Patents by Inventor Yoshitomo Teraoka

Yoshitomo Teraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090034945
    Abstract: In a baffle device 20 fixedly provided in an air passage of a mechanism for blowing out hot air to a solder treatment portion, vanes inclined with a predetermined inclination angle with respect to an air flow are provided substantially radially with a predetermined interval. Also, in a nozzle to be attached to the hot air blower for solder treatment, the baffle device 20 is fixedly provided in an in-nozzle air passage. Moreover, in the hot air blower for solder treatment which blows out hot air to the solder treatment portion, the baffle device 20 is fixedly provided in an in-blower air passage.
    Type: Application
    Filed: January 18, 2005
    Publication date: February 5, 2009
    Inventor: Yoshitomo Teraoka
  • Publication number: 20090014427
    Abstract: A method of configuring a soldering device includes the steps of purchasing (or offering for sale) a soldering device package including a handle, a power cartridge containing an AA battery, a power cartridge containing a lithium ion battery, and a power cartridge containing a nickel-hydride battery; selecting (or instructing a user to select) one of the three power cartridges from the purchased soldering device package for use with the handle to form a soldering device; and inserting the selected power cartridge in the handle to form a soldering device. The selecting step includes selecting one of the three power cartridges based on a specific use of the soldering device and based on soldering performance requirements of the specific use and based on operating times and relative costs of the power cartridges.
    Type: Application
    Filed: September 10, 2008
    Publication date: January 15, 2009
    Inventors: Mitsuhiko Miyazaki, Yoshitomo Teraoka, Tadashi Kato, Tsuyoshi Yamanaka
  • Patent number: 7392926
    Abstract: An electrically-controlled soldering pot apparatus with a timer control mechanism and a temperature control mechanism; a method of alerting a user when to exchange a solder bath of the apparatus before erosion to the solder bath occurs; and a method of varying the heating rate applied to a variety of lead-free solders in a solder bath housed in the apparatus.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: July 1, 2008
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Publication number: 20060054658
    Abstract: An electrically-controlled soldering pot apparatus with a timer control mechanism and a temperature control mechanism; a method of alerting a user when to exchange a solder bath of the apparatus before erosion to the solder bath occurs; and a method of varying the heating rate applied to a variety of lead-free solders in a solder bath housed in the apparatus.
    Type: Application
    Filed: September 15, 2004
    Publication date: March 16, 2006
    Applicant: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Publication number: 20060011600
    Abstract: A battery powered soldering device with a cartridge type battery system which includes a number of different optional battery packs or connections which can be utilized to provide a full range of soldering features in a cartridge type soldering tip device.
    Type: Application
    Filed: July 15, 2004
    Publication date: January 19, 2006
    Inventors: Mitsuhiko Miyazaki, Yoshitomo Teraoka, Tadashi Kato, Tsuyoshi Yamanaka
  • Publication number: 20040226981
    Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.
    Type: Application
    Filed: February 24, 2004
    Publication date: November 18, 2004
    Applicant: Hakko Corpotation, Japanese corporation
    Inventors: Takashi Nagase, Takashi Uetani, Yoshitomo Teraoka, Takanori Naito, Masayuki Miyabe, Norihisa Sekimori
  • Publication number: 20040226982
    Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.
    Type: Application
    Filed: February 24, 2004
    Publication date: November 18, 2004
    Applicant: Hakko Corporation, Japanese corporation
    Inventors: Takashi Nagase, Takashi Uetani, Yoshitomo Teraoka, Takanori Naito, Masayuki Miyabe, Norihisa Sekimori
  • Publication number: 20040222206
    Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.
    Type: Application
    Filed: November 21, 2003
    Publication date: November 11, 2004
    Applicant: Hakko Corporation, Japanese corporation
    Inventors: Takashi Nagase, Takashi Uetani, Yoshitomo Teraoka, Takanori Naito, Norihisa Sekimori, Masayuki Miyabe
  • Patent number: D522328
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: June 6, 2006
    Assignee: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Tadashi Kato, Tsuyoshi Yamanaka, Yoshitomo Teraoka
  • Patent number: D554545
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: November 6, 2007
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka