Patents by Inventor Yoshihiro Yoneda

Yoshihiro Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8547195
    Abstract: A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: October 1, 2013
    Assignee: Dexerials Corporation
    Inventors: Yuji Kimura, Takahiro Asada, Yoshihiro Yoneda, Kazuaki Suzuki
  • Publication number: 20130244363
    Abstract: A method for producing an optical semiconductor device includes the steps of forming a semiconductor structure; forming a mask on the semiconductor structure; etching the semiconductor structure with the mask to form first and second stripe-shaped grooves and a mesa portion; forming a protective film on a top surface and side surfaces of the mesa portion; forming a resin portion on the protective film; etching the resin portion and the protective film formed on the top surface; forming an upper electrode on the top surface; and forming an electrical interconnection on the resin portion. The resin portion has an inclined surface region that rises from a first point above the mesa portion toward a second point above the first stripe-shaped groove. The step of etching the resin portion and the protective film includes the substeps of etching the resin portion and simultaneously etching the resin portion and the protective film.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 19, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro YONEDA, Hirohiko KOBAYASHI, Ryuji MASUYAMA
  • Patent number: 8483744
    Abstract: There is provided a communication apparatus including: a first communication unit having a first communication range; a second communication unit having a second communication range wider than the first communication range; a control unit which transmits a request signal for starting communication via the second communication unit from the first communication unit to another communication apparatus, and transmits authentication information from the second communication unit to the another communication apparatus in the case where it is determined that communication with the another communication apparatus via the second communication unit is possible based on a response signal after the first communication unit receives the response signal in response to the request signal; and a notification unit which notifies a user after the second communication unit receives a result of authentication based on the authentication information.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: July 9, 2013
    Assignee: Sony Corporation
    Inventors: Kazuo Takada, Isao Soma, Seiji Kuroda, Yasuharu Ishikawa, Yoshihiro Yoneda, Naoki Miyabayashi
  • Patent number: 8474134
    Abstract: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: July 2, 2013
    Assignee: Dexerials Corporation
    Inventors: Yoshihiro Yoneda, Takahiro Asada, Kazuaki Suzuki
  • Publication number: 20130099890
    Abstract: A protective element that is capable of promptly reliably disconnecting a current path by taking advantage of the erosion phenomenon of a solder in a melted state. A plurality of electrodes is formed by a first electrically conductive layer deposited on a substrate and by a plurality of second electrically conductive layers. A solder paste has a wetting performance for the electrodes higher than that for the substrate and is deposited on top of the first and second electrically conductive layers formed on the substrate. The solder paste melts by at least one out of heat generated by a resistor and heat generated by a stack of the electrodes and the solder paste. As the solder paste erodes the portion of the first electrically conductive layer intermediate between the electrodes, it is attracted towards the electrodes exhibiting higher wettability by it than that of the substrate.
    Type: Application
    Filed: June 15, 2011
    Publication date: April 25, 2013
    Applicant: DEXERIALS CORPORATION
    Inventor: Yoshihiro Yoneda
  • Publication number: 20130071129
    Abstract: A multi-channel optical waveguide receiver includes an optical input port; an optical branching unit; light-receiving elements having bias electrodes and signal electrodes; optical waveguides being optically coupled between the optical branching unit and the light-receiving elements; capacitors electrically connected between the bias electrodes and a reference potential, the capacitors and the bias electrodes being connected through interconnection patterns; and a signal amplifier including input electrodes. The optical branching unit, the light-receiving elements, the optical waveguides, and the capacitors are formed on a single substrate, the substrate having an edge extending in a first direction. The signal amplifier and the substrate are arranged in a second direction crossing the first direction. The input electrodes and the signal electrodes are arranged along the edge of the substrate.
