Abstract: Provided is a layout structure capable of reducing the parasitic capacitance between storage nodes of an SRAM cell using vertical nanowire (VNW) FETs. In the SRAM cell, a first storage node is connected to top electrodes of some transistors, and a second storage node is connected to bottom electrodes of other transistors. Accordingly, the first and second storage nodes have fewer regions adjacent to each other in a single layer.

Abstract: Nanosheets 21 to 24 are formed in line in this order in the X direction, and nanosheets 25 to 28 are formed in line in this order in the X direction. Faces of the nanosheets 21, 23, 25, and 27 on the first side in the X direction are exposed from gate interconnects 30, 33, 35, and 36, respectively. Faces of the nanosheets 22, 24, 26, and 28 on the second side in the X direction are exposed from gate interconnects 33, 34, 36, and 39, respectively.

Abstract: A memory cell of a 2-port static random access memory (SRAM) includes first and second p-type transistors and first to sixth n-type transistors. Gate interconnects extend in the X direction and are arranged in three rows in the Y direction. The gate interconnects in the first row form gates of the first n-type transistor, the first p-type transistor, and the fourth n-type transistor, the gate interconnect in the second row forms gates of the fifth and sixth n-type transistors, and the gate interconnects in the third row form gates of the third n-type transistor, the second n-type transistor, and the second p-type transistor.

Abstract: Static Random Access Memory (SRAM) cell using Complementary FET (CFET) includes the first to sixth transistors each of which is a three-dimensional transistor. The first to fourth transistors are formed at the same position as each other in the first direction in which channel portions of the first to sixth transistors extend. The fifth transistor having a node connected to the first bit line and the sixth transistor having a node connected to the second bit line are formed at the same position in the first direction as each other.

Abstract: A memory cell of a 2-port static random access memory (SRAM) includes first and second p-type transistors and first to sixth n-type transistors. Gate interconnects extend in the X direction and are arranged in three rows in the Y direction. The gate interconnects in the first row form gates of the first n-type transistor, the first p-type transistor, and the fourth n-type transistor, the gate interconnect in the second row forms gates of the fifth and sixth n-type transistors, and the gate interconnects in the third row form gates of the third n-type transistor, the second n-type transistor, and the second p-type transistor.

Abstract: First and second memory cell arrays each having memory cells arranged in the X and Y directions lie side by side in the Y direction with space between them. A relay buffer is provided between first and second row decoders for buffering a control signal to be supplied to the second row decoder. An inter-array block between the first and second memory cell arrays is constituted by at least either a tap cell or a dummy memory cell. The relay buffer and the inter-array block are the same in position and size in the Y direction.

Abstract: A semiconductor storage circuit has: a plurality of first memory cells and a first precharge transistor connected to a first local read bit line; and a plurality of second memory cells and a second precharge transistor connected to a second local read bit line. A signal responsive to signals output to the first and second local read bit lines is output to a global read bit line via a gate circuit and an output circuit. A first transistor having a gate connected to the output of the gate circuit is provided between the first and second local read bit lines.

Abstract: Provided is a layout structure capable of reducing the parasitic capacitance between storage nodes of an SRAM cell using vertical nanowire (VNW) FETs. In the SRAM cell, a first storage node is connected to top electrodes of some transistors, and a second storage node is connected to bottom electrodes of other transistors. Accordingly, the first and second storage nodes have fewer regions adjacent to each other in a single layer.

Abstract: First and second memory cell arrays each having memory cells arranged in the X and Y directions lie side by side in the Y direction with space between them. A relay buffer is provided between first and second row decoders for buffering a control signal to be supplied to the second row decoder. An inter-array block between the first and second memory cell arrays is constituted by at least either a tap cell or a dummy memory cell. The relay buffer and the inter-array block are the same in position and size in the Y direction.

Abstract: In a semiconductor memory device, a memory cell array includes a plurality of memory cells. A write circuit includes a negative potential generating circuit that generates a potential lower than a lower power supply potential applied to the memory cells. When a write mask signal indicates an enabled state, the write circuit activates the negative potential generating circuit, and supplies the potential generated by the negative potential generating circuit to a bit line to be supplied with low data. On the other hand, when the write mask signal indicates a disabled state, the write circuit supplies no data to bit line pairs, and inactivates the negative potential generating circuit.

