Abstract: Provided is an optical microscope capable of maintaining an objective lens in a focus state without adversely affecting a captured image even when a substance with a weak emission is used as an observation target object. The optical microscope includes an observation optical system capable of capturing, with an image pickup device (10), an optical image of an observation target object (1) that has been obtained with an objective lens (5), and sending out the optical image as an image signal; and an autofocus device that adjusts a focal position of the objective lens based on autofocus light emitted from a focusing light source (11) so as to focus on the observation target object, wherein the autofocus light is emitted from the focusing light source during a non-capturing period during which the image pickup device is not capturing an image of the observation target object.

Abstract: Provided is a fluorescent protein that has a fast photo-switching speed and a high photostability and that switches from a non-fluorescent state to a fluorescent state by being irradiated with light for fluorescence excitation and switches from a fluorescent state to a non-fluorescent state by being irradiated with light having a specific wavelength that does not cause fluorescence excitation. The present invention relates to (a) A protein having an amino acid sequence of Sequence ID No. 1. (b) A protein that has an amino acid sequence of Sequence ID No. 1 in which one to several amino acids are deleted, substituted, and/or added.

Abstract: Provided is an optical microscope capable of maintaining an objective lens in a focus state without adversely affecting a captured image even when a substance with a weak emission is used as an observation target object. The optical microscope includes an observation optical system capable of capturing, with an image pickup device (10), an optical image of an observation target object (1) that has been obtained with an objective lens (5), and sending out the optical image as an image signal; and an autofocus device that adjusts a focal position of the objective lens based on autofocus light emitted from a focusing light source (11) so as to focus on the observation target object, wherein the autofocus light is emitted from the focusing light source during a non-capturing period during which the image pickup device is not capturing an image of the observation target object.

Abstract: An impact absorbing body for attachment to a door trim is capable of bearing a collision load from an exterior panel at the time of a side collision. The impact absorbing body has a top face portion with linear edge portions and sidewall portions extending from the linear edge portions toward the door trim to provide a hollow box. The impact absorbing body also includes base portions connected to edge portions of the sidewall portions. The base portions are open toward the door trim and are attached to the door trim. The impact absorbing body also includes slits between adjacent sidewall portions, and the sidewall portions have outwardly slanted portions. In addition, rib members extend from the top face portion toward the base portion, toward the inside of the hollow box, and connect the adjacent sidewall portions.

Abstract: An impact absorbing body for attachment to a door trim is capable of bearing a collision load from an exterior panel at the time of a side collision. The impact absorbing body has a top face portion with linear edge portions and sidewall portions extending from the linear edge portions toward the door trim to provide a hollow box. The impact absorbing body also includes base portions connected to edge portions of the sidewall portions. The base portions are open toward the door trim and are attached to the door trim. The impact absorbing body also includes slits between adjacent sidewall portions, and the sidewall portions have outwardly slanted portions. In addition, rib members extend from the top face portion toward the base portion, toward the inside of the hollow box, and connect the adjacent sidewall portions.

Abstract: The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient ? of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient ?1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient ?2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17×10?6/° C. and not more than 110×10?6/° C.

Abstract: An airbag device in which a lid part over an opening formed in a base member opens in a suitable opening direction when the airbag is deployed. A tear seam is formed so as to extend along the axis line of a hinge shaft of the lid part in a region further to the outside than the opening. Detaching parts where a skin member on the base member detaches from the base member are provided to the outside region.

Abstract: In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin.

Abstract: Provided is a liquid crystal component manufacturing method wherein a gap between a panel surface of a liquid crystal module and a transparent cover is filled with a transparent resin, then, the liquid crystal module and the transparent cover are bonded by curing the resin. In the method, at the peripheral section of at least one surface of the panel surface and the facing surface of the transparent cover, the resin is applied, then, a dam is formed by semi-curing the resin. At the same time, the resin is applied to the center, the panel surface and the transparent cover are permitted to face, and the resin applied at the center is pushed to spread by reducing the gap between the facing panel surface and the transparent cover. The resin pushed to spread is dammed up by the dam, and the whole resin that exists in the gap is cured. An apparatus for manufacturing the liquid crystal component is also provided.

Abstract: In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin.

Abstract: In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin.

Abstract: An airbag device in which a lid part over an opening formed in a base member opens in a suitable opening direction when the airbag is deployed. A tear seam is formed so as to extend along the axis line of a hinge shaft of the lid part in a region further to the outside than the opening. Detaching parts where a skin member on the base member detaches from the base member are provided to the outside region.

Abstract: A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip.

Abstract: A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

Abstract: The electronic component integrated module includes a wiring board; an electronic component provided on the wiring board; solder for electrically connecting the electronic component onto the wiring substrate; and an encapsulating resin for encapsulating the electronic component and the solder. The average linear thermal expansion coefficient ? of the encapsulating resin, which is calculated by using the glass transition temperature of the encapsulating resin, a linear thermal expansion coefficient ?1 obtained at a temperature lower than the glass transition temperature, a linear thermal expansion coefficient ?2 obtained at a temperature exceeding the glass transition temperature, room temperature, and a peak temperature of reflow packaging of the electronic component integrated module, is not less than 17×106/° C. and not more than 110×10?6/° C.

Abstract: A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip.

Abstract: A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip.

Abstract: In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.