Abstract: A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.

Abstract: An object of the present invention is to provide a copper alloy powder for lamination shaping comprising a copper alloy, a method for producing a lamination shaped product and a lamination shaped product, which can achieve coexistence of mechanical strength and conductivity. One aspect of the present invention relates to a copper alloy powder for lamination shaping, comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %.

Abstract: To reduce a hardware circuit scale and a memory capacity in a communication system reducing a PAPR. A transmitter includes a transmission processing feedback type FIR filter configured to feed back data outputted from the last stage delay element of a plurality of delay elements included in an FIR filter to the first stage delay element and configured to set an initial value to a delay element in a predetermined position, of the delay elements, and performs transmission processing by using the transmission processing feedback type FIR filter. A receiver includes a reception processing feedback type FIR filter configured similarly to the transmission processing feedback type FIR filter and performs reception processing by using the reception processing feedback type FIR filter.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: To reduce a hardware circuit scale and a memory capacity in a communication system reducing a PAPR. A transmitter includes a transmission processing feedback type FIR filter configured to feed back data outputted from the last stage delay element of a plurality of delay elements included in an FIR filter to the first stage delay element and configured to set an initial value to a delay element in a predetermined position, of the delay elements, and performs transmission processing by using the transmission processing feedback type FIR filter. A receiver includes a reception processing feedback type FIR filter configured similarly to the transmission processing feedback type FIR filter and performs reception processing by using the reception processing feedback type FIR filter.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: In order to correct the rotation angle value without an increase in the circuit size, a rotation period measurement unit measures a rotation period of a rotary shaft in which a rotation angle is detected by using a resolver that outputs a signal corresponding to the rotation angle of the rotary shaft. A rotation speed calculation unit calculates the rotation speed of the rotary shaft based on the rotation period. An acceleration calculation unit calculates the rate of change of the rotation speed per interval when a given rotation angle of the rotary shaft is divided into 2n+1 intervals, in which n is an integer of 1 or more. An estimated angle calculation unit calculates the rotation angle estimation value, assuming that the rotary shaft performs a uniform acceleration motion, based on the rotation speed and the rate of change of the rotation speed. A correction value calculation unit calculates the correction value of the rotation angle value converted from the output signal of the resolver.

Abstract: There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness larger than 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 ?m or larger.

Abstract: A material for fuel cell separator, wherein a surface layer 6 containing Au and Cr is formed on a surface of a Ti base 2, and an intermediate layer 2a containing Ti, O, Cr, and less than 20 atomic % of Au is present between the Ti base and the surface layer, a thickness of an area containing 65 atomic % or more of Au being 1.5 nm or more, a maximum concentration of Au being 80 atomic % or more, a coating amount of Au being 9000 to 40000 ng/cm2, a ratio represented by (Au coating amount)/(Cr coating amount) being 10 or more, a coating amount of Cr being 200 ng/cm2 or more, and in the intermediate layer having an area containing 10% or more of Ti, 10% or more of O and 20% or more of Cr being 1 nm or more.

Abstract: There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance.

Abstract: There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal material 10 includes a base material 11 , an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness larger than 0.3 ?m.

Abstract: There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 ?m.

Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.

Abstract: There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness of 0.002 to 0.2 ?m, and the middle layer (B layer) 13 has a thickness larger than 0.3 ?m.

Abstract: The present invention provides a surface treated plating material being suppressed in the occurrence of whiskers, maintaining satisfactory solderability and satisfactory contact resistance even when exposed to a high temperature environment, and being low in the terminal-connector insertion force. The surface treated plating material is a plating material including: a metal base material; a lower layer constituted with Ni or Ni alloy plating; and an upper layer constituted with Sn or Sn alloy plating, wherein the lower layer and the upper layer are sequentially formed on the metal base material; P and N are present on the upper layer surface; the amounts of the P and N elements deposited on the upper layer surface are respectively P: 1×10?11 to 4×10?8 mol/cm2, N: 2×10?12 to 8×10?9 mol/cm2.

Abstract: There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness larger than 0.2 ?m, and the middle layer (B layer) 13 has a thickness of 0.001 ?m or larger.

Abstract: A fuel cell separator material, comprising an alloy layer 6 containing Au and a first component containing Al, Cr, Fe, Co, Ni, Cu, Mo, Sn or Bi, or an Au single layer 8 formed on a Ti base 2; an intermediate layer 2a containing Ti, O, the first component, and less than 20 mass % of Au arranged between the alloy layer or the Au single layer and the Ti base; wherein the alloy layer or the Au single layer has a region having a thickness of 1 nm or more from the uppermost to the lower layer and containing 50 mass % or more of Au, or a region having a thickness of 3 nm or more from the uppermost to the lower layer and containing Au in the range from 10-50 mass %, or the thickness of the Au single layer is 1 nm or more.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.

Abstract: The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials.