Patents by Inventor Yonggang Li

Yonggang Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240221688
    Abstract: A method and device for driving a display panel and a display device. The method for driving a display panel includes: determining a brightness mode of the display panel, where the same display grayscale corresponds to different data voltages in different brightness modes; determining a data voltage characterization value according to the brightness mode, where the data voltage characterization value is used for characterizing a data voltage level in the brightness mode; determining a holding voltage corresponding to the data voltage characterization value according to the data voltage characterization value; and inputting, in a display holding frame of a current display image, the holding voltage to a source electrode of a drive transistor in each sub-pixel of the display panel.
    Type: Application
    Filed: March 20, 2024
    Publication date: July 4, 2024
    Applicants: HEFEI VISIONOX TECHNOLOGY CO., LTD., KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
    Inventors: Chuansheng SONG, Weiwei PAN, Wenxing LI, Yonggang LI, Mingwei GE, Xiujian ZHU
  • Publication number: 20240219653
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic die and at least one optical fiber. Devices and methods are shown that include an optical coupler and one or more correction regions to align a beam between the photonic die and the optical fiber.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Inventors: Yonggang Li, Bai Nie
  • Patent number: 12027466
    Abstract: Conductive routes for an electronic substrate may be fabricated by forming an opening in a material, using existing laser drilling or lithography tools and materials, followed by selectively plating a metal on the sidewalls of the opening. The processes of the present description may result in significantly higher patterning resolution or feature scaling (up to 2× improvement in patterning density/resolution). In addition to improved patterning resolution, the embodiments of the present description may also result in higher aspect ratios of the conductive routes, which can result in improved signaling, reduced latency, and improved yield.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: July 2, 2024
    Assignee: Intel Corporation
    Inventors: Jeremy D. Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad, Haobo Chen, Tarek Ibrahim
  • Publication number: 20240213328
    Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a via opening through the core. In an embodiment, the via opening comprises sidewalls. In an embodiment, a composite layer is provided along the sidewalls, and the composite layer comprises carbon. In an embodiment, the package substrate further comprises a via within the via opening, where the via is electrically conductive.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 27, 2024
    Inventors: Vinith BEJUGAM, Yonggang LI, Srinivas V. PIETAMBARAM, Chandrasekharan NAIR, Whitney BRYKS, Gene CORYELL
  • Publication number: 20240188225
    Abstract: A method for manufacturing a structured substrate is provided, the method including: forming a plurality of openings extending from a first surface of a substrate towards a second surface of the substrate, wherein the first surface is coplanar to the second surface, wherein the substrate comprises glass, and wherein each of the openings comprises a sidewall; forming a first layer at least on the sidewall of the openings; forming a second layer on the first layer, wherein the second layer comprises titanium; and depositing metal on the second layer to at least partially fill the openings.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Vinith BEJUGAM, Rengarajan SHANMUGAM, Srinivas PIETAMBARAM, Mao-Feng TSENG, Yonggang LI
  • Publication number: 20240181572
    Abstract: The present disclosure generally relates to a method. The method may include providing a substrate and forming a seed layer on the substrate. The method may further include forming a first metal layer on selected portions of the seed layer to form exposed portions of the seed layer. The method may also include scanning a laser beam across the substrate to remove the exposed portions of the seed layer to form exposed portions of the substrate.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Tchefor NDUKUM, Deniz TURAN, Yonggang LI
  • Publication number: 20240166951
    Abstract: A continuous solid organic matter pyrolysis polygeneration system and method for using the system is disclosed. The pyrolysis polygeneration system mainly includes a processing system, a drying furnace, a pyrolysis furnace, a cooling furnace, a tail gas treatment system, and a gas treatment system and a protective gas circulation system cooperate with each other to realize the multi-level rational utilization of energy, and are suitable for the continuous and rapid pyrolysis and carbonization of various solid organic matter in the actual production. While realizing the polygeneration of coke, wood vinegar and tar, the maximum utilization of overall heat is realized through process optimization.
