Patents by Inventor Yoshiki Endo
Yoshiki Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160108771Abstract: When a lock demand of a camshaft phase occurs, a control mode of a hydraulic control valve s switched to a locking mode after an actual camshaft phase is controlled to a lock phase, and a lock pin (an inner pin and an outer pin) is moved to a lock position. Thus, the camshaft phase is locked at the lock phase, and a timing advance chamber and a timing retard chamber are made a state of communicating with each other through a back space. In this state, a locking time filling control is executed. In the locking time filling control, the control mode of a hydraulic control valve is switched to a filling mode, the hydraulic oil is supplied to a timing advance chamber, both of the timing advance chamber and the timing retard chamber are filled with the hydraulic oil, the back space is filled with the hydraulic oil, and thereafter the control mode of the hydraulic control valve is returned to the locking mode.Type: ApplicationFiled: October 15, 2015Publication date: April 21, 2016Inventors: Shuhei OE, Shota TODA, Yoshiki ENDO, Yuu YOKOYAMA, Toshiki FUJIYOSHI
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Patent number: 9175583Abstract: When a start-up failure occurs wherein an internal combustion engine equipped with a variable valve device does not transition to complete combustion before a first prescribed period ? elapses from the start of cranking in conjunction with fuel injection, a control unit for the internal combustion engine executes a start-up failure process addressing a state wherein the valve timing is different from a specific timing.Type: GrantFiled: January 20, 2011Date of Patent: November 3, 2015Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Toshio Imamura, Yoshiaki Miyazato, Yuu Yokoyama, Masaki Numakura, Yoshiki Endo
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Patent number: 9006881Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.Type: GrantFiled: September 5, 2013Date of Patent: April 14, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Fukuyoshi, Junichi Nakao, Yoshiki Endo, Eitaro Miyake
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Publication number: 20140284786Abstract: An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material.Type: ApplicationFiled: September 5, 2013Publication date: September 25, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Hiroshi Fukuyoshi, Junichi Nakao, Yoshiki Endo, Eitaro Miyake
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Publication number: 20130291835Abstract: When a start-up failure occurs wherein an internal combustion engine equipped with a variable valve device does not transition to complete combustion before a first prescribed period ? elapses from the start of cranking in conjunction with fuel injection, a control unit for the internal combustion engine executes a start-up failure process addressing a state wherein the valve timing is different from a specific timing.Type: ApplicationFiled: January 20, 2011Publication date: November 7, 2013Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Toshio Imamura, Yoshiaki Miyazato, Yuu Yokoyama, Masaki Numakura, Yoshiki Endo
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Patent number: 8554455Abstract: An IIS system that performs control related to intermittent stopping of engine operation by idling stop control is applied to an internal combustion engine including a VVT mechanism that makes the valve timing of an engine valve variable and has an intermediate lock mechanism that mechanically locks the valve timing at an intermediate lock position between a most retarded position and a most advanced position. The IIS system is configured to inhibit the engine operation from being intermittently stopped at the occurrence of a failure of the VVT mechanism to avoid the internal combustion engine from being prevented from being restarted after the intermittent stop depending on the occurrence of the failure of the VVT mechanism.Type: GrantFiled: August 25, 2010Date of Patent: October 8, 2013Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yoshiaki Miyazato, Toshio Imamura, Yuu Yokoyama, Satoshi Yoshi, Yoshiki Endo, Yuu Ueda, Hiroyuki Ishii
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Publication number: 20130152887Abstract: An IIS system that performs control related to intermittent stopping of engine operation by idling stop control is applied to an internal combustion engine including a VVT mechanism that makes the valve timing of an engine valve variable and has an intermediate lock mechanism that mechanically locks the valve timing at an intermediate lock position between a most retarded position and a most advanced position. The IIS system is configured to inhibit the engine operation from being intermittently stopped at the occurrence of a failure of the VVT mechanism to avoid the internal combustion engine from being prevented from being restarted after the intermittent stop depending on the occurrence of the failure of the VVT mechanism.Type: ApplicationFiled: August 25, 2010Publication date: June 20, 2013Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshiaki Miyazato, Toshio Imamura, Yuu Yokoyama, Satoshi Yoshi, Yoshiki Endo, Yuu Ueda, Hiroyuki Ishii
