Patents by Inventor Yoshitaka Shibuya

Yoshitaka Shibuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11872647
    Abstract: A production method of an additive manufactured object is provided. The method is an EB-based additive manufacturing method of spreading a pure copper powder, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a first layer, newly spreading a pure copper powder on the first layer, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a second layer, and repeating the foregoing process to add layers. The pure copper powder is a pure copper powder with a Si coating formed thereon, and the preheating temperature is set to be 400° C. or higher and less than 800° C.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 16, 2024
    Assignee: JX METALS CORPORATION
    Inventors: Hirofumi Watanabe, Hiroyoshi Yamamoto, Yoshitaka Shibuya, Kenji Sato, Satoru Morioka, Akihiko Chiba, Kenta Aoyagi
  • Patent number: 11872624
    Abstract: Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: January 16, 2024
    Assignee: JX METALS CORPORATION
    Inventors: Hirofumi Watanabe, Yoshitaka Shibuya
  • Publication number: 20230307178
    Abstract: A soft magnetic body includes soft magnetic particles containing an element M and an intergranular region that exists between the soft magnetic particles and covers an outer periphery of the soft magnetic particles. On a cross-section of the soft magnetic body, a ratio of the element M at the center of the soft magnetic particles to a ratio of the element M in a soft magnetic composition that constitutes the soft magnetic body is within a range of 10% to 70%. On the cross-section of the soft magnetic body, an average of peripheral lengths of a plurality of the intergranular regions existing at the periphery of the soft magnetic particles is within a range of 5 ?m to 15.5 ?m.
    Type: Application
    Filed: March 6, 2023
    Publication date: September 28, 2023
    Applicant: TDK CORPORATION
    Inventors: Kenichiro MATSUNO, Mamoru ITO, Hiroshi HARADA, Yoshitaka SHIBUYA, Takayuki MIURA, Naoki ITO
  • Patent number: 11569867
    Abstract: The power line communication device detects inverter noise from the voltage waveforms of the power line, and executes the output of the transmission signal in a period in which it is determined that the signal amplitude of the transmission signal in the transmission processing unit exceeds a predetermined value from the output amplitude of the inverter noise, and stops the output of the transmission signal in other periods.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: January 31, 2023
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kosuke Shibuya, Yoshitaka Shibuya
  • Publication number: 20220362844
    Abstract: Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.
    Type: Application
    Filed: June 25, 2021
    Publication date: November 17, 2022
    Inventors: Hirofumi WATANABE, Yoshitaka SHIBUYA
  • Patent number: 11498122
    Abstract: A pure copper powder with a Si coating formed thereon, wherein a Si adhesion amount is 5 wtppm or more and 200 wtppm or less, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less. An object of the present invention is to provide a pure copper powder with a Si coating formed thereon and a production method thereof, as well as an additive manufactured object using such pure copper powder capable of suppressing the partial sintering of the pure copper powder caused by the preheating thereof in additive manufacturing based on the electron beam (EB) method, and suppressing the loss of the degree of vacuum caused by carbon (C) during the molding process.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: November 15, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Hirofumi Watanabe, Hiroyoshi Yamamoto, Yoshitaka Shibuya
  • Publication number: 20220298401
    Abstract: An object of the present invention is to provide a latent heat storage body which has a melting point of about 300 to 550° C. and is difficult to cause leakage of a phase changing material, and a product obtained by applying the body. Provided is a microcapsule for latent heat storage materials including a metal core containing Zn and Al and a shell covering the metal core. The shell of the microcapsule includes an oxide film containing Zn and O, and an oxide film containing Al and O adjacent to an inner side of the oxide film. In the microcapsule, a mass ratio of ZnAl2O4 is 4% or less. The mass ratio is determined by analyzing the microcapsule by an XRD (X-ray diffractometer) device and subjecting results to quantitative analysis using a RIR (Reference Integrity Ratio) method.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 22, 2022
    Inventors: Takahiro Nomura, Takahiro Kawaguchi, Hiroki Sakai, Shunsuke Cho, Kohei Kashiyama, Kenji Sato, Kazuyuki Miya, Yoshitaka Shibuya
  • Patent number: 11345990
    Abstract: A MgO sintered sputtering target, wherein a ratio of GOS (Grain Orientation Spread) being 0° to 1° is 75% or higher. A MgO sintered sputtering target, wherein a ratio of KAM (Kernel Average Misorientation) being 0° to 2° is 90% or higher. An object of the present invention is to provide a MgO sintered sputtering target capable of reducing particles.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: May 31, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Satoyasu Narita, Hiroki Kajita
  • Patent number: 11313029
    Abstract: A sputtering target formed from a potassium sodium niobate sintered body to which a dopant has been added; as a dopant, the sputtering target includes one or more types among Li, Mg, Ca, Sr, Ba, Bi, Sb, V, In, Ta, Mo, W, Cr, Ti, Zr, Hf, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Cu, Zn, Ag, Mn, Fe, Co, Ni, Al, Si, Ge, Sn, and Ga; and a variation coefficient of a dopant concentration in a plane of the sputtering target is 0.12 or less. In terms of suppressing the generation of particles, provided is a sputtering target which is formed from a sintered body that includes potassium sodium niobate and to which a dopant has been added.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 26, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Ryosuke Sakashita, Yoshitaka Shibuya
  • Patent number: 11260451
    Abstract: A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: March 1, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Kenji Sato
  • Publication number: 20210409069
    Abstract: The power line communication device detects inverter noise from the voltage waveforms of the power line, and executes the output of the transmission signal in a period in which it is determined that the signal amplitude of the transmission signal in the transmission processing unit exceeds a predetermined value from the output amplitude of the inverter noise, and stops the output of the transmission signal in other periods.
