Patents by Inventor Yoshihiro Tsutsumi

Yoshihiro Tsutsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190355638
    Abstract: Provided are a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance; and a semiconductor device encapsulated by the cured product of such resin composition. The heat-curable maleimide resin composition for semiconductor encapsulation contains: (A) a maleimide compound being solid at 25° C., and having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two maleimide groups; (B) an inorganic filler; and C) a curing accelerator.
    Type: Application
    Filed: May 9, 2019
    Publication date: November 21, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Naoyuki Kushihara, Hiroki Oishi, Yoshihira Hamamoto, Yuki Kudo
  • Patent number: 10483104
    Abstract: A method for producing a stacked electrode of an embodiment includes preparing a multi-layered graphene film, applying a dispersion liquid of metal nanowires onto the multi-layered graphene film, and removing a solvent from the dispersion liquid to prepare a metal wiring on the multi-layered graphene film.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: November 19, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsuyuki Naito, Eishi Tsutsumi, Norihiro Yoshinaga, Yoshihiro Akasaka
  • Publication number: 20190338094
    Abstract: The present invention is a quartz glass fiber-containing prepreg, including: (A) at least one quartz glass fiber selected from the group consisting of a quartz cloth, a quartz chopped strand, a quartz nonwoven fabric, and a quartz wool; as well as a resin composition including (B) a maleimide compound that is a solid at 25° C., containing at least one dimer acid skeleton, at least one linear alkylene group having 6 or more carbon atoms, and at least two maleimide groups in the molecule; and (C) a curing accelerator, wherein the total content of uranium and thorium is 0 to 0.1 ppm. This provides a quartz glass fiber-containing prepreg to give a quartz glass fiber-containing substrate that is used as a PCB to prevent malfunction of a semiconductor device caused by the PCB to decrease transmission loss.
    Type: Application
    Filed: April 3, 2019
    Publication date: November 7, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihira HAMAMOTO, Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Yuki KUDO
  • Patent number: 10442368
    Abstract: A recessed portion positioned on a vehicle rear side with respect to a lens of a camera and recessed in an inner side direction from an outer surface of a mirror housing is provided on the mirror housing. A flow rectifying surface, which forms a flow of traveling wind toward the recessed portion, is provided on the mirror housing.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: October 15, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Koji Okabe, Noriyuki Tsutsumi, Takaaki Nagai, Yuji Horikawa, Yoshihiro Maeno
  • Patent number: 10435783
    Abstract: A target assembly is provided in which an abnormal discharging between a projected portion of a backing plate and a side surface of the target is prevented and also in which a bonding material to bond the target and the backing plate can be surely prevented from seeping to the outside and also which is easy in reusing the backing plate. The target assembly according to this invention having: a target made of an insulating material; and a backing plate bonded to one surface of the target via a bonding material, the backing plate having a projected portion which is projected outward beyond an outer peripheral edge of the target, further has an annular insulating plate. The annular insulating plate: encloses a circumference of the target while maintaining a predetermined clearance to a side surface of the target; and covers that surface of the projected portion.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: October 8, 2019
    Assignee: ULVAC, INC.
    Inventors: Shinya Nakamura, Yoshihiro Ikeda, Yuusuke Miyaguchi, Kazuyoshi Hashimoto, Kengo Tsutsumi, Yoshinori Fujii
  • Publication number: 20190271465
    Abstract: Provided is an auxiliary burner for an electric furnace capable of increasing and homogenizing the heating effect of iron scrap by suitably and efficiently burning solid fuel along with gas fuel. This presently disclosed auxiliary burner 100 for an electric furnace comprises a solid fuel injection tube 1, a gas fuel injection tube 2, and a combustion-supporting gas injection tube 3 in the stated order from the center side, all arranged coaxially, and is characterized in that: a combustion-supporting gas flow path 30 of the combustion-supporting gas injection tube 3 is provided with a plurality of swirl vanes 4 for swirling the combustion-supporting gas, and the angle ? formed between the swirl vanes 4 and the burner axis is 5° or more and 45° or less.
