Abstract: A vapor deposited material for FPD protective film comprises a polycrystalline body, sintered body, or single crystal having a surface covered with a fluoride layer. A manufacturing device for FPD protective film comprises: a film formation section for forming a film body on one side of a substrate, and a layer formation section for forming a fluoride layer on a surface of said film body; wherein said layer formation section comprises: a layer formation chamber for housing a substrate on which said film body is formed, a gas supply mechanism for forming a fluoride layer on the surface of said film body by supplying a fluoridation agent towards said substrate in said layer formation chamber, and a substrate heating section provided in said layer formation chamber for heating said substrate.

Abstract: The present invention provides a protecting film capable of preventing deterioration in adhesion and matching to a substrate (dielectric layer), and deterioration in electric insulation. The protecting film includes a film body composed of MgO or the like which is inhibited from reacting with CO2 gas and H2O gas in air to prevent degeneration of MgO or the like into MgCO3 and Mg(OH)2, etc. harmful to FPD. The film body is formed on the surface of the substrate, and the fluoride layer is formed on the surface of the film body. The fluoride layer is represented by MOXFY (M is Mg, Ca, Sr, Ba, an alkali earth complex metal, a rare earth metal, or a complex metal of an alkali earth metal and a rare earth metal, 0≦X<2, and 0<Y≦4), and is obtained by reaction of a gaseous fluorinating agent with MgO or the like. As the gaseous fluorinating agent, a fluorine gas, a hydrogen fluoride gas, BF3, SbF5 or SF4 is preferably used.

Abstract: The present invention provides a protecting film capable of preventing deterioration in adhesion and matching to a substrate (dielectric layer), and deterioration in electric insulation. The protecting film includes a film body composed of MgO or the like which is inhibited from reacting with CO2 gas and H2O gas in air to prevent degeneration of MgO or the like into MgCO3 and Mg(OH)2, etc. harmful to FPD. The film body is formed on the surface of the substrate, and the fluoride layer is formed on the surface of the film body. The fluoride layer is represented by MOXFY (M is Mg, Ca, Sr, Ba, an alkali earth complex metal, a rare earth metal, or a complex metal of an alkali earth metal and a rare earth metal, 0≦X<2, and 0<Y≦4), and is obtained by reaction of a gaseous fluorinating agent with MaO or the like. As the gaseous fluorinating agent, a fluorine gas, a hydrogen fluoride gas, BF3, SbF5 or SF4 is preferably used.

Abstract: It is an object of the present invention to provide a polycrystalline MgO deposition material which is capable of obtaining a good discharge response characteristic over a wide temperature range. Additionally, it is another object of the present invention to provide a plasma display panel with an improved luminance and a material for the plasma display panel which can remarkably reduce the number of address ICs without lowering the panel luminance. In order to achieve the objects, there is provided an improvement of a polycrystalline MgO deposition material for a passivation layer of the plasma display panel. A characteristic structure is that the polycrystalline MgO deposition material is formed of a sintered pellet of polycrystalline MgO, of which MgO purity is more than 99.9% and relative density is more than 90%. Further, a Si concentration in the polycrystalline MgO is more than 30 ppm and less than 500 ppm.

Abstract: A paste film is formed by coating a paste onto the surface of a substrate. In a state in which comb-teeth formed on at least a portion of the periphery of a blade is thrust into the paste film, the blade or the substrate is moved in a certain direction, thus forming ceramic capillary ribs on the substrate surface. The paste should preferably contain from 30 to 95 wt. % glass powder or mixed glass/ceramics powder, from 0.3 to 15 wt. % resin, and from 3 to 70 wt. % solvent mixture (a solvent. a plasticizer and a dispersant), and the ceramic ribs on the substrate should preferably have an aspect ratio of from 1.5 to 10. The blade should preferably have a pitch P, a gap w and a depth h as expressed by 0.03 mm≦h≦1.0 mm and w/P≦0.9, and ribs are foamable on an insulating layer by keeping the blade spaced apart from the substrate surface.

Abstract: A vapor deposited material for FPD protective film comprises a polycrystalline body, sintered body, or single crystal having a surface covered with a fluoride layer. A manufacturing device for FPD protective film comprises: a film formation section for forming a film body on one side of a substrate, and a layer formation section for forming a fluoride layer on a surface of said film body; wherein said layer formation section comprises: a layer formation chamber for housing a substrate on which said film body is formed, a gas supply mechanism for forming a fluoride layer on the surface of said film body by supplying a fluoridation agent towards said substrate in said layer formation chamber, and a substrate heating section provided in said layer formation chamber for heating said substrate.

Abstract: One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.

