Abstract: A bus bar structure includes a bus bar disposed to extend along an outer surface of a housing of an electrical device; and a non-conductive lower cover provided to extend along the bus bar to cover a first surface of the bus bar, the first surface facing the outer surface. The lower cover includes a first hole portion that allows insertion of a fixing member configured to fix the lower cover at a first position on the outer surface, the first hole portion having a major axis extending along a first direction of the housing. The bus bar includes a second hole portion that allows insertion of a connection member configured to electrically connect the bus bar to a terminal at a second position on the outer surface, the second hole portion having a major axis extending along a second direction that intersects the first direction.

Abstract: A reactor unit is equipped with a reactor and a cooler. A coolant flows through an interior of the cooler. The cooler cools the reactor through radiation of heat to the coolant. The reactor is mounted on an upper surface of an upper plate of the cooler. A lower surface of the reactor faces the upper plate of the cooler. An upper surface of the reactor is covered with a metal plate. The metal plate is thermally in contact with the upper surface of the upper plate of the cooler.

Abstract: In a continuous shaping machine for bean curds which is equipped with a pair of endless filter cloth belts that are an upper filter cloth belt and a lower filter cloth belt to circulate outside and a pair of endless conveyors that are an upper conveyor and a lower conveyor to circulate inside, and which compression-shapes curdled soymilk by conveying the curdled soymilk while sandwiching the curdled soymilk between the upper filter cloth belt and conveyor and the lower filter cloth belt and conveyor, the continuous shaping machine includes: heating units which perform heating sterilization in prescribed ranges of a return process that corresponds to regions, from a termination portion of a conveyance passage where the curdled soymilk is sandwiched to a start position of the conveyance passage, of circulation routes of the filter cloth belts.

Abstract: In a continuous shaping machine for bean curds which is equipped with a pair of endless filter cloth belts that are an upper filter cloth belt and a lower filter cloth belt to circulate outside and a pair of endless conveyors that are an upper conveyor and a lower conveyor to circulate inside, and which compression-shapes curdled soymilk by conveying the curdled soymilk while sandwiching the curdled soymilk between the upper filter cloth belt and conveyor and the lower filter cloth belt and conveyor, the continuous shaping machine includes: heating units which perform heating sterilization in prescribed ranges of a return process that corresponds to regions, from a termination portion of a conveyance passage where the curdled soymilk is sandwiched to a start position of the conveyance passage, of circulation routes of the filter cloth belts.

Abstract: An electrical apparatus configured to be mounted in a vehicle includes a case that accommodates an electrical component; a cooler accommodated in the case and configured to cool the electrical component with use of a liquid refrigerant; and a refrigerant pipe that extends through a wall of the case and is connected to the cooler. A notch is provided on an outer surface of the refrigerant pipe such that the notch is located outside the case.

Abstract: A compound represented by the following formula (1): wherein R1, R2 and R3 each independently represent fluorine, an alkyl group having 1 to 6 carbon atoms or a fluoroalkyl group having 1 to 6 carbon atoms; and M+ represents an alkali metal ion.

Abstract: In a continuous shaping machine for bean curds which is equipped with a pair of endless filter cloth belts that are an upper filter cloth belt and a lower filter cloth belt to circulate outside and a pair of endless conveyors that are an upper conveyor and a lower conveyor to circulate inside, and which compression-shapes curdled soymilk by conveying the curdled soymilk while sandwiching the curdled soymilk between the upper filter cloth belt and conveyor and the lower filter cloth belt and conveyor, the continuous shaping machine includes: heating units which perform heating sterilization in prescribed ranges of a return process that corresponds to regions, from a termination portion of a conveyance passage where the curdled soymilk is sandwiched to a start position of the conveyance passage, of circulation routes of the filter cloth belts.

Abstract: A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

Abstract: A contactor coupled to an electrode of a semiconductor package mounted on a mounting surface of a wiring board, the contactor includes: a cable including a core line; a connector attached to a front end of the cable, and to be inserted into a through hole that penetrates the wiring board in a thickness direction thereof; and a signal land formed on a front end surface of the connector, and electrically coupled with the core line.