    Type: Application
    Filed: July 24, 2017
    Publication date: September 5, 2019
    Applicants: JFE STEEL CORPORATION, CHUGAI RO CO., LTD.
    Inventors: Sumito OZAWA, Koichi TSUTSUMI, Yoshihiro MIWA, Ikuhiro SUMI, Kenichi TOMOZAWA, Takayuki ITO
  • Publication number: 20190264914
    Abstract: Provided is an auxiliary burner for an electric furnace capable of increasing and homogenizing the heating effect of iron scrap by suitably and efficiently burning solid fuel along with gas fuel. This auxiliary burner 100 for an electric furnace comprises a solid fuel injection tube 1, a gas fuel injection tube 2, and a combustion-supporting gas injection tube 3 in the stated order from the center side, all arranged coaxially, and is characterized in that: a flow path 30 of the combustion-supporting gas injection tube 3 is provided with a plurality of swirl vanes 4 for swirling the combustion-supporting gas, and a flow path 20 of the gas fuel injection tube 2 is provided with a plurality of swirl vanes 5 for swirling the gas fuel; and the angle ?1 of the swirl vanes 4 and the ?2 of the swirl vanes 5 satisfy the relationship ?1<?2.
    Type: Application
    Filed: July 24, 2017
    Publication date: August 29, 2019
    Applicants: JFE STEEL CORPORATION, CHUGAI RO CO., LTD.
    Inventors: Koichi TSUTSUMI, Yoshihiro MIWA, Sumito OZAWA, Ikuhiro SUMI, Kenichi TOMOZAWA, Takayuki ITO
  • Patent number: 10388837
    Abstract: Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: August 20, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Tadashi Tomita
  • Publication number: 20190249922
    Abstract: Provided is an auxiliary burner for an electric furnace that has high iron scrap heating effect by appropriately and efficiently burning a solid fuel such as coal together with a gas fuel. An auxiliary burner for an electric furnace 100 has a structure in which a solid fuel injection tube 1, a gas fuel injection tube 2, and a combustion-supporting gas injection tube 3 are coaxially arranged in order from the center. The front end of the solid fuel injection tube 1 is located inside the gas fuel injection tube 2 to form, between the front end of the solid fuel injection tube 1 and the front end of the gas fuel injection tube 2, a first space 4 for solid fuel and gas fuel premixing surrounded by the front end portion of the gas fuel injection tube 2.
    Type: Application
    Filed: September 27, 2017
    Publication date: August 15, 2019
    Applicant: JFE STEEL CORPORATION
    Inventors: Yoshihiro MIWA, Koichi TSUTSUMI, Sumito OZAWA, Ikuhiro SUMI
  • Publication number: 20190241696
    Abstract: This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.
    Type: Application
    Filed: January 24, 2019
    Publication date: August 8, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Kazuaki SUMITA, Kenji HAGIWARA
  • Publication number: 20190225762
    Abstract: The present invention is a quartz glass fiber-containing prepreg including: (A) a quartz glass fiber; and (B) a curable resin composition, wherein at least one condition of conditions: (1) a dose of ?-ray contained in the quartz glass fiber is 0.005 c/cm2·hour or smaller, and, each of metal ion contents of Na+, Li+ and K+ is 1 ppm or lower; (2) the quartz glass fiber contains the number of foams of 10 foams/m2 or smaller a unit area; and (3) the quartz glass fiber-containing prepreg has the common bending stiffness in the range of a thickness of 100 to 200 ?m measured by a method described in JIS R 3420:2013 of 500 N·m2 or larger is satisfied. This provides a quartz glass fiber-containing prepreg that has particularly excellent dielectric characteristics, has excellent dielectric characteristics and the heat resistance, and/or has high handling property because of high bending stiffness characteristics.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 25, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Yoshihira HAMAMOTO, Toshio SHIOBARA, Akihiko OSAKI
  • Publication number: 20190067147
    Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.
