Abstract: In the present invention, substrates in a plurality of lots are successively processed in a coating and developing treatment system, and line width measurement is performed for some of substrates of the substrate which have been through processing in each lot. The line width measurement of two successive lots is performed such that the last line width measurement in the previous lot of the two successive lots has been completed at the time of completion of processing of a substrate which is first subjected to the line width measurement in the subsequent lot. According to the present invention, the measurement of product substrates can be performed without decreasing the throughput of the product substrates.

Abstract: In the present invention, for measurement of line widths, for example, at 36 locations within a substrate processed in a coating and developing treatment system, the 36 measurement points are divided and, for example, six substrates are used to measure the line widths at all of measurement points. In this event, the line widths at six measurement points are measured in each of the substrate, which exist in substrate regions different for each substrate. Then, the measurement results of the line widths at the measurement points of the substrates are combined, so that the line widths at 36 measurement points are finally detected. According to the present invention, the measurements of product substrates can be performed without decreasing the throughput of processing of the product substrates.

Abstract: A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.

Abstract: A liquid crystal panel device, being able to transfer heat generation within each of cells building up a panel, into an outside thereof, effectively, therefore being suitable for use in a liquid crystal projection, etc.

Abstract: A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

Abstract: An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Abstract: In order to perform high efficient cooling without boiling cooling liquid and to improve maintainability such as replacement of a lamp, the present invention provides a liquid crystal projector including a light source lamp, a liquid crystal panel, a power source, a fan for removing heat generated by the power source and the lamp, a water-cooling jacket provided on an inner surface of an external wall portion opposed to the lamp in the liquid crystal projector, a metal pipe arrangement for radiation which is placed in the external wall portion, and a pump for driving cooling liquid to flow in the water-cooling jacket so that the cooling liquid receiving the heat from the lamp circulates in a circulation path through the water-cooling jacket, the metal pipe arrangement, and the pump to emit the heat to the outside through the metal pipe arrangement.

Abstract: A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

Abstract: A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Abstract: An electronic apparatus includes a case mounting a semiconductor element therein, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the case, and a liquid driver which drives a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein and having at least a predetermined volume of the coolant to delimit a coolant surface within the tank. The tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

Abstract: A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

Abstract: A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

Abstract: An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

Abstract: A cooling device for an electronic apparatus includes a heat generating element attached within a housing, a heat receiving jacket connectable with the heat generating element, a heat exchanger for exchanging heat between the heat receiving jacket and outside of the electronic apparatus and a liquid driver which supplies a cooling liquid to the heat receiving jacket. A part of pipework connected between the heat receiving jacket, the heat exchanger, and the liquid driver is made of a flexible tube of resin, and an ion exchanger is provided in a portion of the pipework. The cooling liquid has a corrosion inhibitor therein.

Abstract: A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.

Abstract: A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.

Abstract: In an electronic apparatus, having a heat diffusion structure having high efficiency, for corresponding to small-sizing and high-performances of an electronic part therein, a liquid sealing portion is provide on a cover on a side of the electronic part, which builds up a water-cooling jacket attached on an upper portion of the electronic part. Further, within an inside of this liquid sealing portion, a heat diffusion plate is provided, extending from the vicinity of the center of the water-cooling jacket in zigzag manner. With this, heat generated from the electronic part can be spread all over the cover, as a whole, on the side of the electronic part, with an aid of the evaporation heat of the liquid. The heat spread can be transmitted into the cooling liquid circulating within a housing thereof, through liquid flow passages of the water-cooling jacket, thereby being radiated into the atmosphere from the portion having a large or wide heat radiation area of the housing.

Abstract: An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

Abstract: A liquid crystal panel device, being able to transfer heat generation within each of cells building up a panel, into an outside thereof, effectively, therefore being suitable for use in a liquid crystal projection, etc.

Abstract: A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump for supplying a cooling liquid; a heat-receiving jacket, being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag, having an ion exchange resin and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag is exchangeable.