Patents by Inventor Yoshinori Abe

Yoshinori Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160119167
    Abstract: A CFR estimation unit (13) estimates channel frequency characteristic on the basis of a complex baseband (CBB) signal provided by a front end (2#b) via a data distribution unit (11), and a transmission symbol estimated value (dfin) provided by a trellis decoder (8). On the basis of the channel frequency characteristics estimated in this manner, a carrier frequency control unit (15) performs a carrier recovery control in order to become the carrier frequency error to 0 in the front end (2#b), by performing an Auto Frequency Control (AFC) based on changes in the channel phase in the full band of the frequency. As a result, it is possible to perform carrier synchronization appropriate for mobile receiving, and to improve receiving performance, even in the case of a digitally modulated signal having a DC pilot component by a single carrier.
    Type: Application
    Filed: May 21, 2013
    Publication date: April 28, 2016
    Applicant: PIONEER CORPORATION
    Inventor: Yoshinori ABE
  • Publication number: 20160112218
    Abstract: A sum of products calculation of a predetermined tap number of tap data and a prescribed tap number of coefficients is carried out and a sum of the predetermined number of tap data is calculated. A replica signal is calculated on the basis of the sum of products calculation result, the sum of the tap data, and a correction coefficient. A residual signal is calculated as the difference between the replica and received signals. The predetermined tap number of coefficients is updated based on the predetermined tap number of tap data and the residual signal, and the correction coefficient calculated from the residual signal. Here, the tap data is either a data symbol before the superimposition of a DC component or an estimation thereof. This allows an adaptive FIR filter used in channel estimation of a received signal by a digitally modulated wave whereupon a DC component is superimposed.
    Type: Application
    Filed: June 6, 2013
    Publication date: April 21, 2016
    Inventor: Yoshinori ABE
  • Patent number: 9318749
    Abstract: A catalyst carrier production process includes a step (a) of mixing a transition metal compound (1), a nitrogen-containing organic compound (2), and a solvent to provide a catalyst carrier precursor solution; a step (b) of removing the solvent from the catalyst carrier precursor solution; and a step (c) of the thermally treating a solid residue obtained in the step (b) at a temperature of 500 to 1100° C. to provide a catalyst carrier; wherein the transition metal compound (1) is partly or wholly a compound including a transition metal element (M1) selected from the group 4 and 5 elements of the periodic table as a transition metal element; and at least one of the transition metal compound (1) and the nitrogen-containing organic compound (2) includes an oxygen atom.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: April 19, 2016
    Assignee: SHOWA DENKO K.K.
    Inventors: Masaki Horikita, Kunchan Lee, Ryuji Monden, Chunfu Yu, Yasuaki Wakizaka, Takashi Sato, Yoshinori Abe
  • Publication number: 20150372745
    Abstract: An RSS calculation unit (12) calculates a received signal spectrum on the basis of a CBB signal sent from a frontend (2#b). A CFR estimation unit (13) calculates an estimated transmission path characteristic and a residual signal on the basis of the CBB signal and estimated transmitted symbols estimated by a trellis decoder (8). Further, an NPS estimation unit (14) calculates an estimated noise power spectrum on the basis of the residual signal calculated by the CFR estimation unit (13). A combination unit (4) combines a plurality of received signal spectrums on the basis of the received signal spectrum, estimated transmission path characteristic and estimated noise power spectrum calculated as described above. An equalization unit (5) performs equalization of the combination result, thereby calculating an equalized spectrum. As a result, a receiver of which the frequency selectivity noise resistance property is high can be achieved on a small calculation scale.
    Type: Application
    Filed: February 8, 2013
    Publication date: December 24, 2015
    Inventor: Yoshinori ABE
  • Publication number: 20150299451
    Abstract: To provide: a multilayer sheet and the like, which can provide a molded multilayer article that has excellent appearance and the like, while exhibiting excellent wear resistance and the like; a molded multilayer article using the multilayer sheet and the like; and a method for producing a molded multilayer article. A photocurable resin composition for surface protective layers of multilayer sheets, which contains (A) a thermoplastic resin that has a radically polymerizable unsaturated group in a side chain, (B) a high molecular weight hindered amine light stabilizer that has a number average molecular weight of 1,000 to 50,000 and (C) a photo-polymerization initiator.
    Type: Application
    Filed: September 20, 2013
    Publication date: October 22, 2015
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Yoshiaki SATOU, Yoshinori ABE, Noriko FUJIMOTO
  • Patent number: 9138507
    Abstract: A method for manufacturing an implant material includes preparing a base material for implant, removing moisture from a chamber in which the base material is placed, and introducing material gas as a carbon source and a silicon source into the chamber after the removal of the moisture to form a carbon thin film containing a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded on a surface of the base material by ionized deposition.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: September 22, 2015
    Assignee: TOYO ADVANCED TECHNOLOGIES CO., LTD.