Abstract: A semiconductor storage circuit has: a plurality of first memory cells and a first precharge transistor connected to a first local read bit line; and a plurality of second memory cells and a second precharge transistor connected to a second local read bit line. A signal responsive to signals output to the first and second local read bit lines is output to a global read bit line via a gate circuit and an output circuit. A first transistor having a gate connected to the output of the gate circuit is provided between the first and second local read bit lines.

Abstract: In a semiconductor memory device, a memory cell array includes a plurality of memory cells. A write circuit includes a negative potential generating circuit that generates a potential lower than a lower power supply potential applied to the memory cells. When a write mask signal indicates an enabled state, the write circuit activates the negative potential generating circuit, and supplies the potential generated by the negative potential generating circuit to a bit line to be supplied with low data. On the other hand, when the write mask signal indicates a disabled state, the write circuit supplies no data to bit line pairs, and inactivates the negative potential generating circuit.

Abstract: Disclosed herein is a driver circuit including a first group of transistors provided between first and second nodes and including n of the transistor(s) where n is equal to or greater than one, and a second group of transistors provided in parallel with the first group of transistors and including m of the transistor(s) where m is equal to or greater than one and not equal to n, the m transistors being connected together in series. The n-channel transistor in the first group and at least one of the two n-channel transistors in the second group have their gate connected to an input node.

Abstract: Disclosed herein is a driver circuit including a first group of transistors provided between first and second nodes and including n of the transistor(s) where n is equal to or greater than one, and a second group of transistors provided in parallel with the first group of transistors and including m of the transistor(s) where m is equal to or greater than one and not equal to n, the m transistors being connected together in series. The n-channel transistor in the first group and at least one of the two n-channel transistors in the second group have their gate connected to an input node.

Abstract: Disclosed herein is a driver circuit including a first group of transistors provided between first and second nodes and including n of the transistor(s) where n is equal to or greater than one, and a second group of transistors provided in parallel with the first group of transistors and including m of the transistor(s) where m is equal to or greater than one and not equal to n, the m transistors being connected together in series. The n-channel transistor in the first group and at least one of the two n-channel transistors in the second group have their gate connected to an input node.

Abstract: A cross-coupled circuit provided between first and second bit lines that form a bit line pair includes first to fourth fin transistors of p-channel type. The first transistor has its source connected to a first power supply and its gate connected to the second bit line. The second transistor has its source connected to the first power supply and its gate connected to the first bit line. The third transistor has its source connected to the first transistor's drain and its drain connected to the first bit line. The fourth transistor has its source connected to the second transistor's drain and its drain connected to the second bit line.

Abstract: Disclosed herein is a driver circuit including a first group of transistors provided between first and second nodes and including n of the transistor(s) where n is equal to or greater than one, and a second group of transistors provided in parallel with the first group of transistors and including m of the transistor(s) where m is equal to or greater than one and not equal to n, the m transistors being connected together in series. The n-channel transistor in the first group and at least one of the two n-channel transistors in the second group have their gate connected to an input node.

Abstract: A cross-coupled circuit provided between first and second bit lines that form a bit line pair includes first to fourth fin transistors of p-channel type. The first transistor has its source connected to a first power supply and its gate connected to the second bit line. The second transistor has its source connected to the first power supply and its gate connected to the first bit line. The third transistor has its source connected to the first transistor's drain and its drain connected to the first bit line. The fourth transistor has its source connected to the second transistor's drain and its drain connected to the second bit line.

Abstract: A memory cell power supply circuit for each column includes a first PMOS transistor and a second PMOS transistor connected together in series between a first power supply and a second power supply. A connection point between the first and second PMOS transistors is output as a memory cell power supply. A control signal which is based on a column select signal and a write control signal is input to a gate terminal of the first PMOS transistor. A signal which is an inverted version of the signal input to the gate terminal of the first PMOS transistor is input to a gate terminal of the second PMOS transistor.

Abstract: A semiconductor memory device includes a memory cell connected to a word line and a bit line, for storing and holding data, a word line driver circuit connected to the word line, a bit line precharge circuit connected to the bit line, and a peripheral control circuit. First power supply VDD is connected to the memory cell and the peripheral control circuit, and first power supply VDD is connected to word line driver circuit and bit line precharge circuit through switching element controlled by first control signal PD.