    Type: Application
    Filed: September 14, 2021
    Publication date: December 30, 2021
    Inventors: Kosuke SHIBUYA, Yoshitaka SHIBUYA
  • Publication number: 20210351023
    Abstract: A sputtering target configured from a magnesium oxide sintered body, wherein a ratio of crystal grains of the magnesium oxide sintered body in which a number of pinholes in a single crystal grain is 20 or more is 50% or less. The present invention is a sputtering target configured from a magnesium oxide sintered body in which the generation of particles during sputtering is less.
    Type: Application
    Filed: October 9, 2019
    Publication date: November 11, 2021
    Inventors: Hiroki KAJITA, Yoshitaka SHIBUYA, Satoyasu NARITA
  • Patent number: 11146309
    Abstract: The power line communication device detects inverter noise from the voltage waveforms of the power line, and executes the output of the transmission signal in a period in which it is determined that the signal amplitude of the transmission signal in the transmission processing unit exceeds a predetermined value from the output amplitude of the inverter noise, and stops the output of the transmission signal in other periods.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 12, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kosuke Shibuya, Yoshitaka Shibuya
  • Patent number: 10969400
    Abstract: In order to correct the rotation angle value without an increase in the circuit size, a rotation period measurement unit measures a rotation period of a rotary shaft in which a rotation angle is detected by using a resolver that outputs a signal corresponding to the rotation angle of the rotary shaft. A rotation speed calculation unit calculates the rotation speed of the rotary shaft based on the rotation period. An acceleration calculation unit calculates the rate of change of the rotation speed per interval when a given rotation angle of the rotary shaft is divided into 2n+1 intervals, in which n is an integer of 1 or more. An estimated angle calculation unit calculates the rotation angle estimation value, assuming that the rotary shaft performs a uniform acceleration motion, based on the rotation speed and the rate of change of the rotation speed. A correction value calculation unit calculates the correction value of the rotation angle value converted from the output signal of the resolver.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: April 6, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yoshitaka Shibuya, Hayato Kimura
  • Publication number: 20210053114
    Abstract: A pure copper powder with a Si coating formed thereon, wherein a Si adhesion amount is 5 wtppm or more and 200 wtppm or less, a C adhesion amount is 15 wtppm or more, and a weight ratio C/Si is 3 or less. An object of the present invention is to provide a pure copper powder with a Si coating formed thereon and a production method thereof, as well as an additive manufactured object using such pure copper powder capable of suppressing the partial sintering of the pure copper powder caused by the preheating thereof in additive manufacturing based on the electron beam (EB) method, and suppressing the loss of the degree of vacuum caused by carbon (C) during the molding process.
    Type: Application
    Filed: December 26, 2019
    Publication date: February 25, 2021
    Inventors: Hirofumi Watanabe, Hiroyoshi Yamamoto, Yoshitaka Shibuya
  • Publication number: 20210039192
    Abstract: A production method of an additive manufactured object according to an EB-based additive manufacturing method of spreading a pure copper powder, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a first layer, newly spreading a pure copper powder on the first layer, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a second layer, and repeating the foregoing process to add layers, wherein used as the pure copper powder is a pure copper powder with a Si coating formed thereon, and wherein the preheating temperature is set to be 400° C. or higher and less than 800° C.
    Type: Application
    Filed: December 26, 2019
    Publication date: February 11, 2021
    Inventors: Hirofumi Watanabe, Hiroyoshi Yamamoto, Yoshitaka Shibuya, Kenji Sato, Satoru Morioka, Akihiko Chiba, Kenta Aoyagi
  • Patent number: 10826203
    Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: November 3, 2020
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Publication number: 20200340096
    Abstract: A sputtering target formed from a potassium sodium niobate sintered body to which a dopant has been added; as a dopant, the sputtering target includes one or more types among Li, Mg, Ca, Sr, Ba, Bi, Sb, V, In, Ta, Mo, W, Cr, Ti, Zr, Hf, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Cu, Zn, Ag, Mn, Fe, Co, Ni, Al, Si, Ge, Sn, and Ga; and a variation coefficient of a dopant concentration in a plane of the sputtering target is 0.12 or less. In terms of suppressing the generation of particles, provided is a sputtering target which is formed from a sintered body that includes potassium sodium niobate and to which a dopant has been added.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 29, 2020
    Inventors: Ryosuke Sakashita, Yoshitaka Shibuya
  • Publication number: 20200263291
    Abstract: A MgO sintered sputtering target, wherein a ratio of GOS (Grain Orientation Spread) being 0° to 1° is 75% or higher. A MgO sintered sputtering target, wherein a ratio of KAM (Kernel Average Misorientation) being 0° to 2° is 90% or higher. An object of the present invention is to provide a MgO sintered sputtering target capable of reducing particles.
    Type: Application
    Filed: March 6, 2019
    Publication date: August 20, 2020
    Inventors: Yoshitaka Shibuya, Satoyasu Narita, Hiroki Kajita
  • Publication number: 20200212958
    Abstract: The power line communication device detects inverter noise from the voltage waveforms of the power line, and executes the output of the transmission signal in a period in which it is determined that the signal amplitude of the transmission signal in the transmission processing unit exceeds a predetermined value from the output amplitude of the inverter noise, and stops the output of the transmission signal in other periods.
    Type: Application
    Filed: December 18, 2019
    Publication date: July 2, 2020
    Inventors: Kosuke SHIBUYA, Yoshitaka SHIBUYA