Abstract: A semiconductor device includes: a processor having a heat sink mounted thereon; and an optical module having a heat transfer interposer, wherein the heat sink and the optical module are coupled to each other via the heat transfer interposer. And a semiconductor device includes: a semiconductor chip mounted on a substrate; a lead that covers the semiconductor chip; a heat sink installed on the lead; and an optical module coupled to the heat sink via a heat transfer interposer.

Abstract: A board includes: a signal layer; a first layer and a second layer disposed so as to interpose the signal layer; a connector shell portion embedded on a first surface side of the board; a first solder joint portion that brings the connector shell portion and the first layer to be electrically conductive with each other; a contact portion disposed in a state where a center axis line of the contact portion coincides with a center axis line of the connector shell portion and the contact portion is electrically conductive with the signal layer; and an insulating portion disposed around the contact portion.

Abstract: A semiconductor device includes: a processor having a heat sink mounted thereon; and an optical module having a heat transfer interposer, wherein the heat sink and the optical module are coupled to each other via the heat transfer interposer. And a semiconductor device includes: a semiconductor chip mounted on a substrate; a lead that covers the semiconductor chip; a heat sink installed on the lead; and an optical module coupled to the heat sink via a heat transfer interposer.

Abstract: An optical module connector includes a connector configured to be coupled to a package substrate, which is coupled to first solder coupled to a printed board, and to second solder coupled to the printed board, the connector being coupled to the second solder; and an optical-module substrate configured to be detachably coupled to the connector, wherein the connector configured to include a first surface to which the optical-module substrate is coupled, a second surface coupled to the package substrate, and a third surface coupled to the second solder, and wherein the first surface to which the optical-module substrate is coupled includes a fourth surface opposite the second surface and a fifth surface opposite the third surface coupled to the second solder, and wherein a first height from the second surface to the first surface is less than a second height from the third surface to the first surface.

Abstract: A contactor coupled to an electrode of a semiconductor package mounted on a mounting surface of a wiring board, the contactor includes: a cable including a core line; a connector attached to a front end of the cable, and to be inserted into a through hole that penetrates the wiring board in a thickness direction thereof; and a signal land formed on a front end surface of the connector, and electrically coupled with the core line.

Abstract: An interposer includes a first contact terminal pressed against a first fixed terminal for signal transmission; a pair of second contact terminals pressed against second fixed terminals for any one of power supply and grounding, the pair of second contact terminals being disposed with a gap in a pressing direction in which the pair of second contact terminals are pressed against the second fixed terminals, each of the pair of second contact terminals having a larger sectional area than the first contact terminal in a crossing direction that crosses the pressing direction; and a plurality of spring members arranged between the pair of second contact terminals, the plurality of spring members being electro-conductive, having a lower elasticity than the first contact terminal, and pressing the pair of second contact terminals against the second fixed terminals.

Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

Abstract: An interposer includes a first contact terminal pressed against a first fixed terminal for signal transmission; a pair of second contact terminals pressed against second fixed terminals for any one of power supply and grounding, the pair of second contact terminals being disposed with a gap in a pressing direction in which the pair of second contact terminals are pressed against the second fixed terminals, each of the pair of second contact terminals having a larger sectional area than the first contact terminal in a crossing direction that crosses the pressing direction; and a plurality of spring members arranged between the pair of second contact terminals, the plurality of spring members being electro-conductive, having a lower elasticity than the first contact terminal, and pressing the pair of second contact terminals against the second fixed terminals.

Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.

Abstract: A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

Abstract: An optical connector for optically connecting a first optical waveguide and second optical waveguide, includes a first connector module including a first fixing portion attached to a first board in such a manner that a fixed position is adjustable, a first connecting portion, a first ferrule to which the first optical waveguide is connected, and a guide pin attached to the first ferrule and provided with a tapered portion at a front end; and a second connector module including a second fixing portion fixed to a second board, a second connecting portion connectable to the first connecting portion of the first connector module, a second ferrule to which the second optical waveguide is connected and provided with a fitting hole that fits the guide pin, and a holding unit that movably holds the second ferrule.