    Type: Application
    Filed: September 11, 2012
    Publication date: March 21, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro YONEDA, Hideki YAGI, Naoko INOUE
  • Patent number: 8396421
    Abstract: A communication processing apparatus, a computer program product, and a data processing method are provided. The communication processing apparatus includes a near-field communication unit configured to perform near-field communication; a control unit configured to acquire communication history data of near-field communication performed by using the near-field communication unit; and a storage unit configured to store the communication history data under control of the control unit, wherein the control unit is configured to acquire the communication history data stored in the storage unit and transmit the acquired communication history data to a server that performs information management, when issuing an information registration request to the server.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: March 12, 2013
    Assignee: Sony Corporation
    Inventors: Seiji Kuroda, Isao Soma, Yasuharu Ishikawa, Kazuo Takada, Yoshihiro Yoneda, Naoki Miyabayashi
  • Patent number: 8396925
    Abstract: An information processing device includes: a first receiving unit to receive, from a first other information processing device, equipment information of a second other information processing device that differs from the first other information processing device, via a first communication and first connecting information useful for connecting with the second other information processing device by a second communication that differs from the first communication; a first transmitting unit to transmit second connection information that is useful for connecting with the device itself by the second communication to the first other information processing device, via the first communication; and a second receiving unit to receive content data transmitted from the second other information processing device by the second communication, based on the first connection information and the second connection information.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: March 12, 2013
    Assignee: Sony Corporation
    Inventors: Yoshihiro Yoneda, Naoki Miyabayashi, Isao Soma, Seiji Kuroda, Yasuharu Ishikawa, Kazuo Takada
  • Publication number: 20130058371
    Abstract: A semiconductor optical integrated device includes a substrate having a main surface with a first and second regions arranged along a waveguiding direction; a gain region including a first cladding layer, an active layer, and a second cladding layer arranged on the first region of the main surface; and a wavelength control region including a third cladding layer, an optical waveguide layer, and a fourth cladding layer arranged on the second region of the main surface and including a heater arranged along the optical waveguide layer. The substrate includes a through hole extending from a back surface of the substrate in the thickness direction and reaching the first region. A metal member is arranged in the through hole. The metal member extends from the back surface of the substrate in the thickness direction and is in contact with the first cladding layer.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 7, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro YONEDA, Masaki YANAGISAWA, Kenji KOYAMA, Hirohiko KOBAYASHI, Kenji HIRATSUKA
  • Publication number: 20130044402
    Abstract: A protective circuit capable of coping with broad voltage variations of a battery unit to interrupt its charging/discharging current path as damages to the heating unit are prevented from occurrence is disclosed. The protective circuit includes fuses, connected to a charging/discharging current path in series between a battery unit and a charging/discharging control circuit, and a heating unit composed by a series connection of resistors. One of two ends of the resistor which is not connected to the peer resistor is connected to a current path of the fuses. The ends of the resistors not connected to the fuses, are provided with a plurality of terminals selected for connection to a current control element that controls the current flowing through the heating unit, as a range of voltage variations of the battery unit is taken into account.
    Type: Application
    Filed: December 29, 2010
    Publication date: February 21, 2013
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Koichi Mukai, Masahiko Ishimaru, Takahiro Asada, Chisato Komori, Yoshihiro Yoneda, Yuuji Kimura, Shoko Nagaki
  • Patent number: 8380982
    Abstract: A communication device for performing communication by employing first and second communication units, includes: a reception unit for receiving a communication packet including a random number generated for every connection with another communication device, a certificate calculated with the random number, and authentication method information indicating whether or not an authentication method at the second communication unit is compatible with the public key system, through the first communication unit; and a method determining unit for determining whether or not an originator of the communication packet accepts public key encryption based on the authentication method information included in the communication packet; wherein in a case of the method determining unit determining that the originator of the communication packet does not accept the public key system, the random number included in the communication packet is replied to the originator as the identification information of the device itself.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 19, 2013
    Assignee: Sony Corporation
    Inventors: Naoki Miyabayashi, Yoshihiro Yoneda, Isao Soma, Seiji Kuroda, Yasuharu Ishikawa, Kazuo Takada, Masahiro Sueyoshi
  • Publication number: 20130012002
    Abstract: A method for producing a semiconductor optical integrated device includes the steps of forming a substrate product including first and second stacked semiconductor layer portions; forming a first mask on the first and second stacked semiconductor layer portions, the first mask including a stripe-shaped first pattern region and a second pattern region, the second pattern region including a first end edge; forming a stripe-shaped mesa structure; removing the second pattern region of the first mask; forming a second mask on the second stacked semiconductor layer portion; and selectively growing a buried semiconductor layer with the first and second masks. The second mask includes a second end edge separated from the first end edge of the first mask, the second end edge being located on the side of the second stacked semiconductor layer portion in the predetermined direction with respect to the first end edge of the first mask.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 10, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro YONEDA, Hirohiko KOBAYASHI, Kenji KOYAMA, Masaki YANAGISAWA, Kenji HIRATSUKA
  • Publication number: 20120309121
    Abstract: A method of making a semiconductor optical integrated device includes the steps of forming, on a substrate, a plurality of semiconductor integrated devices including a first optical semiconductor element having a first bonding pad and a second optical semiconductor element; forming a plurality of bar-shaped semiconductor optical integrated device arrays by cutting the substrate, each of the semiconductor optical integrated device arrays including two or more semiconductor optical integrated devices; alternately arranging the plurality of semiconductor optical integrated device arrays and a plurality of spacers in a thickness direction of the substrate so as to be fixed in place; and forming a coating film on a facet of the semiconductor optical integrated device array. Furthermore, the spacer has a movable portion facing the first bonding pad, the movable portion protruding toward the first bonding pad and being displaceable in a protruding direction.
