Abstract: To provide a safety joint housing device for preventing a plug of a safety joint or a filling hose from being locked in a lower opening of a casing when the safety joint separates, thereby preventing a filling device from falling over and being damaged. A safety joint housing device 100 according to the present invention houses a safety joint 101 including a plug 10 connected to a filling hose 61 and a socket 20 provided in a filling device 200, the plug 10 and the socket 20 separating from each other when a tensile load exceeding a predetermined level is applied, the safety joint housing device 100 including: a casing 320; a substrate 80 attached to the casing 320 on a main body side of the filling device 200; and a member 30 that is provided at a lower opening 320A of the casing 320 and deforms when in contact with the plug 10 or the filling hose 61.

Abstract: To provide a filling hose guide device for preventing a plug of a safety joint or a filling hose from being locked in a lower opening of a casing when a safety joint separates, thereby preventing a filling device from falling over and being damaged. A filling hose guide device 100 according to the present invention is characterized in that after a plug 10 connected to a filling hose 61 and a socket 20 provided in a filling device 200 in a safety joint 300 separate when a tensile load above a predetermined level is applied to the filling hose 61, the filling hose guide devices 100 include: a rotatable or deformable member 30A, 30B, with which the filling hose 61 contacts, below the safety joint 300; and a support structure 50, through which the filling hose 61 passes, for supporting the rotatable or deformable member 30A, 30B.

Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Abstract: An aspect of the present invention is an anisotropic thermal conductive resin member including a plurality of bundled thermoplastic resin stretch fibers.

Abstract: A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.

Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Abstract: One aspect of the present invention is an anisotropic heat-conducting resin member provided with a first fiber group including multiple stretched thermoplastic resin fibers that have been bundled and a second fiber group and a third fiber group that the first fiber group branches to.

Abstract: An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·m1/2 or more, and a glass transition temperature of 150° C. or higher.

Abstract: An epoxy resin B-stage film obtained by semi-curing an epoxy resin composition, the epoxy resin composition including: a liquid crystalline epoxy monomer capable of forming a cured product that includes a liquid crystal structure; and a curing agent, in which the epoxy resin B-stage film has an average thickness of less than 8 ?m, and in which the liquid crystal structure included in the cured product turns into a liquid crystal structure, in which molecules are orientated in a film thickness direction, by being cured.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: This heat radiation material contains metal particles and a resin, and has a structure in which the metal particles are localized in at least one surface side.

Abstract: A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density.

Abstract: A heat radiation material which includes metal particles and a resin and has a region inside where the metal particles arranged along the surface direction are present in a relatively high density.