Abstract: Provided is a curable resin composition for a bonding film that has a high adhesion force to a copper foil with a small surface roughness, maintains a high adhesion force even after HAST, and can also be turned into a cured product superior in dielectric properties. The curable resin composition for a bonding film that is to be bonded to a copper foil, contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule, that is represented by the following formula (1), (2) or (3) wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 60 carbon atoms and is a hydrocarbon group other than a dimer acid frame-derived hydrocarbon group, D represents a dimer acid frame-derived hydrocarbon group, m, l and n are each 1 to 100; and (B) a catalyst.

Abstract: To directly and clearly observe the state inside a melting chamber in an electric furnace, a video-device-equipped electric furnace comprises: a melting chamber; a preheating chamber; and a video device to observe an inside of the melting chamber. The video device includes: a relay lens; an inner tube containing the relay lens and having an outer diameter of 100 mm or less; an outer tube containing the inner tube; and an imaging device located at an axial end of the relay lens on a furnace outside. The video device is provided through a hole in a furnace wall or lid so that the relay lens is located 300 mm to 3500 mm away from a highest molten iron interface in a vertically upward direction and the imaging device is located 300 mm or more away from an inner wall of the furnace wall or lid in a furnace outward direction.

Abstract: To clearly observe the inside of a furnace where an object is heated by a burner. The burner includes: a lens; an imaging device; and a multiple pipe structure including: an inner pipe that surrounds the lens; an outer pipe that surrounds the inner pipe, separated from the inner pipe by a lens coolant passage; a gaseous fuel pipe radially outward of the outer pipe and operable to inject gaseous fuel; a combustion-supporting gas pipe radially outward of the outer pipe and operable to inject combustion-supporting gas; and a cooling pipe outermost in the multiple pipe structure that surrounds the gaseous fuel pipe and the combustion-supporting gas pipe.

Abstract: To reduce production costs by increasing molten iron heating efficiency, a production method using an electric furnace is provided with a preheating chamber, a melting chamber, a cold iron source supporter operable to partition the preheating chamber into a first and a second preheating chamber, an extruder, and a video device operable to observe the second preheating chamber is used, the method including a melting process, a heating process, a preheating process, and a tapping process are performed. In the heating process, heating of the molten iron is started after the cold iron source supporter is closed, and based on the visual information obtained via the video device of the second preheating chamber.

Abstract: To ensure stable supply of a cold iron source to a melting chamber, a method of producing molten iron uses an electric furnace that includes: a preheating chamber; a melting chamber; an extruder located in the preheating chamber; and a video device configured to observe an inside of the melting chamber, and comprises: an extrusion process of supplying a cold iron source preheated in the preheating chamber to the melting chamber by the extruder; and a melting process of melting the cold iron source supplied to the melting chamber by arc heat to obtain molten iron, wherein in the extrusion process, a moving amount of the extruder and/or a time interval for moving the extruder is controlled based on visual information obtained from the video device.

Abstract: Provided is a resin composition capable of being turned into a cured product having a high glass-transition temperature and excellent dielectric properties as well. The resin composition is a heat-curable bismaleimide resin composition containing: (A) a bismaleimide compound represented by the following formula (1) wherein A independently represents a tetravalent organic group having 4 to 200 carbon atoms, B independently represents a divalent organic group having 2 to 200 carbon atoms, n is 2 to 100, and wherein A and/or B has therein a fluorene frame represented by the following formula (2) wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a (hetero)aryl group having 4 to 10 carbon atoms, a hydroxyl group, an alkoxy group, a halogeno group, an amino group, or a sulfenyl group; and (B) a reaction accelerator.

Abstract: A method of manufacturing a substrate with chips includes the following (A) and (B): (A) preparing a stacked substrate, the stacked substrate including: a plurality of chips; a first substrate to which the plurality of chips are temporarily bonded; and a second substrate bonded to the first substrate via the plurality of chips; and (B) separating the plurality of chips bonded to the first substrate and the second substrate, from the first substrate, in order to bond the plurality of chips to one surface of a third substrate including a device layer. In this method, the first substrate, from which the plurality of chips are separated, includes alignment marks that are used to ensure alignment when the first substrate and the plurality of chips are bonded together, or that are used to measure misalignment after the first substrate and the plurality of chips are bonded together.

Abstract: A digital content operating apparatus, including: a communication unit which communicates with an external device which has a display for displaying the digital content; a user operation interface which receives a user operation to control the digital content which is displayed on the external device; a display which displays either a linear content operation panel or an interactive content operation panel; and a controller which controls the user operation interface corresponding to information on the digital content which is displayed on the external device; wherein either the linear content operation panel or the interactive content operation panel is displayed alternatively as the user operation interface on the display.

Abstract: Provided is a resin composition capable of being turned into a cured product exhibiting excellent dielectric properties even at high frequencies and small changes in dielectric properties even after being left under a high temperature for a long period. The resin composition is a curable resin composition containing: (A) a maleimide compound represented by the following general formula (1) wherein D independently represents a dimer acid- and trimer acid-derived hydrocarbon group; B independently represents a cyclic structure-containing divalent hydrocarbon group other than a dimer acid- and trimer acid-derived hydrocarbon group; A independently represents a tetravalent organic group having a cyclic structure; m is 0 to 100, n is 0 to 100; and (B) a catalyst, wherein D in the formula (1) is a group in which dimer acid-derived hydrocarbon group occupies 95% by mass or more of the dimer acid- and trimer acid-derived hydrocarbon group, and is a hydrogenated group.