    Inventors: Hiroki Nikawa, Seichiyou Makihira, Yuichi Mine, Yoshinori Abe, Tatsuyuki Nakatani, Keishi Okamoto, Yuki Nitta
  • Publication number: 20150064339
    Abstract: A method for manufacturing an implant material includes preparing a base material for implant, removing moisture from a chamber in which the base material is placed, and introducing material gas as a carbon source and a silicon source into the chamber after the removal of the moisture to form a carbon thin film containing a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded on a surface of the base material by ionized deposition.
    Type: Application
    Filed: November 11, 2014
    Publication date: March 5, 2015
    Inventors: Hiroki Nikawa, Seichiyou Makihira, Yuichi Mine, Yoshinori Abe, Tatsuyuki Nakatani, Keishi Okamoto, Yuki Nitta
  • Publication number: 20140342162
    Abstract: A transparent laminated film is described, which has excellent chemical resistance and surface hardness, is glossy even after heating and which has a low haze value, and a laminated molded article that uses the film.
    Type: Application
    Filed: September 12, 2012
    Publication date: November 20, 2014
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Koichiro Sanefuji, Yuhei Konokawa, Yoshinori Abe
  • Patent number: 8877612
    Abstract: In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: November 4, 2014
    Assignee: Toyoda Gosei Co., Ltd.
    Inventor: Yoshinori Abe
  • Patent number: 8703582
    Abstract: An element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) is sequentially irradiated with a laser beam (64) having a first output from a substrate back surface (11b) side in the y direction, and the laser beam (64) is sequentially collected to a part having a first depth D1 from the substrate back surface (11b), thereby forming a first modified region L1. The substrate (20) having the first modified region L1 formed therein is sequentially irradiated with the laser beam (64) having a third output (<the first output) from the substrate back surface 11b side in the y direction, and the laser beam (64) is sequentially collected to a part having a third depth D3 from the substrate back surface (11b) shallower than the first depth D1, thereby forming a third modified region L3.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: April 22, 2014
    Assignee: Toyoda Gosei Co., Ltd.
    Inventor: Yoshinori Abe
  • Patent number: 8642159
    Abstract: Provided is a film having high crystallinity, transparency, and surface smoothness, a lamination of the film, a sheet of the film, and a laminated body. A film contains vinylidene fluoride-based resin (A) and acrylic-based resin (B). The film has at least one surface with arithmetic mean roughness of 0.1 to 20 nm. The at least one surface has crystal fusion heat of 18 to 40 J/g and a haze value of 3.5 or less, the crystal fusion heat being measured using a differential scanning calorimeter.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: February 4, 2014
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Yuhei Konokawa, Yoshinori Abe
  • Publication number: 20130302715
    Abstract: A catalyst carrier production process includes a step (a) of mixing a transition metal compound (1), a nitrogen-containing organic compound (2), and a solvent to provide a catalyst carrier precursor solution; a step (b) of removing the solvent from the catalyst carrier precursor solution; and a step (c) of thermally treating a solid residue obtained in the step (b) at a temperature of 500 to 1100° C. to provide a catalyst carrier; wherein the transition metal compound (1) is partly or wholly a compound including a transition metal element (M1) selected from the group 4 and 5 elements of the periodic table as a transition metal element; and at least one of the transition metal compound (1) and the nitrogen-containing organic compound (2) includes an oxygen atom.
    Type: Application
    Filed: July 19, 2013
    Publication date: November 14, 2013
    Inventors: Masaki HORIKITA, Kunchan LEE, Ryuji MONDEN, Chunfu YU, Yasuaki WAKIZAKA, Takashi SATO, Yoshinori ABE
  • Publication number: 20130202847
    Abstract: Provided is a film having high crystallinity, transparency, and surface smoothness, a lamination of the film, a sheet of the film, and a laminated body. A film contains vinylidene fluoride-based resin (A) and acrylic-based resin (B). The film has at least one surface with arithmetic mean roughness of 0.1 to 20 nm. The at least one surface has crystal fusion heat of 18 to 40 J/g and a haze value of 3.5 or less, the crystal fusion heat being measured using a differential scanning calorimeter.
    Type: Application
    Filed: May 13, 2010
    Publication date: August 8, 2013
    Applicant: MITSUBISHI RAYON CO., LTD.
    Inventors: Yuhei Konokawa, Yoshinori Abe
  • Publication number: 20130040466
    Abstract: In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.
    Type: Application
    Filed: June 3, 2011
    Publication date: February 14, 2013
    Applicant: SHOWA DENKO K.K.