    Type: Application
    Filed: January 14, 2021
    Publication date: May 23, 2024
    Inventors: Hongyu SI, Bing WANG, Xiaohui LIANG, Suxiang LIU, Meirong XU, Yonggang LI, Zhaojie CUI, Qiang YAO, Haichao WANG, Laizhi SUN, Shuangxia YANG, Likun HE, Dongliang HUA, Zhijie GU
  • Publication number: 20240112970
    Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. A first build-up layer is on at least the first surface. In some embodiments, the corner region comprises a recess and a dielectric material within the recess. In other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. The second region comprises a second compressive stress. The first compressive stress is greater than the second compressive stress.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Intel Corporation
    Inventors: Hanyu Song, Vinith Bejugam, Yonggang Li, Gang Duan, Aaron Garelick
  • Publication number: 20240096678
    Abstract: The present disclosure is directed to a carrier chuck having a base plate with a top surface, at least one electrode positioned in a first carrier region of the top surface and configured to produce an electrostatic force to retain a panel placed on the carrier chuck during panel processing, and a dielectric layer positioned over the at least one electrode. The at least one electrode extends from the top surface by a height of at least 20 um.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Deniz TURAN, Yosef KORNBLUTH, Yonggang LI
  • Publication number: 20240088052
    Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
  • Patent number: 11923312
    Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 5, 2024
    Assignee: Intel Corporation
    Inventors: Bai Nie, Gang Duan, Srinivas Pietambaram, Jesse Jones, Yosuke Kanaoka, Hongxia Feng, Dingying Xu, Rahul Manepalli, Sameer Paital, Kristof Darmawikarta, Yonggang Li, Meizi Jiao, Chong Zhang, Matthew Tingey, Jung Kyu Han, Haobo Chen
  • Publication number: 20230410751
    Abstract: A driving method and driving device for a display panel, and a display device. The driving method includes: in a first driving stage, controlling a data voltage signal input terminal to transmit a voltage corresponding to a data voltage to a gate of a drive transistor; and in a second driving stage, controlling the data voltage signal input terminal to transmit a hold voltage to a source of the drive transistor to couple the voltage of the gate of the drive transistor through the hold voltage of the source of the drive transistor.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Applicant: HEFEI VISIONOX TECHNOLOGY CO., LTD.
    Inventors: Wangwang HE, Yonggang LI, Weiwei PAN
  • Publication number: 20230361002
    Abstract: The present disclosure is directed to semiconductor dies and methods that provide a glass substrate, a pulsed laser tool to produce a line-shaped modification to the glass substrate for forming a plurality of structures in the glass substrate. The pulse laser tool may be provided with a predetermined pattern for its movement. The predetermined pattern moves the pulsed laser tool in a series of single steps in a first axial direction and in a series of plural lateral steps in a second axial direction that is perpendicular to the first axial direction, in particular, the single step is followed by the plural lateral steps in a repeating sequence. The series of plural lateral steps form an assembly of line-shaped modifications in parallel rows on the glass substrate, and thereafter the plurality of structures may be formed from the parallel rows of line-shaped modifications in the glass substrate.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 9, 2023
    Inventors: Vinith BEJUGAM, Kristof DARMAWIKARTA, Yonggang LI, Samuel GEORGE, Srinivas PIETAMBARAM
  • Patent number: 11806957
    Abstract: The light guide film product processing apparatus provided in the present invention relates to the field of light guide film processing, and includes an unwinding device for transmitting a first light guide film, a dot processing device, a cooling device, a cutting device, a waste collecting device, and a product collecting device that are sequentially installed along the transmission direction of the first light guide film, and a linkage controller; the dot processing device transfers dots on both sides of the first light guide film, the cooling device cools the first light guide film after dot processing, the cutting device cuts the cooled first light guide film, the waste collecting device is configured to wind a second light guide film, and the second light guide film is a remaining material after the first light guide film is cut into a light guide film product; and the included angle formed between the winding and transmission direction of the second light guide film and the transmission direction of th
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 7, 2023
    Assignee: NANJING BREADY ELECTRONICS CO., LTD.
    Inventors: Yong Liu, Yonggang Li
  • Publication number: 20230294204
    Abstract: A method includes forming a solvent on a stage, and placing, on the solvent formed on the stage, a bottom surface of a substrate on which a residue is formed, so that the residue moves away from the bottom surface of the substrate into the solvent. The method further includes removing the substrate from the solvent into which the residue is moved.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventors: Jeremy ECTON, Vinith BEJUGAM, Jefferson KAPLAN, Yonggang LI, Whitney BRYKS, Samuel GEORGE, Jeremy CROSS
  • Patent number: 11728265
    Abstract: Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital, Darko Grujicic, Rengarajan Shanmugam, Melissa Wette, Srinivas Pietambaram
  • Publication number: 20230193694
    Abstract: The disclosure discloses a percussion and cutting composite drilling tool, which relates to the field of drilling equipment and is mainly used to solve the problems of low working efficiency and high wear rate of drill bit existed in breaking rocks only by cutting effect. The main structure comprises a PDC drill bit and a percussion drill bit, which is characterized by a percussion structure directly connected to the percussion drill bit. The disclosure provides a percussion and cutting composite drilling tool, which is suitable for strata under different geological conditions and has higher construction efficiency and lower bit wear.
    Type: Application
    Filed: March 23, 2022
    Publication date: June 22, 2023
    Inventors: Yaodong ZHENG, Wen ZHONG, Heng LI, Defa ZENG, Yajun KONG, Yiyuan ZHANG, Zhouwen HE, Yonggang LI, Hongji ZHOU, Liang ZHANG, Shu LI
  • Publication number: 20230197679
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade, Xavier Francois Brun, Yonggang Li, Suddhasattwa Nad, Bohan Shan, Haobo Chen, Gang Duan
  • Publication number: 20230146165
    Abstract: Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 11, 2023
    Inventors: Srinivas PIETAMBARAM, Kristof DARMAWIKARTA, Gang DUAN, Yonggang LI, Sameer PAITAL
  • Publication number: 20230090133
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 23, 2023
    Inventors: Bai Nie, Pooya Tadayon, Leonel R. Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Hari Mahalingam, Benjamin Duong