Patents by Inventor Yoshio Tanaka

Yoshio Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240383233
    Abstract: Provided is a glass resin laminate (1), including: a resin layer (2); a glass sheet (3); an adhesive layer (4) configured to bond the glass sheet (3) and the resin layer (2); and a functional film (5) interposed in the adhesive layer (4). The adhesive layer (4) includes a first portion (4a) positioned between the resin layer (2) and the functional film (5), a second portion (4b) positioned between the glass sheet (3) and the functional film (5), and a fused portion (4c) obtained by fusing an end portion of the first portion (4a) and an end portion of the second portion (4b).
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Inventors: Takehiko ISOMOTO, Yasuhiko NOZAKI, Yoshio TANAKA
  • Publication number: 20240344120
    Abstract: The present invention provides a DNA detection method comprising: a first step of dividing a specimen solution containing a fluorescent-labeled probe or a DNA intercalator and multiple types of DNA to be detected into a plurality of aliquots; a second step of performing PCR in microcompartments, each containing one of the aliquots; a third step of measuring fluorescence intensity from the fluorescent-labeled probe or the DNA intercalator in each of the microcompartments as temperature changes; a fourth step of calculating a melting temperature of the multiple type of DNA to be detected from each measured fluorescence intensity; a fifth step of identifying any microcompartment affected by one or more bubbles; and a sixth step of excluding data obtained for the microcompartment affected by one or more bubbles from all data obtained for the plurality of microcompartments.
    Type: Application
    Filed: June 7, 2021
    Publication date: October 17, 2024
    Inventors: Junko TANAKA, Tatsuo NAKAGAWA, Takeshi ISHIDA, Yoshio KAMURA
  • Publication number: 20240347343
    Abstract: A technology is provided to form p-type regions and to effectively reduce a contact resistance between the p-type region and an electrode. One embodiment of a nitride semiconductor device manufacturing method may include a magnesium layer formation step of forming a magnesium layer that comprises magnesium as a major component on a surface of a nitride semiconductor substrate. The method may include an annealing step of annealing the nitride semiconductor substrate on which the magnesium layer is formed.
    Type: Application
    Filed: February 15, 2022
    Publication date: October 17, 2024
    Inventors: Manato DEKI, Shun LU, Hiroshi AMANO, Yoshio HONDA, Atsushi TANAKA, Yuta ITO
  • Publication number: 20240294185
    Abstract: In an aspect of a vehicle control device, a vehicle control method, a target trajectory calculation method, and a vehicle according to the present invention, an offset amount of a coordinate value or a curvature is determined for each item of basic trajectory coordinate data on a basis of the basic trajectory coordinate data on at least a part or all of a two-dimensional coordinate value, a trajectory curvature, and a trajectory azimuth angle at coordinates arranged in ascending order of arc length from a certain position serving as an origin point, new target trajectory coordinate data is determined by adding the offset amount to each item of the basic trajectory coordinate data, and a trajectory of a vehicle is controlled on a basis of the new target trajectory coordinate data. Thus, a target trajectory with an out-in-out line can be obtained as in steering by an expert driver.
    Type: Application
    Filed: February 25, 2022
    Publication date: September 5, 2024
    Inventors: Yu SATO, Makoto YAMAKADO, Masato ABE, Yoshio KANO, Yusuke TANAKA
  • Patent number: 12077694
    Abstract: A surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc is provided. The surface-protective PSA sheet capable of reducing adherend damage and well maintaining appearance, etc., comprises a surface layer, a resin substrate layer and a PSA layer, and has a multilayer structure with the resin substrate layer placed between the surface layer and the PSA layer, wherein the surface layer is a layer obtainable by curing a heat-curable composition comprising the following components: (a) a hydroxyl group-containing (meth)acrylic copolymer having a glass transition temperature of ?40° C. to 30° C.; (b) an allophanate polyisocyanate and/or a biuret polyisocyanate; and (c) a polysiloxane comprising a hydroxyl group-containing hydrocarbon group and/or polymer.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: September 3, 2024
    Assignees: ARAKAWA CHEMICAL INDUSTRIES, LTD., NITTO DENKO CORPORATION
    Inventors: Keita Kume, Yuki Hashimoto, Akihiro Yamazaki, Toru Higashimoto, Eiichi Imoto, Yoshio Nakagawa, Shota Tanaka, Kenichi Nishikawa, Chihiro Yoshida
  • Patent number: 12063468
    Abstract: [Problem] The present invention is directed to a higher-performance and higher-quality curved diaphragm speaker system without deficiency of performance for both a hearing-impaired person and a normal hearing person. [Solution] A speaker unit 10 according to the present invention includes at least a first diaphragm 1 having a corn shape, a second diaphragm 2 having a curved sheet shape, and a driver unit 3 that drives both the first diaphragm and the second diaphragm. A small diameter side 1a of the first diaphragm and one end side 2a of the second diaphragm are coupled to the driver unit. When the speaker unit is mounted in a housing 50 to be a speaker 100, a large diameter side 1b of the first diaphragm is coupled to a support plate 511 of a support member 51 that is a part of the housing, and the other end side 2b of the second diaphragm is coupled to a support leg 513 of the support member that is a part of the housing.
