Abstract: An image erasing apparatus according to an embodiment includes a sheet supply portion that supplies a sheet and an ejector. A first conveying path conveys the sheet from the sheet supply portion toward the ejector. A reader arranged on the first conveying path reads an image on the sheet. A second conveying path branches from the first conveying path at a downstream of the reader on the first conveying path and merges with the first conveying path at an upstream of the reader on the first conveying path. An erasing unit is arranged on the second conveying path. A conveying path changing portion is arranged at a branching portion. An operating portion receives a setup of the processing to the sheet. A controller changes a conveying path of the sheet in accordance with the setup received by the operating portion before the sheet is supplied from the sheet supply portion.

Abstract: According to one embodiment, a detection device includes a sensor element and a probe molecule. The probe molecule is immobilized at the sensor element. The probe molecule associates with a receptor exposed at a surface of a detection target. The sensor element detects cleavage of the receptor having associated with the probe molecule.

Abstract: According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

Abstract: The semiconductor layer has a first surface, a second surface provided on opposite side from the first surface, and a third surface provided on the opposite side from the first surface with a step difference with respect to the second surface. The semiconductor layer includes a light emitting layer between the first surface and the third surface. The first electrode is in contact with the second surface. The second electrode is provided in a plane of the third surface. The second electrode includes a contact part in contact with the third surface and an end part not in contact with the third surface. The second electrode contains silver. The insulating film is provided between the end part of the second electrode and the third surface. A semiconductor light emitting device having a high light extraction efficiency is provided.

Abstract: According to one embodiment, a sensor includes an ionic liquid, a probe molecule, and a sensor element. The probe molecule selectively associates with a designated substance in the ionic liquid. The sensor element detects an association of the probe molecule with the designated substance.

Abstract: An erasing apparatus of embodiments has a color erasing device, the color erasing device has: a first heating member; a second heating member provided at a position facing the first heating member so as to form a nip portion therebetween through which the sheet is passed; a halogen lamp configured to heat the second heating member from outside thereof; and a reflector provided at a position opposite to the second heating member with the halogen lamp interposed therebetween and having a reflective surface configured to reflect heat received from the halogen lamp toward the second heating member, the reflector forming a guiding section configured to be in sliding contact with the sheet being conveyed so as to guide the sheet to the nip portion, the guiding section being heated by the halogen lamp.

Abstract: An image erasing apparatus according to an embodiment includes a sheet supply portion that supplies a sheet and an ejector. A first conveying path conveys the sheet from the sheet supply portion toward the ejector. A reader arranged on the first conveying path reads an image on the sheet. A second conveying path branches from the first conveying path at a downstream of the reader on the first conveying path and merges with the first conveying path at an upstream of the reader on the first conveying path. An erasing unit is arranged on the second conveying path. A conveying path changing portion is arranged at a branching portion. An operating portion receives a setup of the processing to the sheet. A controller changes a conveying path of the sheet in accordance with the setup received by the operating portion before the sheet is supplied from the sheet supply portion.

Abstract: According to one embodiment, a sensor includes a graphene film and at least two electrodes. The graphene film has an opening. The opening dominantly has either a zigzag edge or an armchair edge. The two electrodes electrically contact the graphene film, for reading a change in electric characteristics of the graphene film due to coaction with an object to be detected.

Abstract: An image erasing apparatus according to an embodiment includes a sheet supply portion that supplies a sheet and an ejector. A first conveying path conveys the sheet from the sheet supply portion toward the ejector. A reader arranged on the first conveying path reads an image on the sheet. A second conveying path branches from the first conveying path at a downstream of the reader on the first conveying path and merges with the first conveying path at an upstream of the reader on the first conveying path. An erasing unit is arranged on the second conveying path. A conveying path changing portion is arranged at a branching portion. An operating portion receives a setup of the processing to the sheet. A controller changes a conveying path of the sheet in accordance with the setup received by the operating portion before the sheet is supplied from the sheet supply portion.

