Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: There is provided a reticle chuck cleaner A for cleaning a reticle chuck of an apparatus, as a reticle chuck cleaner that allows easy cleaning of a reticle chuck in a vacuum chamber of an apparatus without exposing the chamber to the atmosphere and contributes to improvement of the operating ratio of the apparatus, including: an adhesive layer 1 to be adhered to a chuck region of the reticle chuck; a support layer 2 laminated on the adhesive layer 1; and a substrate 3 having a shape capable of being carried to the reticle chuck, the support layer 2 and the substrate 3 being partially bonded together in an adhesive region 41 of a partial adhesive layer 4.

Abstract: According to one embodiment, an electrostatic chuck cleaner cleaning an adsorption face of an electrostatic chuck capable of attracting a reticle, and the cleaner includes: a plurality of substrates; adhesive layers provided on a major surface of each of the substrates, the adhesive layers being pressed against the adsorption face; and conductive layers provided on the major surface of each of the substrates, and the conductive layers being provided in a region other than a region where the adhesive layer being provided. The adhesive layers provided on the major surface of each of the substrates are disposed in different regions, and the entire adsorption face is pressed by the adhesive layers when the adhesive layers of the substrates are pressed against the adsorption face.

Abstract: According to one embodiment, a mask cleaner includes a cleaner support casing having a major surface with a recess formed therein, another major surface, and a gas supply hole and a gas exhaust hole extending through the cleaner support casing between the another major surface and the recess, a sticky layer support board attached to the cleaner support casing to block an opening of the recess of the cleaner support casing, and a sticky layer attached to a surface of the sticky layer support board remote from the cleaner support casing.

Abstract: According to one embodiment, an electrostatic chuck cleaner cleaning an adsorption face of an electrostatic chuck capable of attracting a reticle, and the cleaner includes: a plurality of substrates; adhesive layers provided on a major surface of each of the substrates, the adhesive layers being pressed against the adsorption face; and conductive layers provided on the major surface of each of the substrates, and the conductive layers being provided in a region other than a region where the adhesive layer being provided. The adhesive layers provided on the major surface of each of the substrates are disposed in different regions, and the entire adsorption face is pressed by the adhesive layers when the adhesive layers of the substrates are pressed against the adsorption face.

Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: There is provided a reticle chuck cleaner A for cleaning a reticle chuck of an apparatus, as a reticle chuck cleaner that allows easy cleaning of a reticle chuck in a vacuum chamber of an apparatus without exposing the chamber to the atmosphere and contributes to improvement of the operating ratio of the apparatus, including: an adhesive layer 1 to be adhered to a chuck region of the reticle chuck; a support layer 2 laminated on the adhesive layer 1; and a substrate 3 having a shape capable of being carried to the reticle chuck, the support layer 2 and the substrate 3 being partially bonded together in an adhesive region 41 of a partial adhesive layer 4.

Abstract: According to one embodiment, a mask cleaner includes a cleaner support casing having a major surface with a recess formed therein, another major surface, and a gas supply hole and a gas exhaust hole extending through the cleaner support casing between the another major surface and the recess, a sticky layer support board attached to the cleaner support casing to block an opening of the recess of the cleaner support casing, and a sticky layer attached to a surface of the sticky layer support board remote from the cleaner support casing.

Abstract: According to one embodiment, a method for manufacturing a template for imprinting includes preparing a first template having a device pattern and a plurality of identification patterns, and forming a second template by transferring the device pattern and at lest desired one of the identification patterns to a template substrate.

Abstract: In one embodiment, a patterning method is disclosed. The method includes applying an uncured imprint material containing a first curing agent and a second curing agent onto a substrate. The method includes pressing a template against the imprint material. The method includes reacting the first curing agent with the template pressed against the imprint material. The method includes stripping the template from the imprint material. In addition, the method includes reacting the second curing agent.

Abstract: A sealant-attached template includes a template, a sealing substrate, and a sealing resin. The template has a major surface and a pattern including at least one of a depression and a protrusion provided on the major surface. The sealing substrate is provided opposite to the pattern of the template. The sealing resin is provided between the major surface and the sealing substrate.

Abstract: According to one embodiment, an imprint-lithography template comprises: a second substrate; a first photo-curable resin provided on a main surface of the first substrate and having a first concave-convex pattern; and a second photo-curable resin provided on the main surface of the first substrate, having a second concave-convex pattern different in pattern density from the first concave-convex pattern, and having optical transmittance different from that of the first photo-curable resin.

Abstract: According to one embodiment, a template includes a pattern part which is provided on a substrate and corresponds to a pattern of a semiconductor device, the pattern of the semiconductor device being to be transferred to a wafer, and an alignment mark part which is provided on the substrate, used for positioning of the substrate with respect to the wafer. The alignment mark part has a refractive index that is higher than a refractive index of the substrate.

Abstract: According to one embodiment, a method for manufacturing a template for imprinting includes preparing a first template having a device pattern and a plurality of identification patterns, and forming a second template by transferring the device pattern and at lest desired one of the identification patterns to a template substrate.

Abstract: In one embodiment, a patterning method is disclosed. The method includes applying an uncured imprint material containing a first curing agent and a second curing agent onto a substrate. The method includes pressing a template against the imprint material. The method includes reacting the first curing agent with the template pressed against the imprint material. The method includes stripping the template from the imprint material. In addition, the method includes reacting the second curing agent.

Abstract: A method for manufacturing a semiconductor apparatus, includes: supplying a first imprint material onto a dicing region surrounding each chip of a semiconductor wafer; bringing a first template having a frame-like configuration into contact with the first imprint material and curing the first imprint material; peeling the first template from the first imprint material to form a first pattern in the first imprint material after the curing of the first imprint material; supplying a second imprint material onto a chip region of the semiconductor wafer on an inner side of the first pattern; bringing a second template into contact with the second imprint material and curing the second imprint material; peeling the second template from the second imprint material to form a second pattern in the second imprint material after the curing of the second imprint material; etching the semiconductor wafer, the first imprint material having the first pattern and the second imprint material having the second pattern being us

Abstract: An electronic device test apparatus includes a plurality of testers on which are mounted test heads that are connected to test outputters for outputting test signals to the electronic devices and for receiving response signals from the electronic devices. A loading transporter is provided at a frontmost stage of the testers that transports the electronic devices from a previous process conveyance medium to a test tray before loading the electronic devices into the testers. An unloading transporter is provided at a rearmost stage of the testers that unloads the electronic devices from the test tray to a later process conveyance medium corresponding to the response signals. A transporter is provided between the testers that transports the test tray from a previous process tester to a later process tester. The transporter includes a buffer that holds test trays to absorb a waiting time due to differences in processing capacities between test trays.

Abstract: An electronic device test apparatus used for bringing the ICs into electrical contact with contact parts of the test head in the state where the ICs are held on a test tray and running tests on the electrical characteristics of ICs, the electronic device test apparatus including an inversion system for rotating the test tray which holds a plurality of ICs in a direction dropping ICs which are insufficiently held at least once before testing.