Abstract: A resin composition comprising an epoxy compound denoted by the formula (1): wherein Ar1, Ar2 and Ar3 are the same or different and each denotes any one of divalent groups denoted by the following formulas: wherein R denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and an epoxy compound denoted by the formula (2): wherein R5 denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and Q2 denotes a single bond or a straight-chain alkylene group having 1 to 8 carbon atoms.

Abstract: A resin composition comprising an epoxy compound denoted by the formula (1): wherein R1, R2, R3, R4 and R5 denote a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, m and n denote an integer of 0 to 4, Ar denotes any one of divalent groups denoted by the following formulas: wherein R denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and an epoxy compound denoted by the formula (2): wherein Q denotes a straight-chain alkylene group having 1 to 8 carbon atoms, methylene groups composing said straight-chain alkylene group are optionally substituted with an alkyl group having 1 to 8 carbon atoms and —O— or —N(R6)— is optionally inserted between the methylene groups, wherein R6 denotes a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

Abstract: The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.

Abstract: There is disclosed an epoxy composition containing at least two kinds of epoxy compounds selected from the epoxy compounds of the formula (1): wherein each of Ar1, Ar2 and Ar3, the same as or different from one another, is a bivalent group of any one of the following formulas : wherein R is a hydrogen atom or a C1-8 alkyl group; a is an integer of 1 to 8; each of b, e and g is an integer of 1 to 6; c is an integer of 1 to 7; each of d and h is an integer of 1 to 4; and f is an integer of 1 to 5, wherein, when there are present a plurality of Rs in said bivalent group, Rs may be all the same groups or may be different groups from one another; Q is a C1-8 linear alkylene group, wherein a methylene group constituting the linear alkylene group may be substituted with a C1-8 alkyl group, and wherein a methylene group, not adjacent to an oxygen atom, may be replaced by —O—, and —O— or —N(R4)—may be inserted between methylene groups; each of R1, R2, R3 and R4, the same as or different from one another, is a

Abstract: An object of the present invention is to provide a fiber-reinforced composite resin composition for use as a sealant, adhesive, or filler, having a high transparency, and enabled to adequately meet recently required levels of low thermal expansion property, high strength, light weight, high thermal conductivity, and especially high, isotropic thermal conductivity. With the fiber-reinforced composite resin composition, the fibers have an average fiber diameter of 4 to 200 nm, a total light transmittance at wavelengths of 400 to 700 nm as measured with a 50 ?m-thickness cured product, resulting from curing the composition to a plate-like form, is no less than 70%, both a thermal conductivity coefficient in a thickness direction and a thermal conductivity coefficient in a plate surface direction of the cured product are no less than 0.4 W/m·K, and the fibers are oriented randomly in the composition.

Abstract: A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

Abstract: Novel epoxy compounds represented by the general formula (1) wherein Ar1, Ar2 and Ar3 are each optionally substituted phenylene, cyclohexanyl or the like, R1, R2, R3, R4, R5 and R6 are each hydrogen or alkyl of 1 to 18 carbon atoms, and Q1 and Q2 are each alkylene of 1 to 9 carbon atoms or the like, which are useful as the raw material of cured epoxy resins exhibiting liquid crystallinity; a process for the production thereof; and compositions containing the compounds.

Abstract: The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide.

Abstract: An epoxy resin composition comprising an epoxy compound represented by the formula (1): wherein Ar1, Ar2 and Ar3 each denotes any one of divalent groups represented by the following formulas: a curing agent and an alumina powder, wherein the alumina powder is a mixture of an alumina (A) having D50 of 2 ?m or more and 100 ?m or less, an alumina (B) having D50 of 1 ?m or more and 10 ?m or less, and an alumina (C) having D50 of 0.01 ?m or more and 5 ?m or less, in which D50 is a particle size at 50% cumulation from the smallest particle side of a weight cumulative particle size distribution, and the content of the alumina (A), that of the alumina (B) and that of the alumina (C) are respectively 50% by volume or more and 90% by volume or less, 5% by volume or more and 40% by volume or less, and 1% by volume or more and 30% by volume or less, based on the volume of the alumina powder (provided that the total % by volume of the alumina (A), the alumina (B) and the alumina (C) is 100% by volume).

Abstract: A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

Abstract: There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 ?m. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L?4.5 ?m is 30% or less of the total analyzed length.

Abstract: Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.

Abstract: Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.

Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.

Abstract: Novel epoxy compounds represented by the general formula (1) wherein Ar1, Ar2 and Ar3 are each optionally substituted phenylene, cyclohexanyl or the like, R1, R2, R3, R4, R5 and R6 are each hydrogen or alkyl of 1 to 18 carbon atoms, and Q1 and Q2 are each alkylene of 1 to 9 carbon atoms or the like, which are useful as the raw material of cured epoxy resins exhibiting liquid crystallinity; a process for the production thereof; and compositions containing the compounds.

Abstract: A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

Abstract: The technique of the present invention enhances the stability of paper material identification of sheets. To achieve the above purpose, both short-wavelength light in the range of 370 nm and long-wavelength light in the range of 420 to 1000 nm are irradiated to paper to be identified in identifying the paper material. The identification is carried out, based on the difference in absorbance of the paper, which is obtained for each irradiated light. The absorbance of the paper varies according to the paper material, thereby enabling the identification of the paper material free from influence, which are caused by differences in manufacturing process, such as shading patterns. In addition, the simultaneous use of the short-wavelength light and the long-wavelength light declines influence on the absorbance, which are caused by environmental factors, such as humidity and deterioration of sheets, thereby resulting in stable identification of the paper material.

Abstract: A semiconductor device is manufactured by adhering a fixing tape to plural leads of a lead frame comprising a copper alloy, mounting a semiconductor chip on a tab of the lead frame, electrically connecting the leads to electrodes a of the semiconductor chip via bonding wires, forming a sealing resin portion that seals the semiconductor chip, the tab, the bonding wires, the leads and the fixing tape, and cutting the lead frame. A binder layer of the fixing tape includes at least % by weight of an amine-curable epoxy resin as its main component, and does not include a phenol resin. The binder layer of the fixing tape further includes no more than % by weight of acrylonitrile butadiene rubber. By using this material for the binder layer of the fixing tape, migration of the copper in the leads is suppressed even when a degradation test with strict environmental degradation conditions is conducted.

Abstract: There is provided a fiber-reinforced composite material containing fibers having an average fiber diameter of 4 to 200 nm and a matrix material, the composite material having a visible light transmittance of 60% or more at a wavelength of 400 to 700 nm, which is a conversion value based on a thickness of 50 ?m. A fiber-reinforced composite material composed of a matrix material and a fiber aggregate impregnated therewith is provided, in which when a segment length of a bright region corresponding to a pore region of the fiber aggregate is represented by L, which is obtained by statistical analysis of a unidirectional run-length image formed from a binary image obtained by binarization of a scanning electron microscopic image of the fiber aggregate, the total length of segments that satisfy L?4.5 ?m is 30% or less of the total analyzed length.

Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.