Abstract: Methods for preparing a green sheet and a glass ceramic substrate are herein disclosed.

Abstract: A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

Abstract: A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

Abstract: A multilayer ceramic copper circuit board was produced by forming a multilayer structure comprising layers of copper-based paste patterns and layers of glass/ceramic composite. The glass-ceramic consisted of a mixture of 3% to 75% by weight of mullite, 25% to 97% by weight of borosilicate glass having a softening temperature of at least 720.degree. C., and 0% to 72% by weight of quartz glass, based on the total weight of the glass/ceramic composite, and blended with a binder composition containing a thermally depolymerizable resin. The multilayer structure was prefired in an inert atmosphere containing water vapor and having a partial pressure of 0.005 to 0.3 atomsphere, at a temperature at which the thermally depolymerizable resin was eliminated, the multilayer structure was then fired in an inert atmosphere containing no water vapor at a temperature below the melting temperature of copper, to sinter the glass/ceramic composite.

Abstract: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

Abstract: A process for producing a multilayer ceramic circuit board with copper including the steps of:forming green sheets by doctoring a slurry which includes 100 parts by weight of glass ceramic particles, 5 to 20 parts by weight of a thermally depolymerizable resin binder, 2 to 10 parts by weight of a plasticizer, and up to 2 parts by weight of a fatty acid ethylene oxide adduct type, deflorculant. The glass ceramic includes 20 to 70% by weight of alumina, and 30 to 80% by weight of SiO.sub.2 -B.sub.2 O.sub.3 glass. The process further includes the steps of forming via holes through the green sheets, screen-printing a copper paste on the green sheets, and laminating the green sheets, thereby forming a multilayer structure and firing the multilayer structure in a non-oxidizable atmosphere.

Abstract: A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

Abstract: A thermoplastic resin film laminate. A thermoplastic film is made abrasion-resistant by coating or laminating (A) one or both sides of a thermoplastic resin film with (B) a vinyl polymer composed mainly of a cyanurate ring-containing (meth)cyanurate having a structure corresponding to the condensation product of 1 mole of cyanuric acid with 3 moles, on the average, of a hydroxyl group-containing (meth)acrylate represented by the formula C H.sub.2 .dbd.CR--COO--R.sup.10 --OH (wherein R is hydrogen atom or methyl group; and R.sup.10 is an alkylene group having a carbon number of 2 to 4), or a cyanurate ring-containing (meth)acrylate having a structure corresponding to the condensation product of 1 mole of cyanuric acid with 2 moles or more and less than 3 moles, on the average, of the above hydroxyl group-containing (meth)acrylate and not more than 0.5 mole, on the average, of a polyhydric alcohol of the formula R.sup.20 --(--OH).sub.y (wherein R.sup.

Abstract: The invention involves a novel melamine group-containing (meth)acrylate, e.g. hexakis(2-acryloyloxypropyl)melamine, hexakis(2-acryloyloxyethyl)melamine, etc., and its polymer. Said (meth)acrylate has excellent reactivity and storage stability, and said polymer has excellent dimensional stability, durabilities (especially water resistance and moisture resistance) and surface hardness, and is useful as a molded product and a coating layer of a molded resin article. For example, a polyester film coated with said polymer has excellent adhesivity, flexibility and dimensional stability as well as high abrasion resistance, and can be used to a wide variety of uses as an abrasion resistant film.

Abstract: A process for fire-proofing treatment of shaped articles of aromatic polyamides which comprises contacting a shaped article of an aromatic polyamide with an aqueous solution of a phosphorus-containing inorganic compound free from halogen and sulfur, drying it and then post heat-treating it; characterized in that said shaped article is contacted with an aqueous solution of a treating compound selected from the group consisting of halogen- and sulfur-free, phosphorus-containing inorganic acids and their ammonium, amine and urea salts in a concentration of about 2 to about 30% by weight, dried at a temperature of not more than about 150.degree. C., and then post heat-treated at a temperature of about 300.degree. C. to about 450.degree. C.