Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Abstract: The presently disclosed subject matter provides antibodies that bind KLB and FGFR1, and methods of using the same. In certain embodiments, an antibody of the present disclosure includes a bispecific antibody that binds to an epitope present on FGFR1 and binds to an epitope present on KLB.

Abstract: Aspects of the subject disclosure may include, for example, receiving network requirements for a new telecommunications network to be developed by a network operator, developing a workflow for design and development of the new telecommunications network based on stored knowledge base data about past telecommunications network projects of the network operator, the stored knowledge base data including information about prior milestone processes of the past telecommunications network projects of the network operator, modifying the information about prior milestone processes based on the network requirements for the new telecommunications network, forming a plurality of milestone processes for the new telecommunications network, and performing respective milestone processes of the plurality of milestone processes to design, develop and test the new telecommunications network, including performing a network ready milestone process of final testing of network functions and a certification that the new telecommunica

Abstract: Aspects of the subject disclosure may include, for example, receiving network requirements for a new telecommunications network to be developed by a network operator, developing a workflow for design and development of the new telecommunications network based on stored knowledge base data about past telecommunications network projects of the network operator, the stored knowledge base data including information about prior milestone processes of the past telecommunications network projects of the network operator, modifying the information about prior milestone processes based on the network requirements for the new telecommunications network, forming a plurality of milestone processes for the new telecommunications network, and performing respective milestone processes of the plurality of milestone processes to design, develop and test the new telecommunications network, including performing a network ready milestone process of final testing of network functions and a certification that the new telecommunica

Abstract: Embodiments of the present disclosure herein include a method of removing a contamination material from an optical device. The method may include disposing an optical device in a process chamber, the optical device having optical device structures formed in a substrate, the contamination material is disposed at least on sidewalls of the optical device structures and within trenches between the optical device structures, and exposing the optical device to a plasma generated in the process chamber, the plasma generated from oxygen gas (O2), chlorine gas (Cl2), Argon (Ar), or a combination thereof, the exposing the optical device to the plasma removes the contamination material.

Abstract: The presently disclosed subject matter provides antibodies that bind KLB and FGFR1, and methods of using the same. In certain embodiments, an antibody of the present disclosure includes a bispecific antibody that binds to an epitope present on FGFR1 and binds to an epitope present on KLB.

Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Abstract: Aspects of the subject disclosure may include, for example, receiving network requirements for a new telecommunications network to be developed by a network operator, developing a workflow for design and development of the new telecommunications network based on stored knowledge base data about past telecommunications network projects of the network operator, the stored knowledge base data including information about prior milestone processes of the past telecommunications network projects of the network operator, modifying the information about prior milestone processes based on the network requirements for the new telecommunications network, forming a plurality of milestone processes for the new telecommunications network, and performing respective milestone processes of the plurality of milestone processes to design, develop and test the new telecommunications network, including performing a network ready milestone process of final testing of network functions and a certification that the new telecommunica

Abstract: The presently disclosed subject matter provides antibodies that bind KLB and FGFR1, and methods of using the same. In certain embodiments, an antibody of the present disclosure includes a bispecific antibody that binds to an epitope present on FGFR1 and binds to an epitope present on KLB.

Abstract: A multi-link wheel base includes a main body composed of a plurality of links connected in series and wheels provided on the main body, and the wheels are provided on the link assembly the link assembly includes an intermediate link and an end link, wherein both sides of the intermediate link are provided with a rotational connection position, one side of the end link is provided with a rotational connection position, and the rotational connection positions on the adjacent link assemblies are rotationally connected by means of a connecting device.

Abstract: A multi-link wheel base includes a main body composed of a plurality of links connected in series and wheels provided on the main body, and the wheels are provided on the link assembly the link assembly includes an intermediate link and an end link, wherein both sides of the intermediate link are provided with a rotational connection position, one side of the end link is provided with a rotational connection position, and the rotational connection positions on the adjacent link assemblies are rotationally connected by means of a connecting device.

Abstract: Implementations of the present disclosure generally relate to the fabrication of integrated circuits, and more particularly, to methods for forming a layer. The layer may be a mask used in lithography process to pattern and form a trench. The mask is formed over a substrate having at least two distinct materials by a selective deposition process. The edges of the mask are disposed on an intermediate layer formed on at least one of the two distinct materials. The method includes removing the intermediate layer to form a gap between edges of the mask and the substrate and filling the gap with a different material than the mask or with the same material as the mask. By filling the gap with the same or different material as the mask, electrical paths are improved.

Abstract: Embodiments of the present disclosure provide a sputtering chamber with in-situ ion implantation capability. In one embodiment, the sputtering chamber comprises a target, an RF and a DC power supplies coupled to the target, a support body comprising a flat substrate receiving surface, a bias power source coupled to the support body, a pulse controller coupled to the bias power source, wherein the pulse controller applies a pulse control signal to the bias power source such that the bias power is delivered either in a regular pulsed mode having a pulse duration of about 100-200 microseconds and a pulse repetition frequency of about 1-200 Hz, or a high frequency pulsed mode having a pulse duration of about 100-300 microseconds and a pulse repetition frequency of about 200 Hz to about 20 KHz, and an exhaust assembly having a concentric pumping port formed through a bottom of the processing chamber.

Abstract: The presently disclosed subject matter provides antibodies that bind KLB and FGFR1, and methods of using the same. In certain embodiments, an antibody of the present disclosure includes a bispecific antibody that binds to an epitope present on FGFR1 and binds to an epitope present on KLB.

Abstract: A device includes a capacitive sensor having a hydrogel structure that includes a first surface and a second surface. A first electrode is provided at the first surface of the hydrogel structure, the first electrode including a network of conductive nanoparticles extending into the hydrogel structure. A second electrode is provided at the second surface of the hydrogel structure.

Abstract: Provided herein are anti-RSPO antibodies, in particular anti-RSPO2 antibodies and/or anti-RSPO3 antibodies, and methods of using the same.

Abstract: Implementations of the present disclosure generally relate to the fabrication of integrated circuits, and more particularly, to methods for forming a layer. The layer may be a mask used in lithography process to pattern and form a trench. The mask is formed over a substrate having at least two distinct materials by a selective deposition process. The edges of the mask are disposed on an intermediate layer formed on at least one of the two distinct materials. The method includes removing the intermediate layer to form a gap between edges of the mask and the substrate and filling the gap with a different material than the mask or with the same material as the mask. By filling the gap with the same or different material as the mask, electrical paths are improved.

Abstract: A method of forming an interconnect structure for semiconductor or MEMS structures at a 10 nm Node (16 nm HPCD) down to 5 nm Node (7 nm HPCD), or lower, where the conductive contacts of the interconnect structure are fabricated using solely subtractive techniques applied to conformal layers of conductive materials.

Abstract: Methods and apparatus for simulating arcing that can occur during substrate fabrication is provided. In some embodiments, the method includes: loading a bare silicon substrate that has been pretreated with at least one of polybutylene terephthalate (PBT) or a film into a testing environment, performing a physical vapor deposition (PVD) process on the bare silicon substrate, and determining arcing occurrences on the bare silicon substrate caused during the PVD process.

Abstract: The presently disclosed subject matter provides antibodies that bind KLB and FGFR1, and methods of using the same. In certain embodiments, an antibody of the present disclosure includes a bispecific antibody that binds to an epitope present on FGFR1 and binds to an epitope present on KLB.