Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract: A connection member to be inserted into a through-hole of a socket module that is electrically connected between an electronic component and a substrate, the connection member includes: a first end portion that is connected to the electronic component; a second end portion that is connected to the substrate; a plurality of upper flexure portions that correspond to projections of a waveform arranged near the electronic component; and a plurality of lower flexure portions that correspond to projections of the waveform arranged near the substrate; wherein the connection member is a single conductor member with elasticity and is formed in the shape of the waveform.

Abstract: An optical connector for optically connecting a first optical waveguide and second optical waveguide, includes a first connector module including a first fixing portion attached to a first board in such a manner that a fixed position is adjustable, a first connecting portion, a first ferrule to which the first optical waveguide is connected, and a guide pin attached to the first ferrule and provided with a tapered portion at a front end; and a second connector module including a second fixing portion fixed to a second board, a second connecting portion connectable to the first connecting portion of the first connector module, a second ferrule to which the second optical waveguide is connected and provided with a fitting hole that fits the guide pin, and a holding unit that movably holds the second ferrule.

Abstract: A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.

Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A contact device that electrically connects a first substrate and a second substrate. The contact device includes: a contact that has electrical conductivity and elasticity, the contact including a first terminal that is contactable with a first pad provided on the first substrate and a second terminal that is contactable with a second pad provided on the second substrate, the first terminal and the second terminal being biased in a direction spreading a distance therebetween; and a sheet that has flexibility and heat dissipation, and holds the contact so that the first terminal is arranged opposite to one surface of the sheet and the second terminal is arranged opposite to another surface of the sheet.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract: A method for manufacturing an optical waveguide in which multiple cores are embedded in a parallel-arranged fashion within a single cladding, the cores having a refractive index of light different from that of the cladding, the method includes forming the multiple cores in a state where the adjacent cores are connected by a rib, forming the cladding around the rib and the multiple cores by curing a cladding material there around, and a cutting to the rib.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Abstract: A printed circuit board unit includes a first board and a second board. First electrically-conductive terminals are fixed and exposed on the front surface of the first board in a matrix. Second electrically-conductive terminals are arranged in a matrix and supported on the front surface of the second board. The second electrically-conductive terminals have flexibility. Each of the second electrically-conductive terminals is disengageably brought in contact with the corresponding first electrically-conductive terminal. A static pressure member is received on the back surface of the first board within an area corresponding to the specific area to generate a static pressure. An urging plate is overlaid on the static pressure member so that the static pressure member is interposed between the urging plate and the first board. The urging plate exhibits an urging force applied to the first board toward the second board.

Abstract: A printed wiring board includes a main body, a plurality of glass fiber yarns disposed in parallel with each other with a predetermined width, a pair of first wirings disposed in parallel with the glass fiber yarns, a pair of second wirings disposed in parallel with the glass fiber yarns, and a pair of connection wirings for connecting the first and the second wiring while being orthogonal to the glass fiber yarns, wherein the glass fiber yarns are separated at the same space as the width of the glass fiber yarns, and the center line of the first wiring and the second wiring are separated at a space of (space between the center lines of the adjacent glass fiber yarns×½+space between the center lines of the adjacent glass fiber yarns×N (N is an integer of at least 0 (zero)).

Abstract: A printed wiring board includes a body made of resin. Woven glass fiber yarns are impregnated in the resin of the body. An electrically-conductive wiring pattern is formed on the surface of the body. The wiring pattern extends in parallel with the glass fiber yarns. The width of the wiring pattern is set equal to or larger than the interval between the centerlines of the adjacent ones of the glass fiber yarns extending in parallel. The wiring pattern is reliably located in a region containing both the glass fiber and the resin. The proportion of the glass fiber to the resin is equalized on the wiring patterns. This results in a suppression of the influence resulting from a difference in the permittivity between the glass fiber and the resin on the wiring pattern. A variation of characteristic impedance is suppressed with such a simplified structure.

Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.

Abstract: A printed circuit board unit includes a first board and a second board. First electrically-conductive terminals are fixed and exposed on the front surface of the first board within a specific area of the first board in a matrix. Second electrically-conductive terminals are arranged in a matrix and supported on the front surface of the second board. The second electrically-conductive terminals have flexibility. Each of the second electrically-conductive terminals is disengageably brought in contact with the corresponding first electrically-conductive terminal. A static pressure member is received on the back surface of the first board within an area corresponding to the specific area to generate a static pressure. An urging plate is overlaid on the static pressure member so that the static pressure member is interposed between the urging plate and the first board. The urging plate exhibits an urging force applied to the first board toward the second board.

Abstract: An image recording apparatus for effecting the recording of an image on a recording medium has conveying member for conveying a transfer recording medium having a transfer recording layer whose transfer characteristic is varied by first energy and second energy differing from the first energy being imparted thereto, a recording section having first energy imparting member for imparting the first energy to the transfer recording medium and second energy imparting member for imparting the second energy to the transfer recording medium, the first and second energy imparting member being provided along the conveyance path of the transfer recording medium conveyed by the conveying member, a transfer section for transferring an image formed on the transfer recording medium in the recording section to the recording medium, and heater provided upstream of the recording section with respect to the direction of conveyance of the transfer recording medium for imparting heat energy to the transfer recording medium.