    Type: Grant
    Filed: August 17, 2019
    Date of Patent: August 13, 2024
    Assignee: SOUND FUN CORPORATION
    Inventors: Kazunori Sato, Nobuhiro Miyahara, Yoshio Sakamoto, Hiroshi Tanaka
  • Publication number: 20240259688
    Abstract: An imaging system images measurement targets arranged on a plane and includes a light source that irradiates the measurement targets with light, a photodetector that detects light from the measurement targets, one or more lenses, an adjustment mechanism that focuses imaging on the measurement targets, and a drive mechanism that changes the relative position of the photodetector and the measurement targets. The measurement targets have the same shape and size and are arranged at equal pitches in a longitudinal direction and a lateral direction on the plane, based on a value obtained by multiplying the pitch of the measurement targets by an imaging magnification that is an integer multiple of two or more times of a pixel pitch of the photodetector. In the changing of the relative position by the drive mechanism, an adjustment unit of an imaging range is equal to or less than the pixel pitch.
    Type: Application
    Filed: June 18, 2021
    Publication date: August 1, 2024
    Inventors: Yoshio KAMURA, Takeshi ISHIDA, Junko TANAKA
  • Publication number: 20230259944
    Abstract: A monitoring apparatus includes a camera interface, a terminal interface, a communication interface, and a processor. The processor is configured to recognize actions of a settler at a point-of-sale terminal based on images from a camera, recognize input operations performed at the point-of-sale terminal by the settler based on information from the point-of-sale terminal and detect fraudulent acts based on a recognized action and a recognized input operation at the point-of-sale terminal. The processor outputs a fraud detection image corresponding to a detected fraudulent act to at least one of the point-of-sale terminal and an attendant terminal.
    Type: Application
    Filed: December 20, 2022
    Publication date: August 17, 2023
    Inventors: Tsuyoshi GOTANDA, Yusuke MIMURA, Daisuke TAKEUCHI, Yoshio TANAKA, Anna TSUBOI
  • Publication number: 20220250358
    Abstract: A laminated glass 1 includes a resin plate 2 as a core material, a first glass sheet 4 disposed on one surface side of the resin plate 2 via a first adhesive layer 3, and a second glass sheet 6 disposed on the other surface side of the resin plate 2 via a second adhesive layer 5. A heat reflective film 7 is disposed in the first adhesive layer 3, and a heat absorbing film 8 is disposed in the second adhesive layer 5, the heat absorbing film 8 functioning as a light absorbing member capable of absorbing a portion of incident light. The heat reflective film 7 is disposed closer to the first glass sheet 4 than the heat absorbing film 8 is.
    Type: Application
    Filed: June 4, 2020
    Publication date: August 11, 2022
    Inventors: Nobuo FUNABIKI, Takehiko ISOMOTO, Yoshio TANAKA
  • Publication number: 20220176680
    Abstract: Provided is a glass resin laminate (1), including: a resin layer (2); a glass sheet (3); an adhesive layer (4) configured to bond the glass sheet (3) and the resin layer (2); and a functional film (5) interposed in the adhesive layer (4). The adhesive layer (4) includes a first portion (4a) positioned between the resin layer (2) and the functional film (5), a second portion (4b) positioned between the glass sheet (3) and the functional film (5), and a fused portion (4c) obtained by fusing an end portion of the first portion (4a) and an end portion of the second portion (4b).
    Type: Application
    Filed: February 23, 2022
    Publication date: June 9, 2022
    Inventors: Takehiko ISOMOTO, Yasuhiko NOZAKI, Yoshio TANAKA
  • Publication number: 20200130327
    Abstract: Provided is a glass resin laminate (1), including: a resin layer (2); a glass sheet (3); an adhesive layer (4) configured to bond the glass sheet (3) and the resin layer (2); and a functional film (5) interposed in the adhesive layer (4). The adhesive layer (4) includes a first portion (4a) positioned between the resin layer (2) and the functional film (5), a second portion (4b) positioned between the glass sheet (3) and the functional film (5), and a fused portion (4c) obtained by fusing an end portion of the first portion (4a) and an end portion of the second portion (4b).
