Abstract: An information processing device which shares data with one or more communication partners includes a creation unit which creates its own encryption key that the device uses for itself and encryption keys that the communication partners use, a first communication unit which transmits all the encryption keys created by the creation unit to the communication partners with the first communication, a division unit which divides the data, an encryption unit which encrypts its own data that the device is to save for itself among the data divided by the division unit with its own encryption key, a second communication unit which transmits other data that the communication partners are to save among the data divided by the division unit to the communication partners with the second communication, and a storage unit which stores its own data encrypted by the encryption unit and the other encryption keys.

Abstract: A system and method for information processing is provided. In an embodiment of the present system and method, a connection target apparatus is detected at an information processing apparatus. Upon detection, the information processing apparatus generates apparatus information and transmits the apparatus information to a server via a communication path. Based on the apparatus information, the server generates connection information and transmits the connection information to the information processing apparatus. The information processing apparatus may use the connection information to establish communication with the connection target apparatus via another communication path.

Abstract: A protective element is provided that is applicable to reflow soldering and ensuring good responsiveness of electric current interruption operation even in a case where a solder to be used has a liquid-phase point or a solid-phase point higher than a mounting temperature. The protective element includes an elastic member firmly adhered through a solder to second conductor layers and current-carrying electrode terminals formed on a prescribed substrate in such a manner to divide a current-carrying path in plural to form an electric current interruption portion. The solder has a liquid-phase point higher than a mounting temperature at which the protective element is mounted to a protection target device.

Abstract: A communication device has a first communication section that supports a first communication mode having a low communication rate and a second communication section that supports a second communication mode having a higher communication rate than the first communication mode. The communication device includes a packet generation section and a communication control section. The packet generation section generates a first portion containing authentication information used for connection authentication for the second communication mode and a second portion other than the first portion. The communication control section performs control to cause the first communication section to transmit the first portion and to cause the second communication section to transmit the second portion after the connection authentication succeeds using the authentication information contained in the first portion.

Abstract: An object of the present invention is to provide a niobium monoxide able to realize large capacitance in a miniature sized capacitor. The invention relates to a niobium monoxide having a porous structure comprising particles, characterized in that the niobium monoxide has a full-width at half maximum of an X-ray diffraction peak corresponding to a (111) plane or an X-ray diffraction peak corresponding to a (200) plane of 0.21° to 1.0°. The niobium monoxide has a large specific surface area and porosity, and is especially suitable for use in a capacitor.

Abstract: A communication device has a first communication section that supports a first communication mode having a low communication rate and a second communication section that supports a second communication mode having a higher communication rate than the first communication mode. The communication device includes a packet generation section and a communication control section. The packet generation section generates a first portion containing authentication information used for connection authentication for the second communication mode and a second portion other than the first portion. The communication control section performs control to cause the first communication section to transmit the first portion and to cause the second communication section to transmit the second portion after the connection authentication succeeds using the authentication information contained in the first portion.

Abstract: In one example embodiment, the communication system disclosed herein includes an information processing apparatus that acquires address information from a memory device having a free area including the address information and a secure area including account information. The information processing apparatus connects to a resource of a server using the acquired address information. The information processing apparatus causes a security server to acquire the account information from the memory device and transmit the acquired account information to the server such that the server enables a user to access the resource of the server using the account information.

Abstract: In order to improve reliability by preventing an edge breakdown in a semiconductor photodetector having a mesa structure such as a mesa APD, the semiconductor photodetector comprises a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, the mesa structure including a light absorbing layer for absorbing light, an electric field buffer layer for dropping an electric field intensity, an avalanche multiplication layer for causing avalanche multiplication to occur, and a second semiconductor layer of the second conduction type, wherein the thickness of the avalanche multiplication layer at the portion in the vicinity of the side face of the mesa structure is made thinner than the thickness at the central portion of the mesa structure.

