Abstract: A semiconductor device with an antenna includes a heat sink having first and second surfaces, a semiconductor chip provided on the second surface and having a circuit surface, a wiring board having a laminate of alternately disposed insulating layers and interconnect layers, and covering side surfaces of the heat sink and the semiconductor chip and the circuit surface, and exposing the first surface, and an antenna provided on the wiring board. The wiring board includes a board connecting part provided on an opposite side from the antenna, a first interconnect electrically connecting the board connecting part and a first terminal provided on the circuit surface, and a second interconnect electrically connecting the antenna and a second terminal provided on the circuit surface.

Abstract: A gas filling system includes a receiver that receives a temperature in a high pressure container measured by a temperature sensor by communication, and a flow rate control device that controls a flow rate of gas for filling, a pressure sensor that measures a pressure of gas for filling, and a controller. The controller controls the flow rate control device such that the high pressure container is filled with the gas at a preset first pressure rise rate, until a filling rate of the high pressure container reaches a preset first target filling rate, and the high pressure container is filled with the gas at a preset second pressure rise rate lower than the first pressure rise rate, until the filling rate of the high pressure container reaches, from the first target filling rate, a preset second target filling rate higher than the first target filling rate.

Abstract: A high-frequency circuit board includes: a first insulating layer having a first dielectric constant; a first metal layer provided to stack over the first insulating layer; a second insulating layer provided to stack over the first metal layer, and having a second dielectric constant lower than the first dielectric constant; a second metal layer provided to stack over the second insulating layer, on which a compound semiconductor device is mounted; and first vias penetrating the second insulating layer and connecting the first metal layer with the second metal layer.

Abstract: A modularized externally-driven joint structure that can be used for general purposes. In one aspect, an externally-driven joint structure includes: a shaft member that extends in an axial direction; and a plurality of rotatable members that are arranged along the axial direction, and are coupled with each other by the shaft member in an axially rotatable manner. Each of the rotatable members includes a pair of face portions that face each other in the axial direction, a side wall portion that is arranged along the outer circumferential edges of the pair of face portions, and at least one coupling portion that is arranged at the face portions or the side wall portion, and is coupled with a link member constituting a link of a robot.

Abstract: A semiconductor apparatus includes a substrate, a plurality of heat generating elements mounted on the substrate, a heat dissipation member fixed to the substrate and disposed such that the heat generating elements are interposed between the heat dissipation member and the substrate, at least one first heat conduction member provided on a first surface of the heat dissipation member, the first surface facing the heat generating elements, and a plurality of second heat conduction members each provided on a second surface of a corresponding one of the heat generating elements, the second surface facing the heat dissipation member, wherein the at least one first heat conduction member and the second heat conduction members are in contact with each other at an interface between opposing surfaces thereof.

Abstract: A multicopter system according to one aspect of the present invention includes a multicopter configured to fly in a state of holding a package and a mooring device that is installed at a target position of a flight of the multicopter and includes a linear member that extends in a predetermined direction from the target position, the multicopter including a reception portion that has the shape of a recess including an opening open toward one direction and is configured to receive the linear member via the opening.

Abstract: [Object] To provide a compact, high-output actuator device allowing force control. [Solution] An actuator device 1000 includes an electromagnetic coil member 110 provided over a prescribed width on an outer circumference of a cylinder 100, and a movable element 200 slidable as a piston in the cylinder 100. The movable element 200 has a magnetic member 202, and is moved relatively by excitation of the electromagnetic coil member 110. Fluid is supplied to first and second chambers 106a and 106b such that when the movable element 200 is to be moved relatively, the movable element 200 is driven in the same direction.

Abstract: A high-pressure tank includes: a liner including a body portion having a tubular shape and side end portions each having a dome shape, the side end portions being provided on opposite sides of the body portion; and a reinforcement layer made of fiber reinforced resin covering an outer surface of the liner. The reinforcement layer includes a tubular member covering the body portion and dome members joined to opposite sides of the tubular member so as to cover the side end portions. The liner includes a first resin layer defining a storage space for storing gas and a second resin layer provided between the first resin layer and at least the tubular member. An elastic modulus of a second resin constituting the second resin layer is lower than an elastic modulus of a first resin constituting the first resin layer.

Abstract: A package with built-in electronic components that is to be soldered to an electronic circuit board includes: an insulating layer; an electronic component provided on one surface of the insulating layer; and a pad which is electrically connected to the electronic component and in which a plurality of openings that extend from a first surface of the pad in contact with a solder bump to the insulating layer are formed, wherein an area of the plurality of openings at the first surface is larger than an area of the plurality of openings at a second surface of the pad, which is an opposite surface to the first surface and is in contact with the insulating layer.

Abstract: A semiconductor device includes: a semiconductor substrate; an electrode pad disposed over a first face of the semiconductor substrate; a redistribution layer electrically connected to the electrode pad; a through hole disposed in the semiconductor substrate so as to extend from a second face opposite to the first face of the semiconductor substrate to the electrode pad; an electrically conductive film covering an inner wall of the through hole, and electrically connected to the electrode pad; an electrically conductive adhesive disposed on a side of the second face of the semiconductor substrate, and electrically connected to the electrode pad via the electrically conductive film; a heat radiating member bonded to the second face of the semiconductor substrate with the electrically conductive adhesive; and a filling member with which the through hole is filled, the filling member being lower in coefficient of thermal expansion than the electrically conductive adhesive.

