Patents by Inventor Yoshitomo Teraoka

Yoshitomo Teraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220193835
    Abstract: A soldering device includes: a soldering iron; a driver for moving the soldering iron; an input receiver for receiving an input of size information of a workpiece; and a controller for controlling the driver. The controller sets a coordinate of a specific position at a predetermined distance away from a soldering position based on the size information, sets, a speed of a tip at a distant position to a predetermined speed, and sets, an evacuation speed from the soldering position to the specific position to a low speed which is lower than the predetermined speed.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Inventors: Yuta Mishima, Teruhiko Yamamoto, Yoshitomo Teraoka
  • Patent number: 11273510
    Abstract: The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 15, 2022
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Tomoo Takahara
  • Publication number: 20210354225
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: May 12, 2020
    Publication date: November 18, 2021
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 11059118
    Abstract: A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: July 13, 2021
    Assignee: Hakko Corp.
    Inventors: Yoshitomo Teraoka, Kenta Nakamura
  • Patent number: 10864590
    Abstract: The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10864589
    Abstract: A melting tool control apparatus comprises a drive mechanism, a melt processing assembly configured to perform a melt process, a receiving module that receives input of three-dimensional coordinate information of a first point where the melt process is to be performed and input of a position information indicating a position different from the first point, and a process control module configured to control the melt processing assembly to perform the melt process when the distal end is at the first point.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: December 15, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 10842061
    Abstract: A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: November 17, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Patent number: 10807239
    Abstract: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 20, 2020
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda
  • Patent number: 10802449
    Abstract: The present invention is intended to ease the control and management of soldering devices, and enhance convenience. In accordance with the intention of the invention, a system includes a power supply unit having a connecting cable to be connected to soldering devices, a power supply portion supplying power to the soldering devices through the connecting cable, a power supply control portion to control the power supply from the power supply portion based on a temperature setting signal T(s) set in advance and a control unit that may be physically separated from the power supply unit but which inputs the temperature setting signal T(s) to the power supply control portion of the power supply unit.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: October 13, 2020
    Assignee: Hakko Corp.
    Inventors: Yoshitomo Teraoka, Kenta Nakamura, Yasumasa Igi
  • Patent number: 10646945
    Abstract: A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 12, 2020
    Assignee: HAKKO CORPORATION
    Inventor: Yoshitomo Teraoka
  • Patent number: 10618127
    Abstract: The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: April 14, 2020
    Assignee: Hakko Corp.
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 10520219
    Abstract: The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: December 31, 2019
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Patent number: 10413985
    Abstract: A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 17, 2019
    Assignee: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hitoshi Takeuchi, Yasumasa Igi, Kenta Nakamura
  • Publication number: 20190160574
    Abstract: Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
    Type: Application
    Filed: November 30, 2018
    Publication date: May 30, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Publication number: 20190134730
    Abstract: A cordless, hand held soldering iron operable with a control station providing wireless temperature control functionality and a charging station.
    Type: Application
    Filed: September 26, 2018
    Publication date: May 9, 2019
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Kenta Nakamura
  • Publication number: 20190099885
    Abstract: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA
  • Publication number: 20190104659
    Abstract: A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
    Type: Application
    Filed: October 1, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA
  • Publication number: 20190099818
    Abstract: The present application discloses a soldering apparatus including a driving portion for moving a soldering iron to perform soldering on a surface of an electronic board including soldering regions. The soldering regions have a base region and at least one replication region existing at a position different from the base region. The replication region has an arrangement pattern that is the same as an arrangement pattern of a soldering position in the base region. The soldering apparatus includes an input portion for receiving input of positional relationship data, which represents a positional relationship between the base region and the at least one replication region, and for receiving base pattern data, which represents the arrangement pattern of the soldering position in the base region. The soldering apparatus includes a controller which causes the driving portion to move the soldering iron based on the base pattern data and the positional relationship data in a soldering operation.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Satoshi MANDA, Tomoo TAKAHARA
  • Publication number: 20190099819
    Abstract: The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
    Type: Application
    Filed: September 26, 2018
    Publication date: April 4, 2019
    Inventors: Yoshitomo TERAOKA, Tomoo TAKAHARA
  • Patent number: D829519
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 2, 2018
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Hisao Nemoto, Kenta Nakamura