Abstract: Provided are a heat-curable silicone resin composition capable of forming a cured product having a superior long-term reliability and a low-warpage property; an optical semiconductor device and a semiconductor package each having the cured product of such composition that is obtained in compression molding. The heat-curable silicone resin composition contains a molten mixture of a resinous organopolysiloxane (A) and an organopolysiloxane (B); an inorganic filler (C); a curing catalyst (D); and a silane coupling agent (E). The components (A) and (B) are cured by a condensation reaction, and a difference between a storage elastic modulus of a cured product of the composition at 25° C. and a storage elastic modulus of a cured product of the composition at 150° C. is not larger then 4,000 MPa.

Abstract: A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising: (A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4), (A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule, (A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate, (A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and (A-4) an acid anhydride curing agent in a liquid state at 25° C.; (A?) a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and (B) a curing accelerator.

Abstract: A composite oxide particle prepared from raw materials comprising: (1) a finely powdered silica having a BET specific surface area of 50 m2/g or greater or an alkoxysilane, and (2) a liquid metal alkoxide other than an alkoxysilane or a nano order metal oxide powder other than finely powdered silica, one of components (1) and (2) being a solid oxide and the other being a liquid alkoxide, wherein the composite oxide particle is prepared by mixing or kneading the raw materials to obtain a sol or gel-like substance, sintering the sol or gel-like substance at a temperature of 300° C. or higher to form a glass-like substance, and then crushing the glass-like substance is provided. Also, a resin composition containing the composite oxide particle, and a reflector for a light-emitting semiconductor device formed using the resin composition are provided.

Abstract: Provided are a heat-curable epoxy resin composition with a superior handling property, transparency and crack resistance; and an optical semiconductor device having an optical semiconductor element encapsulated by such composition. The composition includes: (A) a prepolymer obtained by a reaction of (A-1), (A-2), (A-3) and (A-4) at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0, (A-1) being a triazine derivative epoxy resin, (A-2) being at least one selected from the group consisting of a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, a hydrogenated bisphenol A-type epoxy resin and an alicyclic epoxy resin, (A-3) being an acid anhydride curing agent as a liquid at 50° C.

Abstract: Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes: (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

Abstract: The present invention provides a case for installing semiconductor element for use in LED etc. formed from a white thermosetting silicone resin composition and a cured material thereof that have low light transmittance rate, excellent moldability and are difficult to cause a burr to occur in molding. Provided is a white thermosetting silicone resin composition for a light-emitting semiconductor device, comprising: (A) a resin organopolysiloxane having a hydroxy group, and exhibiting a weight-average molecular weight of 500 to 20,000 based on polystyrene conversion, (B) an organopolysiloxane having a straight-chain diorganopolysiloxane residue, (C) a white pigment, (D) an inorganic filler other than (C), (E) a silane coupling agent in which a refractive index difference from the resin organopolysiloxane (A) is higher than or equal to 0.02 and a boiling point at atmospheric pressure is higher than or equal to 200° C., and (F) a curing catalyst.

Abstract: Provided are a heat-curable epoxy resin composition with a superior handling property, transparency and crack resistance; and an optical semiconductor device having an optical semiconductor element encapsulated by such composition. The composition includes: (A) a prepolymer obtained by a reaction of (A-1), (A-2), (A-3) and (A-4) at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0, (A-1) being a triazine derivative epoxy resin, (A-2) being at least one selected from the group consisting of a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, a hydrogenated bisphenol A-type epoxy resin and an alicyclic epoxy resin, (A-3) being an acid anhydride curing agent as a liquid at 50° C.

Abstract: Provided is a heat-curable epoxy resin composition for encapsulating an optical semiconductor element. The resin composition exhibits a high strength and elastic modulus even in a high-temperature environment, hardly turns yellow due to an uneven hardening that occurs immediately after molding, and is solid under a room temperature such that the resin composition can be handled easily. The resin composition includes: a prepolymer obtained through a reaction of (A) a triazine derivative epoxy resin, (B) at least one epoxy resin selected from a group of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a hydrogenated bisphenol A-type epoxy resin and (B-4) an alicyclic epoxy resin and (C) an acid anhydride curing agent, at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0; and (D) a curing accelerator, such resin composition capable of being pressure molded under a room temperature before thermally cured.

Abstract: The present invention provides a case for installing semiconductor element for use in LED etc. formed from a white thermosetting silicone resin composition and a cured material thereof that have low light transmittance rate, excellent moldability and are difficult to cause a burr to occur in molding. Provided is a white thermosetting silicone resin composition for a light-emitting semiconductor device, comprising: (A) a resin organopolysiloxane having a hydroxy group, and exhibiting a weight-average molecular weight of 500 to 20,000 based on polystyrene conversion, (B) an organopolysiloxane having a straight-chain diorganopolysiloxane residue, (C) a white pigment, (D) an inorganic filler other than (C), (E) a silane coupling agent in which a refractive index difference from the resin organopolysiloxane (A) is higher than or equal to 0.02 and a boiling point at atmospheric pressure is higher than or equal to 200° C., and (F) a curing catalyst.

Abstract: A wafer processing method includes a functional layer cutting step of applying a laser beam along each division line formed on a functional layer to thereby ablate the functional layer and form a laser processed groove along each division line. A protective member is attached to the front side of the functional layer. A groove is cut by positioning a cutting blade on the back side of the substrate in the area corresponding to each division line. The cut groove has a depth not reaching the functional layer. A dicing tape is attached to the back side of the substrate to support the outer circumferential portion of the dicing tape to an annular frame. The protective member is peeled off and the dicing tape attached to the back side of the substrate is expanded to increase the spacing between the devices.