Abstract: Provided is a bonding film for a high-speed communication board that is superior in adhesion to a conductor layer without requiring a specifical treatment process for improving an adhesiveness between the smooth conductor layer and an insulation layer in the production of a circuit board such as a multilayered printed-wiring board and a flexible printed-wiring board. The bonding film is a curable adhesive layer-containing bonding film for a high-speed communication board, which includes: a curable resin composition layer containing a curable resin composition; and a curable adhesive composition layer that is laminated on one or both surfaces of the curable resin composition layer, contains a bismaleimide resin-containing curable adhesive composition, and has a thickness of 1 to 100 ?m.

Abstract: A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; further processing the plurality of semiconductor dies into a reconstituted wafer; and decoupling the reconstituted wafer from the carrier substrate at an interface using a laser source. The alignment marks are interposed between the interface and the laser source.

Abstract: Provided is a method for producing a cured product of a heat-curable maleimide resin composition, that causes no curing failure and no appearance failure associated therewith. The method is for producing a cured product of a heat-curable maleimide resin composition containing: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a radical polymerization initiator, wherein the method includes: a laminating step of obtaining a laminate by laminating a release sheet, a resin layer made of the heat-curable maleimide resin composition, and a base material, in such order; and a curing step of heating the laminate to a temperature at which the heat-curable maleimide resin composition of the resin layer cures, without removing the release sheet of the laminate.

Abstract: Provided is a bismaleimide compound having a favorable compatibility with other resins and contributing to a higher Tg. The compound is represented by the following formula wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 200 carbon atoms, Q independently represents a cyclohexane backbone-containing divalent alicyclic hydrocarbon group having 6 to 60 carbon atoms, W represents B or Q, n represents 1 to 100, m represents 0 to 100, repeating units identified by n and m whose bonding pattern may be alternate, block or random are present in any order, and wherein Q is independently represented by the following formula (2): wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, each of x1 and x2 represents a number of 0 to 4.

Abstract: Provided is a heat-curable maleimide resin composition exhibiting no turbidity and separation when in the form of a varnish, and yielding a cured product that not only has excellent dielectric properties but also has a strong adhesive force to organic resins such as LCP and MPI and copper. The composition contains: (A) a styrene-based elastomer having a reactive functional group at both ends; (B) a maleimide compound represented by the following formula (1) wherein R1 represents a dimer acid skeleton-derived divalent hydrocarbon group; (C) an epoxy resin having at least two epoxy groups per molecule; and (D) an anionic polymerization initiating catalyst, wherein a ratio between the components (A) and (B) (mass ratio (A)/(B)) is 2 to 20.

Abstract: Provided is a heat-curable maleimide resin composition capable of yielding a cured product having excellent dielectric properties even in the high-frequency region, a low water absorption rate, and a high glass-transition temperature. The heat-curable maleimide resin composition contains: (A) two or more kinds of maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a reaction initiator, wherein a cured product of the heat-curable maleimide resin composition has a dielectric tangent of not larger than 0.003 both at 10 GHz and 40 GHz.

Abstract: Provided are a heat-curable maleimide resin composition for RTM that is used to produce a fiber-reinforced composite material such as FRP, and is superior in dielectric properties; and a fiber-reinforced composite material using such composition. The composition contains: (A-1) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, and having a viscosity of not higher than 20 Pa·s; (A-2) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, having a viscosity of greater than 20 Pa·s, and exhibiting a fluidity at 25° C.; (B) a radical polymerization initiator; and (C) a polymerization inhibitor, wherein the viscosities of the components (A-1) and (A-2) are measured in accordance with a method described in JIS Z8803:2011, at a measurement temperature of 25° C., and using a Brookfield-type rotary viscometer with a rotation rate of a spindle being set to 5 rpm.

Abstract: Provided is a heat-curable resin composition capable of yielding a cured product that has a superior dielectric property and heat resistance and is thus useful for high-frequency purposes. Particularly, there are provided a composition containing the following components (A), (C) and (D); and a composition containing the following components (A) and (B). The components (A), (B), (C) and (D) are: (A) a cyclopentadiene compound represented by the following formula (1) and/or an oligomer(s) of the cyclopentadiene compound wherein R represents a group selected from an alkyl group, an alkenyl group and an aryl group, n represents an integer of 1 to 4, each of x1 and x2 independently represents 0, 1 or 2, provided that when R represents an alkyl group or an aryl group, x1 represents 1 or 2, and x1 and x2 satisfy 1?x1+x2?4; (B) a cyclic imide compound; (C) a curing accelerator; and (D) an inorganic filler.

Abstract: Provided is such a cyclic imide resin composition where although it has a fast curability and a cured product thereof has a low relative permittivity, a low dielectric tangent and an excellent heat resistance, the composition itself has a high adhesive force. The cyclic imide resin composition contains: (a) a cyclic imide compound represented by the following formula (1) and having a weight-average molecular weight of 2,000 to 1,000,000, wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group that may contain a hetero atom and has not less than six carbon atoms, X independently represents a hydrogen atom or a methyl group, m is 1 to 1,000; (b) an epoxy compound; and (c) a polymerization initiator containing at least two types of polymerization initiators which are a radical polymerization initiator (c-1) and an anionic polymerization initiator (c-2).

Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.