    Type: Application
    Filed: March 22, 2018
    Publication date: April 30, 2020
    Inventors: Takehiko ISOMOTO, Yasuhiko NOZAKI, Yoshio TANAKA
  • Patent number: 9010866
    Abstract: A vehicle seat device includes a seat base, an upholstery sheet covering the sheet base, and a cover member covering an end region of the upholstery sheet. The cover member includes a cover body of a soft material fastenable to the seat base by a fastener in covering relation to the end region of the upholstery sheet, a first lip formed by bending one side of the soft material inwardly, and a second lip formed by bending another side of the soft material inwardly. The first lip and the second lip at least partly cover a portion of the cover body where the fastener is to be positioned.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 21, 2015
    Assignee: TS Tech Co., Ltd.
    Inventors: Yoshio Tanaka, Tyler Mencl, Nick Miller
  • Patent number: 8486519
    Abstract: A white film for a reflecting structure for surface light sources, which contains voids inside it and has a light stabilizer-containing coating film formed on at least one surface of it, is aged little with time and its brightness lowers little even when used for a long time. The white film ensures good image quality of display screens for a long time, and it is favorable to reflecting sheets and reflectors in edge light-type and direct back light-type surface light sources for liquid crystal display screens.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: July 16, 2013
    Assignee: Toray Industries, Inc.
    Inventors: Takashi Mimura, Yoshio Tanaka, Hisashi Oowatari
  • Publication number: 20130099549
    Abstract: A vehicle seat device includes a seat base, an upholstery sheet covering the sheet base, and a cover member covering an end region of the upholstery sheet. The cover member includes a cover body of a soft material fastenable to the seat base by a fastener in covering relation to the end region of the upholstery sheet, a first lip formed by bending one side of the soft material inwardly, and a second lip formed by bending another side of the soft material inwardly. The first lip and the second lip at least partly cover a portion of the cover body where the fastener is to be positioned.
    Type: Application
    Filed: September 12, 2012
    Publication date: April 25, 2013
    Applicant: TS TECH CO., LTD.
    Inventors: Yoshio TANAKA, Tyler MENCL, Nick MILLER
  • Patent number: 8338950
    Abstract: An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: December 25, 2012
    Assignee: OMRON Corporation
    Inventors: Kazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa
  • Patent number: 8314485
    Abstract: An electronic component has a board, a semiconductor element mounted on an upper surface of the board, a ground electrode formed in a region surrounding the semiconductor element on the upper surface of the board, a conductive cap that overlaps the board such that the semiconductor element is covered therewith, and a conductive joining member that joins a whole periphery of a lower surface of the conductive cap to the ground electrode. The conductive cap includes a pressing portion on the lower surface thereof The lower surface of the conductive cap and the ground electrode are joined by the conductive joining member on an outer peripheral side of the pressing portion.
    Type: Grant
    Filed: February 16, 2009
    Date of Patent: November 20, 2012
    Assignee: OMRON Corporation
    Inventors: Kazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa
  • Patent number: 8274797
    Abstract: An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: September 25, 2012
    Assignee: OMRON Corporation
    Inventors: Kazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa
  • Publication number: 20120139111
    Abstract: An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.
    Type: Application
    Filed: February 17, 2009
    Publication date: June 7, 2012
    Applicant: OMRON CORPORATION
    Inventors: Kazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa
  • Patent number: 8166136
    Abstract: A storage management system (10) is a system for connecting a client terminal (30) to a storage apparatus (111) via a communication network. The storage management system (10) includes: a communication unit (21) that receives a reservation request from the client terminal (30); a reservation management unit (221) that reserves a right of use and a time slot of use of the remaining capability of the storage capability in the storage apparatus (111) in accordance with the reservation request, and manages reservation information indicating the result of the reservation; and a ticket issuance unit (222) that issues a reservation ticket showing the reservation information to the client terminal (30), and transmits the reservation ticket to the client terminal (30). The ticket issuance unit (222) issues the reservation ticket only when the remaining capability is confirmed.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 24, 2012
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Yusuke Tanimura, Tomohiro Kudoh, Isao Kojima, Yoshio Tanaka
  • Publication number: 20110044017
    Abstract: An electronic component has a printed substrate having a die bonding portion, a semiconductor element rigidly bonded to the die bonding portion of the printed substrate by a die bonding resin, and a wire bonding terminal formed by a conductor pattern on the printed substrate that is connected to the semiconductor element by a bonding wire. A groove portion located at a level lower than the conductor pattern of the printed substrate is formed in a region located on at least a die bonding portion side in a region surrounding the wire bonding terminal.
    Type: Application
    Filed: February 18, 2009
    Publication date: February 24, 2011
    Applicant: OMRON CORPORATION
    Inventors: Kazuyuki Ono, Yoshio Tanaka, Kiyoshi Nakajima, Naoto Kuratani, Tomofumi Maekawa