Abstract: An erasing apparatus of embodiments has a color erasing device, the color erasing device has: a first heating member; a second heating member provided at a position facing the first heating member so as to form a nip portion therebetween through which the sheet is passed; a halogen lamp configured to heat the second heating member from outside thereof; and a reflector provided at a position opposite to the second heating member with the halogen lamp interposed therebetween and having a reflective surface configured to reflect heat received from the halogen lamp toward the second heating member, the reflector forming a guiding section configured to be in sliding contact with the sheet being conveyed so as to guide the sheet to the nip portion, the guiding section being heated by the halogen lamp.

Abstract: An erasing apparatus of embodiments has a color erasing device, the color erasing device has: a first heating member; a second heating member provided at a position facing the first heating member so as to form a nip portion therebetween through which the sheet is passed; a halogen lamp configured to heat the second heating member from outside thereof; and a reflector provided at a position opposite to the second heating member with the halogen lamp interposed therebetween and having a reflective surface configured to reflect heat received from the halogen lamp toward the second heating member, the reflector forming a guiding section configured to be in sliding contact with the sheet being conveyed so as to guide the sheet to the nip portion, the guiding section being heated by the halogen lamp.

Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a sealing member configured to cover a lower surface of the semiconductor layer and a side surface of the semiconductor layer to protrude to be higher than an upper surface of the semiconductor layer at a side of the semiconductor layer, a fluorescer layer provided above the semiconductor layer and the sealing member, and an insulating film provided between the sealing member and the semiconductor layer and between the sealing member and the fluorescer layer. A corner of a protruding portion of the sealing member is rounded.

Abstract: According to one embodiment, a semiconductor light-emitting device includes a semiconductor layer including a light emitting layer; and a phosphor layer provided on the semiconductor layer. The phosphor layer includes a plurality of phosphors, ?0.05<A×(AR)+B×(Np)+C<0.05 being satisfied for ?0.149055?(3×0.011797)?constant A??0.149055+(3×0.011797), ?0.000192?(3×0.00002461)?constant B??0.000192+(3×0.00002461), and 0.0818492?(3×0.005708)?constant C?0.0818492+(3×0.005708). AR is a ratio of a thickness of the phosphor layer to a width of the phosphor layer, and Np is a number of the plurality of phosphors.

Abstract: According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

Abstract: According to one embodiment, the n-side electrode has a corner and a plurality of straight portions. The plurality of straight portions extends in different directions. The corner connects the plurality of straight portions. A first insulating film is provided between the semiconductor layer and the corner of the n-side electrode. The corner is not in contact with the semiconductor layer. The straight portions of the n-side electrode are in contact with the semiconductor layer.

Abstract: According to one embodiment, the p-side electrode is provided on the second semiconductor layer. The insulating film is provided on the p-side electrode. The n-side electrode includes a first portion, a second portion, and a third portion. The first portion is provided on a side face of the first semiconductor layer. The second portion is provided in the first n-side region. The third portion overlaps the p-side electrode via the insulating film and connects the first portion and the second portion to each other.

Abstract: According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

Abstract: According to one embodiment, an image erasing apparatus includes a sheet supply section, a discharge tray, a first conveying path, a reader, a second conveying path, an erasing unit and a switching section. A controller controls the first conveying path, the reader, the second conveying path, the erasing unit and the switching section depending on a selected mode. When the selected mode is an erasing mode, the sheet is conveyed on the first conveying path without being read by the reader, conveyed on the second conveying path where the image is erased by the erasing unit, and then conveyed to the discharge tray. When the selected mode is a reading mode, the sheet is conveyed on the first conveying path where the surface of the sheet is read by the reader, and then conveyed to the discharge tray without being conveyed on the second conveying path.

Abstract: According to one embodiment, the p-side electrode is provided on the second semiconductor layer. The insulating film is provided on the p-side electrode. The n-side electrode includes a first portion, a second portion, and a third portion. The first portion is provided on a side face of the first semiconductor layer. The second portion is provided in the first n-side region. The third portion overlaps the p-side electrode via the insulating film and connects the first portion and the second portion to each other.

Abstract: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.