Abstract: Examples of a cleaning method includes supplying a cleaning gas into an exhaust duct that provides an exhaust flow passage of a gas supplied to an area above a susceptor, the exhaust duct having a shape surrounding the susceptor in plan view, and activating the cleaning gas to clean an inside of the exhaust duct.

Abstract: A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.

Abstract: Sample analysis systems and methods using assay surfaces, assay processing units (APUs), assay processing systems (APSs), and laboratory systems are disclosed. An assay surface includes a sample processing component comprising a plurality of regions, including at least one wash region and at least one storage region configured to hold a plurality of solid supports moveable through the regions under a magnetic force, and a detection component configured to receive the solid supports. An APU includes an assay surface receiving component, a magnetic element configured to generate a moveable magnetic field, and one or more processors configured to move the magnetic field. An APS includes one or more assay surfaces and an APU. A laboratory system includes one or more APSs and a controller for parallel processing. Sample processing and detection methods are disclosed with a reduced sample volume and/or shortened processing time and/or higher sensitivity.

Abstract: The present disclosure relates to a device including a reagent portion in which a chemiluminescent indicator and a chemiluminescent substrate for the indicator are disposed, and a base on which the reagent portion is formed. The chemiluminescent indicator and the chemiluminescent substrate are disposed independently from each other in the reagent portion in such a manner that the chemiluminescent indicator and the chemiluminescent substrate can react with each other when a sample is supplied to the reagent portion. The present disclosure also relates to a remote diagnosis system including an imaging terminal for detecting a luminescent signal generated when a reagent is supplied to the device and an information processing unit for processing luminescent signal data obtained by the imaging terminal. The imaging terminal and the information processing unit can bi-directionally communicate with each other via a network.

Abstract: A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

Abstract: Provided is a method of detecting a biological material, by which quantitative measurement can be performed easily. The method of detecting a biological material in a sample includes: mixing, with the sample, a fusion protein (C) in which a protein (A) capable of binding the biological material and a chemiluminescent protein (B) are fused together and a substrate for the chemiluminescent protein (B); and observing a luminescent signal from the sample, wherein the protein (A) and the protein (B) are linked in such a manner that resonance energy transfer can occur, the protein (A) is either a protein (A1) that can emit fluorescence in a state where the biological material is bound thereto or a protein (A2) capable of binding an autofluorescent molecule as the biological material, and the protein (B) can excite fluorescence or autofluorescence of the protein (A) with its luminescence energy.

Abstract: A biological specimen containing a chemiluminescence substance that generates chemiluminescence is observed in a living state under a microscope. The microscope includes a light source that outputs control light that changes the state of the chemiluminescence, a defining unit that defines the radiation pattern of the control light with which an observation surface of the biological specimen is irradiated, and a detector that detects the chemiluminescence from the biological specimen.

Abstract: A main body fixing member is disclosed. The main body fixing member fixes an endpin including a shaft portion having a first end housed in a musical instrument main body and a second end stood on a floor. The shaft portion is provided with a recess. The main body fixing member includes a fitting portion, a through hole through which the shaft portion of the endpin extends, an opening disposed orthogonal to the through hole and having a bottom surface, a columnar member, a biasing portion, and a pressing portion. The columnar member is provided with a hole through which the shaft portion extends, and an engagement protrusion engaged with the recess of the shaft portion. The engagement protrusion is formed on an inner surface of the hole. The pressing portion presses the shaft portion inserted into the through hole and the hole via the columnar member.

Abstract: A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

Abstract: A main body fixing member is disclosed. The main body fixing member fixes an endpin including a shaft portion having a first end housed in a musical instrument main body and a second end stood on a floor. The shaft portion is provided with a recess. The main body fixing member includes a fitting portion, a through hole through which the shaft portion of the endpin extends, an opening disposed orthogonal to the through hole and having a bottom surface, a columnar member, a biasing portion, and a pressing portion. The columnar member is provided with a hole through which the shaft portion extends, and an engagement protrusion engaged with the recess of the shaft portion. The engagement protrusion is formed on an inner surface of the hole. The pressing portion presses the shaft portion inserted into the through hole and the hole via the columnar member.

Abstract: A continuous coating device for continuously conveying a long film includes a coating roll, an imaging device and a coating head. The long film is wound onto the coating roll. The imaging device is configured to capture an image of a mark or a pattern on the long film wound onto the coating roll. The coating head is configured to coat the long film wound onto the coating roll with a specific pattern. The coating head is disposed downstream from the imaging device in a conveyance direction of the long film.

Abstract: A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.

Abstract: Provided are a device with excellent operability and portability and a determination system that uses the device. The present disclosure relates to a device including a reagent portion in which a chemiluminescent indicator and a chemiluminescent substrate for the indicator are disposed, and a base on which the reagent portion is formed. The chemiluminescent indicator and the chemiluminescent substrate are disposed independently from each other in the reagent portion in such a manner that the chemiluminescent indicator and the chemiluminescent substrate can react with each other when a sample is supplied to the reagent portion. The present disclosure also relates to a remote diagnosis system including an imaging terminal for detecting a luminescent signal generated when a reagent is supplied to the device and an information processing unit for processing luminescent signal data obtained by the imaging terminal.

Abstract: Provided is a method of detecting a biological material, by which quantitative measurement can be performed easily. The method of detecting a biological material in a sample includes: mixing, with the sample, a fusion protein (C) in which a protein (A) capable of binding the biological material and a chemiluminescent protein (B) are fused together and a substrate for the chemiluminescent protein (B); and observing a luminescent signal from the sample, wherein the protein (A) and the protein (B) are linked in such a manner that resonance energy transfer can occur, the protein (A) is either a protein (A1) that can emit fluorescence in a state where the biological material is bound thereto or a protein (A2) capable of binding an autofluorescent molecule as the biological material, and the protein (B) can excite fluorescence or autofluorescence of the protein (A) with its luminescence energy.

Abstract: A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.

Abstract: A biological specimen containing a chemiluminescence substance that generates chemiluminescence is observed in a living state under a microscope. The microscope includes a light source that outputs control light that changes the state of the chemiluminescence, a defining unit that defines the radiation pattern of the control light with which an observation surface of the biological specimen is irradiated, and a detector that detects the chemiluminescence from the biological specimen.

Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts

Abstract: A photo-switching fluorescent protein of a type in which wavelengths for switching fluorescence on and off and wavelength for fluorescence excitation are all independent of one another is provided, which has an amino acid sequence in which at least an S208G mutation is introduced into SEQ ID NO: 1. The fluorescent protein may have an amino acid sequence in which at least three mutations, I47V, M153T, and S208G, are introduced into SEQ ID NO: 1. The fluorescent protein may have an amino acid sequence in which at least five mutations, I47V, T59S, M153T, S208G, and M233T, are introduced into SEQ ID NO: 1. The fluorescent protein may have an amino acid sequence in which at least six mutations, I47V, T59S, M69Q, M153T, S208G, and M233T, are introduced into SEQ ID NO: 1.

Abstract: Provided is a fluorescent protein that has a fast photo-switching speed and a high photostability and that switches from a non-fluorescent state to a fluorescent state by being irradiated with light for fluorescence excitation and switches from a fluorescent state to a non-fluorescent state by being irradiated with light having a specific wavelength that does not cause fluorescence excitation. The present invention relates to (a) A protein having an amino acid sequence of Sequence ID No. 1. (b) A protein that has an amino acid sequence of Sequence ID No. 1 in which one to several amino acids are deleted, substituted, and/or added.

Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts