Abstract: A sum of products calculation of a predetermined tap number of tap data and a prescribed tap number of coefficients is carried out and a sum of the predetermined number of tap data is calculated. A replica signal is calculated on the basis of the sum of products calculation result, the sum of the tap data, and a correction coefficient. A residual signal is calculated as the difference between the replica and received signals. The predetermined tap number of coefficients is updated based on the predetermined tap number of tap data and the residual signal, and the correction coefficient calculated from the residual signal. Here, the tap data is either a data symbol before the superimposition of a DC component or an estimation thereof. This allows an adaptive FIR filter used in channel estimation of a received signal by a digitally modulated wave whereupon a DC component is superimposed.

Abstract: A catalyst carrier production process includes a step (a) of mixing a transition metal compound (1), a nitrogen-containing organic compound (2), and a solvent to provide a catalyst carrier precursor solution; a step (b) of removing the solvent from the catalyst carrier precursor solution; and a step (c) of the thermally treating a solid residue obtained in the step (b) at a temperature of 500 to 1100° C. to provide a catalyst carrier; wherein the transition metal compound (1) is partly or wholly a compound including a transition metal element (M1) selected from the group 4 and 5 elements of the periodic table as a transition metal element; and at least one of the transition metal compound (1) and the nitrogen-containing organic compound (2) includes an oxygen atom.

Abstract: An RSS calculation unit (12) calculates a received signal spectrum on the basis of a CBB signal sent from a frontend (2#b). A CFR estimation unit (13) calculates an estimated transmission path characteristic and a residual signal on the basis of the CBB signal and estimated transmitted symbols estimated by a trellis decoder (8). Further, an NPS estimation unit (14) calculates an estimated noise power spectrum on the basis of the residual signal calculated by the CFR estimation unit (13). A combination unit (4) combines a plurality of received signal spectrums on the basis of the received signal spectrum, estimated transmission path characteristic and estimated noise power spectrum calculated as described above. An equalization unit (5) performs equalization of the combination result, thereby calculating an equalized spectrum. As a result, a receiver of which the frequency selectivity noise resistance property is high can be achieved on a small calculation scale.

Abstract: To provide: a multilayer sheet and the like, which can provide a molded multilayer article that has excellent appearance and the like, while exhibiting excellent wear resistance and the like; a molded multilayer article using the multilayer sheet and the like; and a method for producing a molded multilayer article. A photocurable resin composition for surface protective layers of multilayer sheets, which contains (A) a thermoplastic resin that has a radically polymerizable unsaturated group in a side chain, (B) a high molecular weight hindered amine light stabilizer that has a number average molecular weight of 1,000 to 50,000 and (C) a photo-polymerization initiator.

Abstract: A method for manufacturing an implant material includes preparing a base material for implant, removing moisture from a chamber in which the base material is placed, and introducing material gas as a carbon source and a silicon source into the chamber after the removal of the moisture to form a carbon thin film containing a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded on a surface of the base material by ionized deposition.

Abstract: A method for manufacturing an implant material includes preparing a base material for implant, removing moisture from a chamber in which the base material is placed, and introducing material gas as a carbon source and a silicon source into the chamber after the removal of the moisture to form a carbon thin film containing a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded on a surface of the base material by ionized deposition.

Abstract: A transparent laminated film is described, which has excellent chemical resistance and surface hardness, is glossy even after heating and which has a low haze value, and a laminated molded article that uses the film.

Abstract: In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.

Abstract: An element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) is sequentially irradiated with a laser beam (64) having a first output from a substrate back surface (11b) side in the y direction, and the laser beam (64) is sequentially collected to a part having a first depth D1 from the substrate back surface (11b), thereby forming a first modified region L1. The substrate (20) having the first modified region L1 formed therein is sequentially irradiated with the laser beam (64) having a third output (<the first output) from the substrate back surface 11b side in the y direction, and the laser beam (64) is sequentially collected to a part having a third depth D3 from the substrate back surface (11b) shallower than the first depth D1, thereby forming a third modified region L3.

Abstract: Provided is a film having high crystallinity, transparency, and surface smoothness, a lamination of the film, a sheet of the film, and a laminated body. A film contains vinylidene fluoride-based resin (A) and acrylic-based resin (B). The film has at least one surface with arithmetic mean roughness of 0.1 to 20 nm. The at least one surface has crystal fusion heat of 18 to 40 J/g and a haze value of 3.5 or less, the crystal fusion heat being measured using a differential scanning calorimeter.

Abstract: A catalyst carrier production process includes a step (a) of mixing a transition metal compound (1), a nitrogen-containing organic compound (2), and a solvent to provide a catalyst carrier precursor solution; a step (b) of removing the solvent from the catalyst carrier precursor solution; and a step (c) of thermally treating a solid residue obtained in the step (b) at a temperature of 500 to 1100° C. to provide a catalyst carrier; wherein the transition metal compound (1) is partly or wholly a compound including a transition metal element (M1) selected from the group 4 and 5 elements of the periodic table as a transition metal element; and at least one of the transition metal compound (1) and the nitrogen-containing organic compound (2) includes an oxygen atom.

