Abstract: An embodiment of the present invention provides a method and apparatus for data transmission, wherein the method comprises: establishing a buffer for TCP/IP data packets, and the TCP/IP data packets including TCP payloads and TCP ACKs; adjusting a queue of the buffered TCP/IP data in accordance with header information of the TCP/IP data packets; and transmitting sequentially the buffered TCP/IP data packets being adjusted. According to the embodiments of the present invention, the IP data packets of TCP ACKs transmitted by the receiving side are processed, so that the amount of the TCP ACK responses is significantly reduced and the IP data packets of TCP ACKs are transmitted with priority, thereby the round-trip time delay for data transmitting can be reduced, and the data transmission efficiency can be improved.

Abstract: The present invention provides a power-saving method for a mobile terminal, comprising the steps, after setting the mobile terminal to be in a data service power-saving state, monitoring, by the mobile terminal, a data service in accordance with a monitoring strategy for the data service power-saving state, and triggering a data service power-saving operation when a triggering condition set in the monitoring strategy is met. The present invention further provides a power-saving apparatus arranged within a mobile terminal, comprising a monitoring unit and an executing unit, wherein the monitoring unit is configured to monitor data services of the mobile terminal in accordance with a preset monitoring strategy, and send a power-saving command to the executing unit when a data service power-saving strategy is met. The present invention further provides a mobile terminal comprising the power-saving apparatus.

Abstract: The invention discloses a method for implementing dual-homing, including: setting each one of any two core control equipment as a standby for each other, connecting a network entity belonging to one of the core control equipment with the two core control equipment through a primary link and a standby link respectively; setting the primary link connected with the core control equipment as activated, and setting the standby link connected with the core control equipment inactive; determining whether the core control equipment corresponding to the primary link is out of service, if the core control equipment corresponding to the primary link is out of service, activating the standby link; otherwise, continuously determining whether the core control equipment corresponding to the primary link is out of service. The invention also discloses another method for implementing dual-homing, by which the reliability of the network can be improved.

Abstract: This invention discloses a method of manufacturing a trenched semiconductor power device with split gate filling a trench opened in a semiconductor substrate wherein the split gate is separated by an inter-poly insulation layer disposed between a top and a bottom gate segments. The method further includes a step of forming the inter-poly layer by applying a RTP process after a HDP oxide deposition process to bring an etch rate of the HDP oxide layer close to an etch rate of a thermal oxide.

Abstract: Aspects of the subject matter described herein relate to content sharing for mobile devices. In aspects, images that are created using mobile devices may be automatically uploaded to one or more targets. In addition, images created on the one or more targets may be automatically downloaded to the mobile device based on one or more criteria. A service facilitates transfer of images in both directions and includes a pluggable architecture in which forwarders for new targets may be added.

Abstract: CMOS power oscillator and a method of frequency modulating a CMOS power oscillator. The oscillator comprises a transformer-based feedback CMOS power oscillator circuit formed on a chip-substrate, the oscillator circuit including a transformer coupled to a transistor; means for modulating the capacitance of the transformer to the chip-substrate for frequency modulating an output of the power oscillator.

Abstract: This invention discloses a method of manufacturing a trenched semiconductor power device with split gate filling a trench opened in a semiconductor substrate wherein the split gate is separated by an inter-poly insulation layer disposed between a top and a bottom gate segments. The method further includes a step of forming the inter-poly layer by applying a RTP process after a HDP oxide deposition process to bring an etch rate of the HDP oxide layer close to an etch rate of a thermal oxide.

Abstract: CMOS power oscillator and a method of frequency modulating a CMOS power oscillator. The oscillator comprises a transformer-based feedback CMOS power oscillator circuit formed on a chip-substrate, the oscillator circuit including a transformer coupled to a transistor; means for modulating the capacitance of the transformer to the chip-substrate for frequency modulating an output of the power oscillator.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.