    Type: Application
    Filed: May 24, 2012
    Publication date: December 6, 2012
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro YONEDA, Hirohiko KOBAYASHI, Kenji KOYAMA, Masaki YANAGISAWA, Kenji HIRATSUKA
  • Patent number: 8301124
    Abstract: An information processing apparatus for communicating with a different information processing apparatus, includes: a first connection establishment block configured to control a first communication section, which carries out nearby wireless communication for delivering and accepting information to and from the different information processing apparatus positioned near to the information processing apparatus, to establish a connection for the nearby wireless communication; an acquisition block configured to acquire setting information for short range wireless communication which exhibits a wire communication range than the nearby wireless communication and capability information regarding the capacity of the different information processing apparatus from the different information processing apparatus through the nearby wireless communication; and a second connection establishment block configured to control a second communication section, which carries out the short range wireless communication, based on the
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: October 30, 2012
    Assignee: Sony Corporation
    Inventors: Isao Soma, Naoki Miyabayashi, Yoshihiro Yoneda, Seiji Kuroda, Yasuharu Ishikawa
  • Publication number: 20120220278
    Abstract: There is provided an information processing system including a service provider unit, a communication terminal and an information processing unit. The communication terminal includes a terminal first communication section, a terminal second communication section to communicate with the information processing unit through a first communication channel, a terminal third communication section to communicate with the information processing unit through a second communication channel, and a terminal communication control section.
    Type: Application
    Filed: May 3, 2012
    Publication date: August 30, 2012
    Applicant: SONY CORPORATION
    Inventors: Isao Soma, Naoki Miyabayashi, Yoshihiro Yoneda, Seiji Kuroda, Yasuharu Ishikawa, Kazuo Takada
  • Publication number: 20120156994
    Abstract: A communication processing apparatus, a computer program product, and a data processing method are provided. The communication processing apparatus includes a near-field communication unit configured to perform near-field communication; a control unit configured to acquire communication history data of near-field communication performed by using the near-field communication unit; and a storage unit configured to store the communication history data under control of the control unit, wherein the control unit is configured to acquire the communication history data stored in the storage unit and transmit the acquired communication history data to a server that performs information management, when issuing an information registration request to the server.
    Type: Application
    Filed: February 16, 2012
    Publication date: June 21, 2012
    Applicant: SONY CORPORATION
    Inventors: Seiji Kuroda, Isao Soma, Yasuharu Ishikawa, Kazuo Takada, Yoshihiro Yoneda, Naoki Miyabayashi
  • Publication number: 20120148184
    Abstract: A process to manufacture a semiconductor optical modulator is disclosed, in which the process easily forms a metal film including AuZn for the p-ohmic metal even a contact hole has an enhanced aspect ration. The process forms a mesa including semiconductor layers first, then, buries the mesa by a resin layer sandwiched by insulating films. The resin layer provides an opening reaching the top of the mesa, into which the p-ohmic metal is formed. Another metal film including Ti is formed on the upper insulating film along the opening.
    Type: Application
    Filed: December 6, 2011
    Publication date: June 14, 2012
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yoshihiro Yoneda, Kenji Koyama, Hirohiko Kobayashi
  • Patent number: 8180278
    Abstract: There is provided an information processing system including a service provider unit, a communication terminal and an information processing unit. The communication terminal includes a terminal first communication section, a terminal second communication section to communicate with the information processing unit through a first communication channel, a terminal third communication section to communicate with the information processing unit through a second communication channel, and a terminal communication control section.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: May 15, 2012
    Assignee: Sony Corporation
    Inventors: Isao Soma, Naoki Miyabayashi, Yoshihiro Yoneda, Seiji Kuroda, Yasuharu Ishikawa, Kazuo Takada
  • Patent number: 8135343
    Abstract: An information management apparatus includes a communication unit configured to receive, from a plurality of communication processing apparatuses, a plurality of pieces of communication history data of near-field communication performed in the plurality of communication processing apparatuses; a data comparison unit configured to perform comparison of the plurality of pieces of communication history data received by the communication unit; and a data registration unit configured to register a plurality of pieces of user information associated with the plurality of communication processing apparatuses as a group in a database on condition that it is verified by the data comparison unit, in accordance with the plurality of pieces of communication history data of the near-field communication, that near-field communication has been performed between the plurality of communication processing apparatuses.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: March 13, 2012
    Assignee: Sony Corporation
    Inventors: Seiji Kuroda, Isao Soma, Yasuharu Ishikawa, Kazuo Takada, Yoshihiro Yoneda, Naoki Miyabayashi
  • Patent number: 8105866
    Abstract: A semiconductor photo detecting element includes a PIN-type photo detecting element and window semiconductor layer. The PIN-type photo detecting element has a semiconductor substrate, a first semiconductor layer, a second semiconductor layer and a third semiconductor layer. The first semiconductor layer is provided on the semiconductor substrate, is lattice-matched to the semiconductor substrate, includes a first conductivity type dopant, and has first band gap energy. The second semiconductor layer is provided on the first semiconductor layer, has the first band gap energy, and has a concentration of the first conductivity type dopant lower than that of the first semiconductor layer or is substantially undoped. The third semiconductor layer is provided on the second semiconductor layer. The window semiconductor layer has second band gap energy larger than the first band gap energy at a light-incoming side with respect to the second semiconductor layer and has a thickness of 5 nm to 50 nm.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: January 31, 2012
    Assignee: Eudyna Devices Inc.
    Inventors: Yoshihiro Yoneda, Ryuji Yamabi