Abstract: A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Abstract: Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 ?m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: Provided are a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance; and a semiconductor device encapsulated by the cured product of such resin composition. The heat-curable maleimide resin composition for semiconductor encapsulation contains: (A) a maleimide compound being solid at 25° C., and having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two maleimide groups; (B) an inorganic filler; and C) a curing accelerator.

Abstract: The present invention is a quartz glass fiber-containing prepreg, including: (A) at least one quartz glass fiber selected from the group consisting of a quartz cloth, a quartz chopped strand, a quartz nonwoven fabric, and a quartz wool; as well as a resin composition including (B) a maleimide compound that is a solid at 25° C., containing at least one dimer acid skeleton, at least one linear alkylene group having 6 or more carbon atoms, and at least two maleimide groups in the molecule; and (C) a curing accelerator, wherein the total content of uranium and thorium is 0 to 0.1 ppm. This provides a quartz glass fiber-containing prepreg to give a quartz glass fiber-containing substrate that is used as a PCB to prevent malfunction of a semiconductor device caused by the PCB to decrease transmission loss.

Abstract: Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

Abstract: This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.

Abstract: The present invention is a quartz glass fiber-containing prepreg including: (A) a quartz glass fiber; and (B) a curable resin composition, wherein at least one condition of conditions: (1) a dose of ?-ray contained in the quartz glass fiber is 0.005 c/cm2·hour or smaller, and, each of metal ion contents of Na+, Li+ and K+ is 1 ppm or lower; (2) the quartz glass fiber contains the number of foams of 10 foams/m2 or smaller a unit area; and (3) the quartz glass fiber-containing prepreg has the common bending stiffness in the range of a thickness of 100 to 200 ?m measured by a method described in JIS R 3420:2013 of 500 N·m2 or larger is satisfied. This provides a quartz glass fiber-containing prepreg that has particularly excellent dielectric characteristics, has excellent dielectric characteristics and the heat resistance, and/or has high handling property because of high bending stiffness characteristics.

Abstract: A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

Abstract: The present invention is a thermosetting epoxy resin sheet for encapsulating a semiconductor, characterized by being a sheet formed from a composition including: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in a molecule thereof, (D) an inorganic filler, and (E) an urea-based curing accelerator. The present invention provides a thermosetting epoxy resin sheet for encapsulating a semiconductor that has excellent flexibility and good handleability in an uncured state, together with excellent storage stability and formability.

Abstract: A heat-curable epoxy resin composition for optical semiconductor element encapsulation capable of being pressure molded and transfer molded under room temperature, comprising: (A) a prepolymer obtained by reacting at least one component of (A-1), (A-2) and (A-3); and (A-4), (A-1) a triazine derivative epoxy resin having not less than three epoxy groups in one molecule, (A-2) at least one epoxy resin that is non-fluid at 25° C. and selected from the group consisting of a bisphenol-type epoxy resin, a hydrogenated bisphenol-type epoxy resin, an alicyclic epoxy resin and monoalkyl diglycidyl isocyanurate, (A-3) a cyclic siloxane compound having not less than two epoxy groups in one molecule, and (A-4) an acid anhydride curing agent in a liquid state at 25° C.; (A?) a component(s) among (A-1) to (A-3) that is/are not used in said prepolymer (A); and (B) a curing accelerator.

Abstract: Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes: (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

Abstract: Provided are a heat-curable silicone resin composition for primarily encapsulating photocoupler that is superior in heat resistance and curability, has no stain at the time of being molded and after being cured, and exhibits a small change in a light transmissibility; a photocoupler encapsulated by such composition; and an optical semiconductor device having such photocoupler. The heat-curable silicone resin composition contains (A) a condensation reaction-type resinous organopolysiloxane solid at 25° C.; (B) an organopolysiloxane having a linear diorganopolysiloxane residue, and at least one cyclohexyl group or phenyl group in one molecule; (C) an inorganic filler; (D) an organic metal-based condensation catalyst; (E) a zirconium-carrying ion trapping agent; and (F) a mold release agent.

Abstract: Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

Abstract: Provided is a light-reflecting white heat-curable epoxy resin composition capable of forming a cured product that can maintain a high reflectivity and whiteness over a long period of time. The composition can be pressure-molded at a room temperature, and contains: (A) a prepolymer as a reaction product of a triazine derivative epoxy resin (A-1) and a non-aromatic and carbon-carbon double bond-free acid anhydride (A-2), wherein a ratio of a total sum of epoxy groups in the component (A-1) to a total sum of acid anhydride groups in the component (A-2) is 0.6 to 2.0; (B) a white pigment; (C) an inorganic filler other than the white pigment (B); (D) a curing accelerator; (E) at least one antioxidant selected from a phenolic antioxidant, a phosphorous antioxidant and a sulfur-based antioxidant; and (F) a hydrotalcite-like compound and/or a calcined product of a hydrotalcite-like compound.