Abstract: A wafer processing method includes a functional layer cutting step of applying a laser beam along each division line formed on a functional layer to thereby ablate the functional layer and form a laser processed groove along each division line. A protective member is attached to the front side of the functional layer. A groove is cut by positioning a cutting blade on the back side of the substrate in the area corresponding to each division line. The cut groove has a depth not reaching the functional layer. A dicing tape is attached to the back side of the substrate to support the outer circumferential portion of the dicing tape to an annular frame. The protective member is peeled off and the dicing tape attached to the back side of the substrate is expanded to increase the spacing between the devices.

Abstract: A composite oxide particle prepared from raw materials comprising: (1) a finely powdered silica having a BET specific surface area of 50 m2/g or greater or an alkoxysilane, and (2) a liquid metal alkoxide other than an alkoxysilane or a nano order metal oxide powder other than finely powdered silica, one of components (1) and (2) being a solid oxide and the other being a liquid alkoxide, wherein the composite oxide particle is prepared by mixing or kneading the raw materials to obtain a sol or gel-like substance, sintering the sol or gel-like substance at a temperature of 300° C. or higher to form a glass-like substance, and then crushing the glass-like substance is provided. Also, a resin composition containing the composite oxide particle, and a reflector for a light-emitting semiconductor device formed using the resin composition are provided.

Abstract: A composite particle comprises inorganic compound particles that are derived from inorganic particle and are uniformly dispersed and sintered in a matrix phase composed of silica, or comprises silica particles that are uniformly dispersed and sintered in a matrix phase composed of said inorganic compound particles. The composite particle is prepared by sintering a mixture of (1) finely powdered silica having a BET specific surface area of 50 m2/g or greater, (2) an inorganic particle other than silica and (3) water at a temperature of 300° C. or higher to form a glass-like substance, and then crushing the glass-like substance. A spherical composite particle is prepared by melting and spheroidizing the mixture of (1)-(3) in a flame of 1,800° C. or higher.

Abstract: A thermosetting silicone resin composition for reflector of LED has an organopolysiloxane represented by the following average compositional formula, and has at least two alkenyl groups in one molecule, a linear organohydrogen polysiloxane represented by the following formula and/or a branched organohydrogenpolysiloxane represented by the following formula, an addition reaction catalyst, a white pigment selected from titanium oxide, zinc oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate and barium sulfate, and an inorganic filler other than Component, R1aR2bR3c(OR0)dSiO(4-a-b-c-d)/2??(1) R7eR8fHgSiO(4-e-f-g)/2??(3). There can be a thermosetting silicone resin composition which provides a cured product excellent in heat resistance and light resistance, less leakage of light to outside, and particularly suitable for a matrix array reflector.

Abstract: A thermosetting silicone resin composition for an LED reflector has: a thermosetting resin; at least one kind of white pigment selected from titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and an inorganic filler other than the pigment, which contains at least one kind of inorganic filler that has an average particle diameter of 30 ?m to 100 ?m and a refraction index that is different from a refraction index of a cured material of the thermosetting resin by 0.05 or more, and at least one kind of inorganic filler that has an average particle diameter of less than 30 ?m. The thermosetting resin composition provides a cured material that has excellent heat and light resisting properties and hardly leaks light, a reflector for an LED obtained by molding using the composition, and an optical semiconductor apparatus using the reflector.

Abstract: A thermosetting silicone resin composition for an LED reflector has: a thermosetting resin; at least one kind of white pigment selected from titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and an inorganic filler other than the pigment, which contains at least one kind of inorganic filler that has an average particle diameter of 30 ?m to 100 ?m and a refraction index that is different from a refraction index of a cured material of the thermosetting resin by 0.05 or more, and at least one kind of inorganic filler that has an average particle diameter of less than 30 ?m. The thermosetting resin composition provides a cured material that has excellent heat and light resisting properties and hardly leaks light, a reflector for an LED obtained by molding using the composition, and an optical semiconductor apparatus using the reflector.

Abstract: A thermosetting silicone resin composition for reflector of LED has an organopolysiloxane represented by the following average compositional formula, and has at least two alkenyl groups in one molecule, a linear organohydrogen polysiloxane represented by the following formula and/or a branched organohydrogenpolysiloxane represented by the following formula, an addition reaction catalyst, a white pigment selected from titanium oxide, zinc oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate and barium sulfate, and an inorganic filler other than Component, R1aR2bR3c(OR0)dSiO(4-a-b-c)/2??(1) R7eR8fHgSiO(4-e-f-g)/2??(3). There can be a thermosetting silicone resin composition which provides a cured product excellent in heat resistance and light resistance, less leakage of light to outside, and particularly suitable for a matrix array reflector.

Abstract: A platen knob includes a first hollow cylinder having one bottom wall, a second hollow cylinder extending from the interior surface of the bottom wall coaxially with the first cylinder. The second cylinder is fitted on a shaft of a cylindrical platen through a hollow boss of a casing housing the platen. A cavity defined between the sidewalls of the cylinders receives a vibration-proof lining and/or an acoustical layer. The lining suppresses a vibration of the platen knob. The acoustical layer seals the boss of the casing and leaks no noise from the interior of an electronic apparatus including a platen.