Abstract: A heat dissipation device includes a plurality of first, second and third fins arranged side by side and a fan. The fins define a plurality of parallel channels therein respectively for air flowing therethrough. The fan and the channels of the first fins corporately define an enhanced airflow path which is isolated from the channels of the second and third fins so that the fan entirely impels an airflow generated by the fan to pass through the channels of the first fins. The first fins are located corresponding to a portion of a bottom surface of a base for contacting with a heat-generating electronic component.

Abstract: A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16) in two opposite outmost fins thereof. The fan holder includes two brackets (200) each having a positioning rib (212) engaged in a corresponding slot of the heat sink and resisting the outmost fin to thereby mount the fan holder to the heat sink.

Abstract: This invention discloses method of for manufacturing a trenched semiconductor power device with split gate filling a trench opened in a semiconductor substrate wherein the split gate is separated by an inter-poly insulation layer disposed between a top and a bottom gate segments. The method further includes a step of forming the inter-poly layer by applying a RTP process after a HDP oxide deposition process to bring an etch rate of the HDP oxide layer close to an etch rate of a thermal oxide.

Abstract: A heat dissipation assembly (100) comprises a heat sink (10) having a plurality of fins (120), a fan (20) mounted onto the heat sink (10) for generating an airflow flowing into a plurality of channels (126) between the fins (120) of the heat sink (10) and a ventilating strip (40) encircling an outer periphery of the fins (120) to prevent the airflow generated by the fan (20) from being prematurely dispersed out of the fins (120) via the channels (126). The ventilating strip (40) helps the airflow to more effectively reach a bottom of the heat sink (10), which is used to contact a heat-generating electronic component.

Abstract: A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16) in two opposite outmost fins thereof. The fan holder includes two brackets (200) each having a positioning rib (212) engaged in a corresponding slot of the heat sink and resisting the outmost fin to thereby mount the fan holder to the heat sink.

Abstract: A locking device is for locking a heat sink to an electronic device. The locking device includes a retaining frame and a guiding member positioned on the retaining frame. The guiding member includes a seat having a base sitting on the retaining frame, a sleeve extending upwardly from the seat, and two spaced legs descending from the base of the seat to retain the guiding member to the retaining frame. A fastener is accommodated in the sleeve of the guiding member and is kept vertical to the retaining frame by the guiding member.

Abstract: A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.

Abstract: A heat sink (200) for a portable computer (100) includes a plurality of fins (210) located external to the portable computer, a conducting plate (230) extending into an inner space of the portable computer for absorbing heat in the portable computer, and a heat pipe (220) transferring the heat absorbed by the conducting plate to the fins. Therefore, the heat in the portable computer is removed from the inner space of the portable computer by the heat sink.

Abstract: A heat pipe type heat dissipation device for an electronic component comprises a base plate, a cover plate spaced from the base plate, a plurality of parallel fins extending between the base plate and the cover plate and connecting with them. The base plate, the cover plate and each two adjacent fins collectively define a unitary air passage. The base plate has a protuberant portion, which has a convex surface facing towards the cover plate and has a thickness getting small from the middle to two sides in a direction parallel to the fins. The cover plate also has a protuberant portion similar to the protuberant portion of the base plate. A heat pipe connects the protuberant portions of the cover plate and the base plate.

Abstract: A heat sink assembly includes a heat sink (10), a fan holder (20) mounted on the heat sink and a fan (30) carried by the fan holder. The heat sink defines a slot (148) in a top thereof. The fan holder comprises flap (260) downwardly extending to engage in the slot, and a fastening lug (28) secured to a recessed portion (122) of a top surface of a base (12) of the heat sink. The fastening lug extending from a baffle (24) which fittingly engages with a raised portion (124) of the top surface of the base adjacent to the recessed portion.

Abstract: A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pressing portion, a plurality of outer flexible portions located below the pressing portion and a plurality of inner flexible portions integrally extending inwards from the outer flexible portions, respectively. The pressing portion of the first element presses downwardly the heat sink toward the electronic device. The outer flexible portions of the first element abut upwardly against the printed circuit board. The second element is capable of acting on the inner flexible portions of the first element to motivate the outer flexible portions to release their abutment from the printed circuit board.