Abstract: Provided is a film having high crystallinity, transparency, and surface smoothness, a lamination of the film, a sheet of the film, and a laminated body. A film contains vinylidene fluoride-based resin (A) and acrylic-based resin (B). The film has at least one surface with arithmetic mean roughness of 0.1 to 20 nm. The at least one surface has crystal fusion heat of 18 to 40 J/g and a haze value of 3.5 or less, the crystal fusion heat being measured using a differential scanning calorimeter.

Abstract: In a modified region forming step, an element-group formation substrate (20) having plural semiconductor light emitting elements (21) formed on a substrate front surface (11a) of a wafer substrate (11) is irradiated with laser light (64) from the substrate back surface (11b) of the substrate, thereby forming the following inside the substrate: first and third modified regions (L1) and (L3) oriented in a y-direction (corresponding to a first direction) that is parallel to the surfaces of the substrate; and second and fourth modified regions (L2) and (L4) oriented in an x-direction (corresponding to a second direction) that is parallel to the surfaces of the substrate and differs from the y-direction. In the step, the first modified region (L1), the second modified region (L2), the third modified region (L3) and the fourth modified region (L4) are formed at different depths from the substrate back surface of the substrate.

Abstract: A diamond-like carbon film (DLC film) is formed on the surface of a base material made of an inorganic material, such as ceramics, or the like, or an organic material, such as resin, or the like. The surface of the resultant DLC film is treated with plasma, or the like, so as to be activated. Various monomers having biocompatibility, etc., are graft-polymerized to the activated surface of the DLC film, whereby a polymer layer is formed from the monomers grafted to the surface of the DLC film. Thus, the base material coated with the DLC film modified with a polymer which does not readily separate can be realized.

Abstract: Plural LEDs 21 are mounted on a top surface 20a of a circuit board 20, and a circuit pattern 22 for supplying power to the LEDs 21 and metallic film islands 23 for heat radiation are provided on a back surface 20b. Further, lens 30 is provided on the top surface 20a of the circuit board 20, that is, a surface where the circuit pattern 22 and the metallic film islands 23 are not provided, so as to cover each of the LEDs 21. The lens 30 is cured after dripping a liquid resin including a silicone resin containing silica. Therefore, distortion of the cover members formed on the substrate by dripping the liquid resin is suppressed.

Abstract: An acrylic resin film material comprising at least a multilayer structure polymer with a particular structure prevent a molded item from being whitened during insert- or in-mold molding and meet the requirement for surface hardness, heat resistance, and transparency or matting performance for vehicle applications. It is also possible to use an acrylic resin film material exhibiting a difference of 30% or less between haze values as determined in accordance with the testing method of JIS K7136 (haze measurement method) after and before a tensile test where a test piece with a width of 20 mm is pulled under the conditions of an initial inter-chuck distance of 25 mm, a rate of 50 mm/min and a temperature of 23° C. until an end-point inter-chuck distance becomes 33 mm as well as having a pencil hardness of 2 B or higher as determined in accordance with JIS K5400.

Abstract: An implant material includes a base material, and a silicon-containing carbon thin film formed on a surface of the base material. The carbon thin film contains a C—C component in which carbon atoms are bonded, and a SiC component in which carbon and silicon atoms are bonded, and a ratio of the SiC component is 0.06 or higher.

Abstract: Problem To prevent deterioration of electronic elements formed on a substrate, when plural modified regions are formed in the substrate by using a laser beam which have different depths in the thickness direction of the substrate. Solution An element-group formation substrate 20 having plural semiconductor light emitting elements 21 formed on a substrate front surface 11a of a substrate 11 is sequentially irradiated with a laser beam 64 having a first output from a substrate back surface 11b side of the substrate 11 in the y direction, and the laser beam 64 is sequentially collected to a part having a first depth D1 from the substrate back surface 11b, thereby forming a first modified region L1 in the substrate 11.

Abstract: The present invention provides a light-emitting apparatus capable of improving brightness and reducing power consumption and a method of manufacturing the same. The light-emitting apparatus includes: a light-emitting device 2 including electrode pads 9 and 10; and a lead frame 3 including electrode leads 11 and 12. The electrode pads 9 and 10 and the electrode leads 11 and 12 are electrically connected to each other by bonding wires 14 and 15, and the light-emitting device 2 is arranged with a gap H between the lead frame 3 and the light-emitting device 2. In this way, it is possible to effectively use light emitted from one surface of the light-emitting device 2 facing the lead frame 3. Therefore, it is possible to improve the utilization efficiency of light emitted from the light-emitting device 2.

Abstract: A template storage section previously stores a template having a plurality of display areas. A template readout section reads out the template from the template storage section for display. An imaging section images a subject and outputs corresponding image data. A through image display control section displays a through image corresponding to image data output by the imaging section in one of the display areas included in the template that has been read out by the template readout section. The through image display control section switches the display area of the through image from one area to remaining areas based on an instruction from a user.