Abstract: An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring.

Abstract: An epoxy resin, comprising an epoxy compound, the epoxy compound comprising two or more structures represented by the following Formula (I) and at least one divalent biphenyl group: wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

Abstract: A resin composition, comprising: a thermosetting resin that has a mesogenic group in a molecule and that is capable of forming a smectic structure via a curing reaction; and mica.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.

Abstract: An aspect of the present invention is an anisotropic thermal conductive resin fiber including a stretch fiber of a thermoplastic resin; and a thermal insulation material covering the stretch fiber.

Abstract: An aspect of the present invention is an anisotropic thermal conductive resin member including a plurality of bundled thermoplastic resin stretch fibers.

Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: (1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and (2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20° C./minute.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: Provided is a method of producing a laminate, the method including: a resin layer forming step of forming a resin layer on a first member; and a member arranging step of arranging a second member on the resin layer, in which at least one of the following conditions (1) and (2) is satisfied: (1) the surface roughness (Rz) of a surface of the first member that contacts the resin layer is larger than the surface roughness (Rz) of a surface of the second member that contacts the resin layer; and (2) the surface of the second member that contacts the resin layer has a surface roughness (Rz) of 20 ?m or less.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogen structure, wherein, when performing a process of decreasing a temperature of the epoxy resin from 150° C. to 30° C. at a rate of 2° C./min, and a process of increasing the temperature of the epoxy resin from 30° C. to 150° C. at a rate of 2° C./min, in this order, the epoxy resin has a maximum value of ??2/??1 of 20 or less within a temperature range of from 30° C. to 150° C., wherein ??1 is a dynamic shear viscosity (Pa·s) measured in the process of decreasing the temperature, and ??2 is a dynamic shear viscosity (Pa·s) measured in the process of increasing the temperature, ??1 and ??2 being measured at the same temperature, and a value ??2 measured at 100° C. is 1000 Pa·s or less.

Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: An epoxy resin, comprising (1) an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to the two aromatic rings, and at least one of the mesogenic structures being bonded to the aromatic ring at an angle with a molecular axis of the divalent biphenyl structure; (2) an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to the two aromatic rings, and at least one of bonding sites of the aromatic ring to the mesogenic structure being at an ortho position or a meta position with respect to a carbon atom that bonds the aromatic rings; or (3) an epoxy compound having a phenylene group and two mesogenic structures that are bonded to the phenylene group at an angle with each other.