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Patent number: 7633153Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: GrantFiled: July 16, 2007Date of Patent: December 15, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Patent number: 7514783Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: GrantFiled: August 31, 2005Date of Patent: April 7, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Patent number: 7329903Abstract: For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface.Type: GrantFiled: March 8, 2006Date of Patent: February 12, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Koichi Nitta, Takafumi Nakamura, Kuniaki Konno, Yasuhiko Akaike, Yoshiki Endo, Katsufumi Kondo
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Publication number: 20070257708Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: July 16, 2007Publication date: November 8, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20070257376Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: July 16, 2007Publication date: November 8, 2007Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20060151798Abstract: For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface.Type: ApplicationFiled: March 9, 2006Publication date: July 13, 2006Inventors: Koichi Nitta, Takafumi Nakamura, Kuniaki Konno, Yasuhiko Akaike, Yoshiki Endo, Katsufumi Kondo
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Publication number: 20060145171Abstract: For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface.Type: ApplicationFiled: March 8, 2006Publication date: July 6, 2006Inventors: Koichi Nitta, Takafumi Nakamura, Kuniaki Konno, Yasuhiko Akaike, Yoshiki Endo, Katsufumi Kondo
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Patent number: 7038245Abstract: For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface.Type: GrantFiled: March 13, 2003Date of Patent: May 2, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Koichi Nitta, Takafumi Nakamura, Kuniaki Konno, Yasuhiko Akaike, Yoshiki Endo, Katsufumi Kondo
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Publication number: 20060055432Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.Type: ApplicationFiled: August 31, 2005Publication date: March 16, 2006Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuo Shimokawa, Takashi Koyanagawa, Masako Ooishi, Tatsuya Yamada, Osamu Usuda, Yoshiki Endo, Taiki Miura, Masaki Toyoshima, Ichiro Omura, Akio Nakagawa, Kenichi Matsushita, Yusuke Kawaguchi, Haruki Arai, Hiroshi Takei, Tomohiro Kawano, Noriaki Yoshikawa, Morio Takahashi, Yasuhito Saito, Masahiro Urase
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Publication number: 20030197191Abstract: For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface.Type: ApplicationFiled: March 13, 2003Publication date: October 23, 2003Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Koichi Nitta, Takafumi Nakamura, Kuniaki Konno, Yasuhiko Akaike, Yoshiki Endo, Katsufumi Kondo
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Patent number: 6548890Abstract: A press-contact type semiconductor device comprises: a plurality of semiconductor elements each of which has a first main electrode and a control electrode and a second main electrode; a second common main power source plate having the semiconductor elements positioned on a front surface thereof and electrically connected to the second main electrodes; a first common main power source plate arranged on the front surfaces of the semiconductor elements and electrically connected to the first main electrodes; a common control signal/main current plate arranged between semiconductor elements and including at least control signal wiring layers and main current wiring layers; conductive connectors for electrically connecting at least the main current wiring layers and the first common maim power source plate; and conductive elastic members for electrically connecting the main current wiring layers or the first common main power source plate to the conductive connectors by elasticity.Type: GrantFiled: January 22, 2002Date of Patent: April 15, 2003Assignee: Kabushiki Kaisha ToshibaInventors: Eitaro Miyake, Yoshiki Endo, Ichiro Omura, Tomokazu Domon
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Patent number: D508682Type: GrantFiled: May 27, 2004Date of Patent: August 23, 2005Assignee: Kabushiki Kaisha ToshibaInventors: Tatsuya Yamada, Kazuhiko Kurahashi, Toshihisa Inoue, Taizo Tomioka, Kazuo Shimokawa, Yoshiki Endo, Masahiro Urase, Osamu Usuda
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Patent number: D521952Type: GrantFiled: May 27, 2004Date of Patent: May 30, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Tatsuya Yamada, Kazuhiko Kurahashi, Toshihisa Inoue, Taizo Tomioka, Kazuo Shimokawa, Yoshiki Endo, Masahiro Urase, Osamu Usuda