    Type: Application
    Filed: July 20, 2018
    Publication date: February 28, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Shuichi FUJII, Kenji HAGIWARA, Shinsuke YAMAGUCHI
  • Publication number: 20190055377
    Abstract: The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.
    Type: Application
    Filed: July 3, 2018
    Publication date: February 21, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Shuichi FUJII, Kenji HAGIWARA, Kazuaki SUMITA
  • Patent number: 10008646
    Abstract: A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising: (A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4), (A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule, (A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate, (A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and (A-4) an acid anhydride curing agent in a liquid state at 25° C.; (A?) a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and (B) a curing accelerator.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: June 26, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Tadashi Tomita
  • Patent number: 9884960
    Abstract: Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes: (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: February 6, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Tadashi Tomita
  • Publication number: 20170373215
    Abstract: Provided are a heat-curable silicone resin composition for primarily encapsulating photocoupler that is superior in heat resistance and curability, has no stain at the time of being molded and after being cured, and exhibits a small change in a light transmissibility; a photocoupler encapsulated by such composition; and an optical semiconductor device having such photocoupler. The heat-curable silicone resin composition contains (A) a condensation reaction-type resinous organopolysiloxane solid at 25° C.; (B) an organopolysiloxane having a linear diorganopolysiloxane residue, and at least one cyclohexyl group or phenyl group in one molecule; (C) an inorganic filler; (D) an organic metal-based condensation catalyst; (E) a zirconium-carrying ion trapping agent; and (F) a mold release agent.
    Type: Application
    Filed: May 10, 2017
    Publication date: December 28, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Tadashi TOMITA
  • Publication number: 20170365756
    Abstract: Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
    Type: Application
    Filed: June 9, 2017
    Publication date: December 21, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Tadashi TOMITA
  • Publication number: 20170166730
    Abstract: Provided is a light-reflecting white heat-curable epoxy resin composition capable of forming a cured product that can maintain a high reflectivity and whiteness over a long period of time. The composition can be pressure-molded at a room temperature, and contains: (A) a prepolymer as a reaction product of a triazine derivative epoxy resin (A-1) and a non-aromatic and carbon-carbon double bond-free acid anhydride (A-2), wherein a ratio of a total sum of epoxy groups in the component (A-1) to a total sum of acid anhydride groups in the component (A-2) is 0.6 to 2.0; (B) a white pigment; (C) an inorganic filler other than the white pigment (B); (D) a curing accelerator; (E) at least one antioxidant selected from a phenolic antioxidant, a phosphorous antioxidant and a sulfur-based antioxidant; and (F) a hydrotalcite-like compound and/or a calcined product of a hydrotalcite-like compound.
    Type: Application
    Filed: December 9, 2016
    Publication date: June 15, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Tadashi TOMITA
  • Publication number: 20170088710
    Abstract: Provided are a heat-curable silicone resin composition capable of forming a cured product having a superior long-term reliability and a low-warpage property; an optical semiconductor device and a semiconductor package each having the cured product of such composition that is obtained in compression molding. The heat-curable silicone resin composition contains a molten mixture of a resinous organopolysiloxane (A) and an organopolysiloxane (B); an inorganic filler (C); a curing catalyst (D); and a silane coupling agent (E). The components (A) and (B) are cured by a condensation reaction, and a difference between a storage elastic modulus of a cured product of the composition at 25° C. and a storage elastic modulus of a cured product of the composition at 150° C. is not larger then 4,000 MPa.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 30, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihiro TSUTSUMI, Taro SHIMODA, Masahiro KANETA, Tadashi TOMITA
  • Publication number: 20170018693
    Abstract: A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising: (A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4), (A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule, (A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate, (A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and (A-4) an acid anhydride curing agent in a liquid state at 25° C.; (A?) a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and (B) a curing accelerator.
    Type: Application
    Filed: July 13, 2016
    Publication date: January 19, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Tadashi TOMITA