Abstract: There is disclosed an electronic apparatus having a water-cooling structure suited for a compact, thin design in which structure is brought about a liquid-circulating flow rate necessary and sufficient for an increased amount of heat occurring in a heat-generating element due to an improved processing performance of the electronic apparatus. In the electronic apparatus, a water-cooling jacket 8 is thermally connected to a heat-generating element 7, a heat-dissipating pipe 9 being thermally connected to a heat-dissipating metal sheet 9 provided at a rear panel of a display case 2, a cooling medium liquid being circulated between the water-cooling jacket 8 and the heat-dissipating pipe 9 by a liquid-moving device 11. The necessary and sufficient circulating flow rate and the necessary discharge pressure are determined by the relation between the upper limit temperature of the heat-generating element 7 and the limit amount of heat dissipation from the surface of the housing.

Abstract: An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.

Abstract: A rubber component that provides a fuel seal is provided which includes a base formed principally of fluorosilicon rubber or hydrin rubber, and a coating layer applied by coating to the base and formed principally of nylon or fluorine-contained resin.

Abstract: A rubber component that provides a fuel seal is provided which includes a base formed principally of fluorosilicon rubber or hydrin rubber, and a coating layer applied by coating to the base and formed principally of nylon or fluorine-contained resin.

Abstract: A liquid cooling system and a personal computer equipped with it, being suitable for a semiconductor device, etc, generating high heat therefrom and suppressing influences following corrosion upon an apparatus, thereby ensuring healthiness of the system as a whole, wherein it comprises: a pump for supplying cooling liquid; a heat receiving jacket being supplied with the cooling liquid, and for receiving heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump, and the heat radiation pipe is made of material having corrosion resistance being higher than that of the heat receiving jacket.

Abstract: A liquid cooling system for cooling a high heat generating body, such as a semiconductor element or the like, used in an electronic apparatus being small and thin in sizes, or a personal computer equipped with such the structure therein, comprising a ump of reciprocal movement type, a heat receiving jacket, a heat radiation pipe, and a connector pipe for connecting those parts with one another, wherein those are disposed to form a closed loop and are filled up with cooling liquid therein, and &Dgr;Vs is equal to or greater than &Dgr;Vp, defining that inner volume change when the pump emits pulsation therefrom is the &Dgr;Vp, that pressure caused accompanying with the volume change is P, and that volume change due to the pressure P in flow passage of the cooling liquid &Dgr;Vp other than portion of the pump.

Abstract: An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

Abstract: A rubber component that provides a fuel seal is provided which includes a base formed principally of fluorosilicon rubber or hydrin rubber, and a coating layer applied by coating to the base and formed principally of nylon or fluorine-contained resin.

Abstract: A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case.

Abstract: A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

Abstract: Duplicate optical fibers connect between a base station controller and a radio base station for each route. The duplicate optical fiber is connected to each of the radio base stations for each route through a star coupler. The radio base stations are arranged in each of areas so that the radio base stations for different routes are arranged adjacent to each other.

Abstract: A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case.

Abstract: An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air.

Abstract: In a portable personal computer in which high-exothermic devices are mounted within a flat case equipped with an input unit, the and in which a surface temperature of the exothermic devices and the input unit is cooled down to or below a predetermined temperature. A first space is created between the back of a keyboard operating section and an electronic circuit board 3, the electronic circuit board 3 is installed so that the face thereof on which the high-exothermic devices are mounted faces away from the back of the keyboard, a second space is created between the electronic circuit board 3 and an electronic circuit board 2, and a fan 4 is installed inside the case so that cooling air flows from the first space to the second space. A flow path for circulating outside air into the case via an air intake hole 8 is constructed on the wall of the input device operating section.

Abstract: Duplicate optical fibers connect between a base station controller and a radio base station for each route. The duplicate optical fiber is connected to each of the radio base stations for each route through a star coupler. The radio base stations are arranged in each of areas so that the radio base stations for different routes are arranged adjacent to each other.

Abstract: Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like.

Abstract: A method and device for checking a joint of an electronic component is arranged to apply heat energy to a joint containing a heat conductive material and receive the infrared ray radiated from said joint with an infrared camera. By processing the image information output from the infrared camera, the method and device can offer an area of a defect, an area ratio of a defect, pixel coordinates, a temperature distribution pattern, a distance between central axes of a particular portion of the joint, or a gradient angle. The obtained value is compared with a predetermined value for determining the kind of a defect and whether or not the joint is defective.