    Inventor: Yoshinori Abe
  • Patent number: 8221823
    Abstract: A diamond-like carbon film (DLC film) is formed on the surface of a base material made of an inorganic material, such as ceramics, or the like, or an organic material, such as resin, or the like. The surface of the resultant DLC film is treated with plasma, or the like, so as to be activated. Various monomers having biocompatibility, etc., are graft-polymerized to the activated surface of the DLC film, whereby a polymer layer is formed from the monomers grafted to the surface of the DLC film. Thus, the base material coated with the DLC film modified with a polymer which does not readily separate can be realized.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: July 17, 2012
    Assignee: Toyo Advanced Technologies Co., Ltd.
    Inventors: Yoshinori Abe, Tatsuyuki Nakatani, Keishi Okamoto, Kohei Shiraishi, Kazuo Sugiyama
  • Patent number: 8208093
    Abstract: Plural LEDs 21 are mounted on a top surface 20a of a circuit board 20, and a circuit pattern 22 for supplying power to the LEDs 21 and metallic film islands 23 for heat radiation are provided on a back surface 20b. Further, lens 30 is provided on the top surface 20a of the circuit board 20, that is, a surface where the circuit pattern 22 and the metallic film islands 23 are not provided, so as to cover each of the LEDs 21. The lens 30 is cured after dripping a liquid resin including a silicone resin containing silica. Therefore, distortion of the cover members formed on the substrate by dripping the liquid resin is suppressed.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: June 26, 2012
    Assignee: Showa Denko K.K.
    Inventors: Kenji Shinozaki, Yoshinori Abe
  • Patent number: 8137803
    Abstract: An acrylic resin film material comprising at least a multilayer structure polymer with a particular structure prevent a molded item from being whitened during insert- or in-mold molding and meet the requirement for surface hardness, heat resistance, and transparency or matting performance for vehicle applications. It is also possible to use an acrylic resin film material exhibiting a difference of 30% or less between haze values as determined in accordance with the testing method of JIS K7136 (haze measurement method) after and before a tensile test where a test piece with a width of 20 mm is pulled under the conditions of an initial inter-chuck distance of 25 mm, a rate of 50 mm/min and a temperature of 23° C. until an end-point inter-chuck distance becomes 33 mm as well as having a pencil hardness of 2 B or higher as determined in accordance with JIS K5400.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: March 20, 2012
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Yukio Kitaike, Yoshinori Abe, Junichi Abe, Koichiro Kitashima, Shogo Okazaki, Hideyuki Fujii
  • Publication number: 20110318714
    Abstract: An implant material includes a base material, and a silicon-containing carbon thin film formed on a surface of the base material. The carbon thin film contains a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded, and a ratio of the SiC component is 0.06 or higher.
    Type: Application
    Filed: February 10, 2009
    Publication date: December 29, 2011
    Applicant: TOYO ADVANCED TECHNOLOGIES CO., LTD.
    Inventors: Hiroki Nikawa, Seichiyou Makihira, Yuichi Mine, Yoshinori Abe, Tatsuyuki Nakatani, Keishi Okamoto, Yuki Nitta
  • Publication number: 20110312193
    Abstract: Problem To prevent deterioration of electronic elements formed on a substrate, when plural modified regions are formed in the substrate by using a laser beam which have different depths in the thickness direction of the substrate. Solution An element-group formation substrate 20 having plural semiconductor light emitting elements 21 formed on a substrate front surface 11a of a substrate 11 is sequentially irradiated with a laser beam 64 having a first output from a substrate back surface 11b side of the substrate 11 in the y direction, and the laser beam 64 is sequentially collected to a part having a first depth D1 from the substrate back surface 11b, thereby forming a first modified region L1 in the substrate 11.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 22, 2011
    Applicant: SHOWA DENKO K.K.
    Inventor: Yoshinori ABE
  • Patent number: 8035125
    Abstract: The present invention provides a light-emitting apparatus capable of improving brightness and reducing power consumption and a method of manufacturing the same. The light-emitting apparatus includes: a light-emitting device 2 including electrode pads 9 and 10; and a lead frame 3 including electrode leads 11 and 12. The electrode pads 9 and 10 and the electrode leads 11 and 12 are electrically connected to each other by bonding wires 14 and 15, and the light-emitting device 2 is arranged with a gap H between the lead frame 3 and the light-emitting device 2. In this way, it is possible to effectively use light emitted from one surface of the light-emitting device 2 facing the lead frame 3. Therefore, it is possible to improve the utilization efficiency of light emitted from the light-emitting device 2.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: October 11, 2011
    Assignee: Showa Denko K.K.
    Inventor: Yoshinori Abe