Abstract: Provided is a modularized externally-driven joint structure that can be used for general purposes. An aspect of the present invention is directed to an externally-driven joint structure (1) including: a shaft member (13) that extends in an axial direction; and a plurality of rotatable members (11 and 12) that are arranged along the axial direction, and are coupled with each other by the shaft member in an axially rotatable manner. Each of the rotatable members includes a pair of face portions (122) that face each other in the axial direction, a side wall portion (113 or 123) that is arranged along the outer circumferential edges of the pair of face portions, and at least one coupling portion (21) that is arranged at the face portions or the side wall portion, and is coupled with a link member (31) constituting a link of a robot.

Abstract: A modularized externally-driven joint structure can be used for general purposes. An externally-driven joint structure: includes a shaft member that extends in an axial direction; and a number of rotatable members that are arranged along the axial direction, and are coupled with each other by the shaft member in an axially rotatable manner. Each of the rotatable members includes a pair of face portions that face each other in the axial direction, a side wall portion that is arranged along the outer circumferential edges of the pair of face portions, and at least one coupling portion that is arranged at the face portions or the side wall portion, and is coupled with a link member constituting a link of a robot.

Abstract: [Object] To provide a compact, high-output actuator device allowing force control. [Solution] An actuator device 1000 includes an electromagnetic coil member 110 provided over a prescribed width on an outer circumference of a cylinder 100, and a movable element 200 slidable as a piston in the cylinder 100. The movable element 200 has a magnetic member 202, and is moved relatively by excitation of the electromagnetic coil member 110. Fluid is supplied to first and second chambers 106a and 106b such that when the movable element 200 is to be moved relatively, the movable element 200 is driven in the same direction.

Abstract: [Object] To provide a compact, high-output actuator device allowing force control. [Solution] An actuator device 1000 includes an electromagnetic coil member 110 provided over a prescribed width on an outer circumference of a cylinder 100, and a movable element 200 slidable as a piston in the cylinder 100. The movable element 200 has a magnetic member 202, and is moved relatively by excitation of the electromagnetic coil member 110. Fluid is supplied to first and second chambers 106a and 106b such that when the movable element 200 is to be moved relatively, the movable element 200 is driven in the same direction.

Abstract: A multicopter system according to one aspect of the present invention includes a multicopter configured to fly in a state of holding a package and a mooring device that is installed at a target position of a flight of the multicopter and includes a linear member that extends in a predetermined direction from the target position, the multicopter including a reception portion that has the shape of a recess including an opening open toward one direction and is configured to receive the linear member via the opening.

Abstract: A semiconductor device includes: a semiconductor substrate; an electrode pad disposed over a first face of the semiconductor substrate; a redistribution layer electrically connected to the electrode pad; a through hole disposed in the semiconductor substrate so as to extend from a second face opposite to the first face of the semiconductor substrate to the electrode pad; an electrically conductive film covering an inner wall of the through hole, and electrically connected to the electrode pad; an electrically conductive adhesive disposed on a side of the second face of the semiconductor substrate, and electrically connected to the electrode pad via the electrically conductive film; a heat radiating member bonded to the second face of the semiconductor substrate with the electrically conductive adhesive; and a filling member with which the through hole is filled, the filling member being lower in coefficient of thermal expansion than the electrically conductive adhesive.

Abstract: A liner of a high-pressure tank is made of a material having a shrinkage amount that is calculated by an equation below being 0 or less, the equation being shrinkage amount=?1.533538e?03*x1?3.82355406*x2?7.81992308*x3+1.89342646e?01*x4?7.84558163e?03*x5+1.15956871e?03*x1x2+6.29564353e?04*x1x3?9.34550213e?06*x1x4?6.59253799e?04*x1x5?1.52692282e+00*x2{circumflex over (?)}2+1.67290964e+00*x2x3?1.85202252e?02*x2x4?1.79615713e+00*x2x5+2.37163664e+00*x3{circumflex over (?)}2?1.17467786e?02*x3x4?9.04442817e?01*x3x5?1.86321584e?03*x4{circumflex over (?)}2+6.62631756e?03*x4x5+1.27572698e*x5{circumflex over (?)}2.

Abstract: A high-pressure tank includes: a liner including a body portion having a tubular shape and side end portions each having a dome shape, the side end portions being provided on opposite sides of the body portion; and a reinforcement layer made of fiber reinforced resin covering an outer surface of the liner. The reinforcement layer includes a tubular member covering the body portion and dome members joined to opposite sides of the tubular member so as to cover the side end portions. The liner includes a first resin layer defining a storage space for storing gas and a second resin layer provided between the first resin layer and at least the tubular member. An elastic modulus of a second resin constituting the second resin layer is lower than an elastic modulus of a first resin constituting the first resin layer.

Abstract: An electronic module includes: a plurality of heat generating members provided over a first surface of a board; a frame joined to the first surface of the board and provided between the plurality of heat generating members that are arranged; and a lid configured to cover the first surface of the board and thermally coupled to each of the plurality of heat generating members, the frame being a grid-shaped frame or a mesh-shaped frame.

Abstract: A semiconductor apparatus includes: a substrate; a plurality of semiconductor devices mounted on a first surface of the substrate; a heat spreader coupled to a second side opposite to a first side, which is coupled to the substrate, of the plurality of semiconductor devices; an underfill provided in a gap between the substrate and the plurality of semiconductor devices; and a heat conductive resin provided between the heat spreader and the underfill.