Abstract: Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Abstract: The present disclosure is a tension control device which includes a pressing member configured to press an object in a noncontact manner by spraying a gas onto the object to which tension is applied, an actuator configured to vary a position of the pressing member, a pressure sensor configured to detect pressure of the gas, a gap sensor configured to detect a floating amount of the object from the pressing member, and a control unit configured to control the actuator based on a detected value of the pressure sensor and a detected value of the gap sensor.

Abstract: The present disclosure is a conveyor device which feeds a thin workpiece from an unwinding roll and conveys the thin workpiece on a conveyance path. The conveyor device includes first movable holding members, fixed holding members, a cutting device, second movable holding members, a first position sensor, and a first correction mechanism.

Abstract: A conveyance device for levitating a subject body by a gas and conveying the subject body in a first direction is comprised of a levitation section emitting the gas to apply pressure on the subject body to levitate the subject body; a conveyance section comprising an endless belt elongated in the first direction and a plurality of projections projecting from the belt and capable of coming in contact with the subject body, and being configured to come in contact with and drive the subject body in the first direction; and a suction section elongated adjacent to and in parallel with the conveyance section or aligned with the conveyance section in a single straight line, the suction section applying negative pressure on the subject body to have the subject body in contact with the conveyance section.

Abstract: An oceanographic information collection system includes an anchor arranged on a sea bottom, an intermediate buoy connected to the anchor and floating in a sea, a mooring cable connected at one end to the intermediate buoy and at another end to an observation buoy. The observation buoy includes a main body whose longitudinal direction is arranged in a flowing direction of an ocean current. A specific gravity adjuster is arranged in the main body and includes an expandable and shrinkable buoyancy bag, an antenna arranged on the main body and transfers data, and an observation unit arranged in the main body and acquires prescribed oceanographic information. The observation buoy floats upward by expanding the buoyancy bag of the specific gravity adjuster, and sinks by shrinking the buoyancy bag in order to stand by in the sea. The buoy can easily float, sink and stand by in the sea.

Abstract: An underwater mobile body capable of acquiring information on hydrosphere and moving between a position under water and a water surface includes: a body unit provided with a data acquisition device that acquires hydrosphere information, and a specific gravity adjusting device that adjusts the position of the underwater mobile body under water; and an antenna unit arranged at a tail of the body unit and provided with an antenna that transmits the acquired hydrosphere information, wherein the antenna unit holds the antenna such that the antenna is able to turn in a vertical direction.

Abstract: In an electronic component mounting structure, a plurality of bumps formed on an electronic component is joined to a plurality of electrodes formed on a substrate by way of joining portions formed with the bumps and solder. Bonding portions bond the electronic component to the substrate and the bonding portions are formed of thermosetting materials obtained by curing thermosetting resins having a curing temperature which is lower than a melting point of the solder between the electronic component and the substrate. The thermosetting materials come in contact with a nearest-neighboring joining portion in the bonding portions.

Abstract: A conveyance device for levitating a subject body by a gas and conveying the subject body in a first direction is comprised of a levitation section emitting the gas to apply pressure on the subject body to levitate the subject body; a conveyance section comprising an endless belt elongated in the first direction and a plurality of projections projecting from the belt and capable of coming in contact with the subject body, and being configured to come in contact with and drive the subject body in the first direction; and a suction section elongated adjacent to and in parallel with the conveyance section or aligned with the conveyance section in a single straight line, the suction section applying negative pressure on the subject body to have the subject body in contact with the conveyance section.

Abstract: Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Abstract: An image decoding apparatus includes a plurality of decoders and (i) divides image data to decode into a plurality of pieces of partial data, (ii) acquires attribute information pieces each affecting decoding processing time of a corresponding one of the plurality of pieces of partial data, (iii) determines which of the plurality of decoders is caused to decode which of the plurality of pieces of partial data based on the attribute information pieces on the plurality of pieces of partial data and (iv) causes two or more of the plurality of decoders to decode two or more corresponding pieces of the partial data in parallel.

Abstract: An oceanographic information collection system includes an anchor arranged on a sea bottom, an intermediate buoy connected to the anchor and floating in a sea, a mooring cable connected at one end to the intermediate buoy and at another end to an observation buoy. The observation buoy includes a main body whose longitudinal direction is arranged in a flowing direction of an ocean current. A specific gravity adjuster is arranged in the main body and includes an expandable and shrinkable buoyancy bag, an antenna arranged on the main body and transfers data, and an observation unit arranged in the main body and acquires prescribed oceanographic information. The observation buoy floats upward by expanding the buoyancy bag of the specific gravity adjuster, and sinks by shrinking the buoyancy bag in order to stand by in the sea. The buoy can easily float, sink and stand by in the sea.

Abstract: Disclosed is an electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux; dispensing a thermosetting resin to at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon, to melt the bumps and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component to the substrate.

Abstract: The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four corners of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Abstract: A device for cutting a brittle member such as a glass is comprised of a laser oscillator configured to radiate a laser beam through a first space onto a first region on the brittle member; a cooling nozzle configured to expel a cooling medium onto a second region distinct from the first region on the brittle member; a baffle so disposed as to leave a gap between the member and the baffle and to have the first region not enclosed by the baffle, and so directed as to deflect a flow of a splash and a mist originating in the second region away from the first region; and a gas nozzle configured to expel a gas toward the gap.

Abstract: An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Abstract: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Abstract: A wiring board with a built-in component includes an insulating board, a first wiring pattern on an upper surface of the insulating board, plural electrodes on the upper surface of the insulating board, a solder resist on the upper surface of the insulating board, plural solders on the electrodes, respectively, an electronic component joined to the electrodes with the solders, a sealing resin provided between the insulating board and the electronic component, a component-fixing layer provided on the upper surface of the insulating board and the first wiring pattern and having an insulating property, a second wiring pattern on the component-fixing layer, and an interlayer wiring connecting the first wiring pattern to the second wiring pattern. The solder resist surrounds the electrodes. The sealing resin entirely covers the solders and the solder resist. This wiring board can be efficiently manufactured by simple processes.

Abstract: A method of mounting an electronic component allows bumps to land onto electrodes via thermosetting flux formed of first thermosetting resin containing a first active ingredient, and brings a resin reinforcing member formed of second thermosetting resin containing a second active ingredient into contact with the electronic component at reinforcement sections, and then heats the substrate to form solder junction sections that bond the bumps to the electrodes. At the same time, the method forms resin reinforcement sections that reinforce the solder junction sections from the surroundings. A mixing ratio of the second active ingredient in the resin reinforcing member is set greater than a mixing ratio of the first active ingredient in the thermosetting flux.

Abstract: To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particles 5 in a thermosetting resin 3a, a rigid substrate 1 and a flexible substrate 7 are bonded by the thermosetting resin 3a, and a first terminal 2 and a second terminal 8 are electrically connected by the solder particles 5, a blending ratio of an activator of the thermosetting resin 3a in the solder paste is properly set and oxide film removed portions 2b, 8b, and 5b are partially formed in oxide films 2a, 8a, and 5a of the first terminal 2, the second terminal 8, and the solder particles 5.

Abstract: To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particles 5 in a thermosetting resin 3a, a rigid substrate 1 and a flexible substrate 7 are bonded by the thermosetting resin 3a, and a first terminal 2 and a second terminal 8 are electrically connected by the solder particles 5, a blending ratio of an activator of the thermosetting resin 3a in the solder paste is properly set and oxide film removed portions 2b, 8b, and 5b are partially formed in oxide films 2a, 8a, and 5a of the first terminal 2, the second terminal 8, and the solder particles 5.