Abstract: A paste film is formed by coating a paste onto the surface of a substrate. In a state in which comb-teeth formed on at least a portion of the periphery of a blade is thrust into the paste film, the blade or the substrate is moved in a certain direction, thus forming ceramic capillary ribs on the substrate surface. The paste should preferably contain from 30 to 95 wt. % glass powder or mixed glass/ceramics powder, from 0.3 to 15 wt. % resin, and from 3 to 70 wt. % solvent mixture (a solvent, a plasticizer and a dispersant), and the ceramic ribs on the substrate should preferably have an aspect ratio of from 1.5 to 10. The blade should preferably have a pitch P, a gap w and a depth h as expressed by 0.03 mm≦h≦1.0 mm and w/P≦0.9, and ribs are foamable on an insulating layer by keeping the blade spaced apart from the substrate surface.

Abstract: One object of the present invention is to provide a paste that is easily coated, has a comparatively long aging time and is able to maintain the shape of the ribs following plastic deformation; in order to achieve the object, the present invention provides a paste comprising 50-95% by weight of glass powder or glass-ceramic mixed powder, 0.1-15% by weight of a resin, and 3-60% by weight of a plurality of kinds of solvents, wherein each boiling point of the plurality of kinds of solvents differs by 30° C. or more; and, the plurality of kinds of solvents contain one or more low boiling point solvents which are low boiling point solvents having a boiling point from 100° C. to 180° C., and one or more high boiling point solvents which are high boiling point solvents having a boiling point from 190° C. to 450° C.

Abstract: A vapor deposited material for FPD protective film comprises a polycrystalline body, sintered body, or single crystal having a surface covered with a fluoride layer. A manufacturing device for FPD protective film comprises: a film formation section for forming a film body on one side of a substrate, and a layer formation section for forming a fluoride layer on a surface of said film body; wherein said layer formation section comprises: a layer formation chamber for housing a substrate on which said film body is formed, a gas supply mechanism for forming a fluoride layer on the surface of said film body by supplying a fluoridation agent towards said substrate in said layer formation chamber, and a substrate heating section provided in said layer formation chamber for heating said substrate.

Abstract: A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

Abstract: An aluminum nitride (AlN) substrate comprising an AIN sinter, an Al.sub.2 O.sub.3 layer provided on the sinter, and a glass-mixed Al.sub.2 O.sub.3 layer which is provided on the Al.sub.2 O.sub.3 layer and contains Al.sub.2 O.sub.3 and glass mixed therewith, preferably with an oxide particle-dispersed glass layer and a main glass layer provided on the glass-mixed Al.sub.2 O.sub.3 layer. The AlN substrate has heat dissipation properties closer to those of AlN itself, does not cause generation of air bubbles at the junction interface between the AlN sinter and the glass-containing layer, and has excellent surface smoothness and corrosion resistance. The very fine conductive layer, etc. may be readily and firmly formed on the substrate in a stable manner.

Abstract: A ceramic substrate is used for an electric or electronic circuit, and comprises a ceramic foundation and at least one conductive island formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic foundation for providing conductive paths to circuit components connected thereto, wherein the aluminum or aluminum-alloy island is brazed to the ceramic foundation with a brazing alloy selected from the group consisting of aluminum-silicon alloy, aluminum-germanium alloy, aluminum-silicon-magnesium alloy and aluminum-silicon-germanium alloy so that thermal stress between the ceramic foundation and the conductive island is taken up.

Abstract: A ceramic substrate is used for an electric or electronic circuit comprises a ceramic plate formed of a substance mainly composed of aluminum nitride, and conductive islands formed of aluminum or an aluminum alloy and bonded to one surface of the ceramic plate for providing conductive paths to circuit components connected thereto, wherein the aluminum islands decrease the total weight of the ceramic substrate and enhance a resistance against repetition of a thermal stress.

Abstract: An insulating substrate is used for fabrication of a thick film circuit and comprises a foundation of aluminum nitride and a surface film structure provided on the foundation, in which the foundation contains at least one oxidizing agent selected from the group consisting of an yttrium oxide and a calcium oxide ranging from 0.1% to 10% by weight for enhancing a stiffness of the foundation, and in which the surface film structure is of the multi-level surface film structure having a lower surface film of an aluminum oxide rapidly grown on the foundation in the presence of the oxidizing agent and an upper surface film containing a silicon oxide and a substance selected from the group consisting of a zirconium oxide, a titanium oxide and a boron oxide for enhancing the resistivity against a firing operation.

Abstract: An insulating substrate is used for fabrication of a thick film circuit provided with a conductive pattern made from a paste containing glass frits, and comprises a foundation containing an aluminum nitride and incidental impurities, and a multi-level surface film structure provided between the foundation and the conductive pattern and having a lower surface film of an aluminum oxide provided on a surface of the foundation, an intermediate surface film provided on the lower surface film and formed of a substance having a relatively small acidity and an upper surface film provided on the intermediate surface film and formed of a substance having a relatively large acidity, in which the substance with the large acidity rapidly reacts with the frits in a firing stage for enhancing the adhesion of the conductive pattern but the substance with the relatively small acidity restricts the consumption thereof, so that the total thickness of the multi-level film structure is decrased and, accordingly, the heat radiatio