Abstract: A double-stick adhesive tape (10) for fixing a wig (100) to a head, of which the surface of at least one side (12) of both sides of adhesive layers (12, 13) on a core material (11) is deglossed by forming minute concavity and convexity (12a), one side of adhesive layer (12) is formed to have a thickness to bury at least more than half of a wire diameter of the filament (103) used as a net member of a wig base (101), thereby one side of adhesive layer (12) is set inside of a network (104) of the net member, and bonded to the net member, a filament (103) is peripherally bonded with the adhesive layer (12) and the other adhesive layer (13) is bonded to the head.

Abstract: Provided is a communication device including a first communication unit that is capable of sending a polling-signal in a specific polling cycle and receiving a response-signal sent from a counterpart device in response to the polling-signal, based on a first scheme, a second communication unit that is capable of sending a polling-signal in a longer polling cycle than the first communication unit and receiving a response-signal sent from the counterpart device in response to the polling-signal, based on a second scheme, and a scheme determination unit that waits for reception of the response-signal by the second or the first communication unit for a specific period of time longer than the polling cycle of the second communication unit with a time of the response-signal being received by the first or the second communication unit as a reference, and determines a scheme usable by the counterpart device based on the reception result.

Abstract: In order to improve reliability by preventing edge breakdown in a semiconductor photodetector having a mesa structure such as a mesa APD, the semiconductor photodetector includes a mesa structure formed on a first semiconductor layer of the first conduction type formed on a semiconductor substrate, the mesa structure including a light absorbing layer for absorbing light, an electric field buffer layer for dropping an electric field intensity, an avalanche multiplication layer for causing avalanche multiplication to occur, and a second semiconductor layer of the second conduction type, wherein the thickness of the avalanche multiplication layer at the portion in the vicinity of the side face of the mesa structure is made thinner than the thickness at the central portion of the mesa structure.

Abstract: A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power, amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member.

Abstract: An optical functional device-mounted module and a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.

Abstract: A communication method includes: a first transmission step of transmitting first setting information and first network organization information regarding one information processing apparatus of a second network via a first communication path; a first determination step of determining a role of communication with a first master apparatus via a second communication path on the basis of the first network organization information and role adjustment information; a second transmission step of transmitting second setting information and second network organization information to the first master apparatus via the first communication path; a second determination step of determining a role of the communication with a second master apparatus via the second communication path on the basis of the second network organization information and role adjustment information by the first master apparatus; and a first communication start step of starting the communication via the second communication path with another informatio

Abstract: An object of the present invention is to provide a niobium monoxide able to realize large capacitance in a miniature sized capacitor. The invention relates to a niobium monoxide having a porous structure comprising particles, characterized in that the niobium monoxide has a full-width at half maximum of an X-ray diffraction peak corresponding to a (111) plane or an X-ray diffraction peak corresponding to a (200) plane of 0.21° to 1.0°. The niobium monoxide has a large specific surface area and porosity, and is especially suitable for use in a capacitor.

Abstract: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.

Abstract: An optical semiconductor module with a light receiving element with an upper and side light receiving face and a light emitting element mounted on the same mounting carrier. The light receiving element has a light receiving face on an upper face and a side face covered with an antireflection film. The mounting unit has the light emitting element and the light receiving element mounted so that they encompass a positional relationship that the light emitted from the light emitting element is optically connected at least on the light receiving face of the side face of the light receiving element.

Abstract: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.

Abstract: A semiconductor photo detecting element includes a PIN-type photo detecting element and window semiconductor layer. The PIN-type photo detecting element has a semiconductor substrate, a first semiconductor layer, a second semiconductor layer and a third semiconductor layer. The first semiconductor layer is provided on the semiconductor substrate, is lattice-matched to the semiconductor substrate, includes a first conductivity type dopant, and has first band gap energy. The second semiconductor layer is provided on the first semiconductor layer, has the first band gap energy, and has a concentration of the first conductivity type dopant lower than that of the first semiconductor layer or is substantially undoped. The third semiconductor layer is provided on the second semiconductor layer. The window semiconductor layer has second band gap energy larger than the first band gap energy at a light-incoming side with respect to the second semiconductor layer and has a thickness of 5 nm to 50 nm.

Abstract: The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin.