Abstract: A fiber coupler includes first and second optical fiber groups and a fused-elongated region. The first optical fiber group is obtained by parallelly arranging a plurality of optical fibers on a single plane, a coating of each of the optical fibers being removed throughout a predetermined portion at the same position as that of an adjacent optical fiber in a longitudinal direction. The second optical fiber group is obtained by parallelly arranging adjacent optical fibers on a predetermined plane parallel to an arrange plane of the first optical fiber group at the same pitch as that of the first optical fiber group, a coating of each of the optical fibers being removed throughout a predetermined portion at the same position as that of an adjacent optical fiber in a longitudinal direction as the first optical fiber group.

Abstract: A cassette-type molding die comprises a die plate unit having fitting bores and a cassette die unit including movable and stationary cassette plates between which a molding cavity is defined, an ejector cassette plate, and ejector pins disposed between the movable cassette plate and the ejector cassette plate. The cassette die unit can be detachably inserted into the fitting bores of the die plate unit. As a result, the cassette die unit can be easily exchanged with another cassette die unit while the movable and stationary die plates of the die plate unit are very close together. This speeds up the process of changing cassette die units, and also allows for the overall cassette-type molding die to be smaller than conventional units.

Abstract: A semiconductor integrated circuit comprises a three-valued logic circuit connected to receive an output signal of a logic circuit to receive at one input a control clock signal and at the other input an input signal, and a flip-flop circuit composed of a clocked inverter to receive the output signal of the three-valued logic circuit, and another inverter.