Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.

Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

Abstract: A plurality of boards are arranged perpendicular to a base plate and parallel to each other. An optical transmission circuit connects the boards according to an optical transmission method. Each of the boards has a photoelectric conversion circuit that converts optical signals into electric signals and vice versa. The optical transmission circuit includes a plurality of optical transmission paths parallel to each other and extending in a direction of arrangement of the boards on the base plate, and an optical connection part mounted on said base plate for each of the boards and connected to the optical transmission paths. The photoelectric conversion circuit is connected to an optical connection part so that data transmission between the boards is performed through the optical transmission circuit.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.

Abstract: A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.

Abstract: A plurality of boards are arranged perpendicular to a base plate and parallel to each other. An optical transmission circuit connects the boards according to an optical transmission method. Each of the boards has a photoelectric conversion circuit that converts optical signals into electric signals and vice versa. The optical transmission circuit includes a plurality of optical transmission paths parallel to each other and extending in a direction of arrangement of the boards on the base plate, and an optical connection part mounted on said base plate for each of the boards and connected to the optical transmission paths. The photoelectric conversion circuit is connected to an optical connection part so that data transmission between the boards is performed through the optical transmission circuit.

Abstract: A bonded board is formed by bonding at least two boards via an insulation member. A through hole is formed in the bonded board to mount a firs electronic component on one face of the bonded board, and a second electronic component on the other face of the bonded board. The first electronic component and the second electronic component are electrically connected via the through hole.

Abstract: A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: A printed circuit board unit comprising a printed circuit board and a correction member. The correction member contacts the printed circuit board at a pair of contact points and support points arranged between the contact points. The support points are defined at a position withdrawing from a plane including the contact points. Screws serve to urge the printed circuit board against the correction member. The correction member is adapted to generate an intentional warp or bend. Such warp serves to correct or modify the curvature of the front surface of the printed circuit board. The front surface of the printed circuit board can be maintained flat.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: A printed-circuit board reinforcing member can reduce a space to be provided between an electronic part mounted on a printed-circuit board and the printed-circuit board reinforcing member fixed to the printed-circuit board. The printed-circuit board reinforcing member has a square frame shape having four side members. The electronic part having a square shape is mounted on a part of the surface of the printed-circuit board so that the part of the surface of the printed-circuit board is surrounded by the printed-circuit board reinforcing member. An inlet port is formed on a top surface of each of the side members. An outlet port is formed on an inner surface of each of the side members. A fluid passage is provided in each of the side members so as to connect the inlet port to the outlet port. Heated fluid introduced into the inlet port is discharged from the outlet port so as to heat connecting parts between the electronic part and the printed-circuit board.

Abstract: A daughter-board cover of a system board device which daughter-board cover covers daughter boards can be removed by a simple operation in a short time. The system board device is adapted to be subjected to forced-air cooling. At least one electronic part generating heat is mounted on a motherboard. A plurality of daughter boards are removably mounted on the motherboard. The daughter boards are mounted so as to be perpendicular to the motherboard. A ventilation cover is attached to the motherboard so as to form an air passage therebetween so that the electronic part and the daughter boards are accommodated in the air passage. The ventilation cover includes the daughter-board cover covering the daughter boards. The daughter-board cover is displaceable so that each of the daughter boards are accessible.

Abstract: The present invention writes intrinsic information such as the current time, etc. to both a memory and a storage medium when an exchangeable storage medium inserted in a drive device is mounted to a system. If the storage medium is removed from the drive device when the storage medium is being I/O accessed, then the execution of the present and the succeeding I/O requests is suspended. Then, if a storage medium is inserted in the drive device, then it is checked whether or not the intrinsic information stored in the memory has been written to the storage medium. Only when the information has been written to the storage medium, the suspended request for the storage medium is resumed. Accordingly, even if a storage medium has been erroneously removed from the drive device, all I/O requests are surely executed without being lost if the erroneously removed medium is inserted again. Furthermore, the data in a replacing storage medium won't be erroneously lost, either.

Abstract: A storage section stores therein one or more files each composed of a plurality of data blocks each having a constant length. A plurality of buffers are provided corresponding to the plurality of blocks. A batch block demand section generates a batch block input demand for batch inputting the plurality of blocks of the storage section. A batch transfer processing section performs an input process of the plurality of blocks between the batch block demand section and the plurality of blocks, and at the same time performs the input process of the plurality of blocks between the plurality of buffer and the storage section.