Patents by Inventor Youn-Soo Kim

Youn-Soo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177263
    Abstract: A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: November 16, 2021
    Inventors: Se-hyoung Ahn, Youn-soo Kim, Jae-hyoung Choi, Jae-wan Chang, Sun-min Moon, Jin-sun Lee
  • Patent number: 11150744
    Abstract: The present inventive concept relates to a smart controller which wirelessly communicates with a portable terminal so as to control the portable terminal, the smart controller comprising: a main button unit including a direction button for generating a first signal by being pressed laterally and a selection button, disposed at the central portion one side of the direction button, for generating a second signal by being pressed downward; and an auxiliary button unit including at least one button provided to change an operation mode of the main button unit or perform a particular function of the portable terminal.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: October 19, 2021
    Inventor: Youn Soo Kim
  • Publication number: 20210273039
    Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.
    Type: Application
    Filed: May 19, 2021
    Publication date: September 2, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Youn-soo KIM, Seung-min RYU, Chang-su WOO, Hyung-suk JUNG, Kyu-ho CHO, Youn-joung CHO
  • Publication number: 20210202693
    Abstract: A method of manufacturing a semiconductor device includes forming a preliminary lower electrode layer on a substrate, the preliminary lower electrode layer including a niobium oxide; converting at least a portion of the preliminary lower electrode layer to a first lower electrode layer comprising a niobium nitride by performing a nitridation process on the preliminary lower electrode layer; forming a dielectric layer on the first lower electrode layer; and forming an upper electrode on the dielectric layer.
    Type: Application
    Filed: March 12, 2021
    Publication date: July 1, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-goo KANG, Sang-yeol KANG, Youn-soo KIM, Jin-su LEE, Hyung-suk JUNG, Kyu-ho CHO
  • Patent number: 11043553
    Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: June 22, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn-soo Kim, Seung-min Ryu, Chang-su Woo, Hyung-suk Jung, Kyu-ho Cho, Youn-joung Cho
  • Publication number: 20210166886
    Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.
    Type: Application
    Filed: May 19, 2020
    Publication date: June 3, 2021
    Inventors: Jin Ho Hong, Youn Soo Kim, Oh Choon Kwon, Hyun Sub Oh
  • Publication number: 20210165499
    Abstract: The signal input device according to an embodiment of the present inventive concept may have effects in that the number of buttons included in the signal input device can be reduced because different types of input signals can be generated depending on a direction of a laterally pushed manipulation force, and a configuration can be simplified, a production cost can be significantly reduced and two or more input signals can be simultaneously generated because a laterally pushed manipulation force can be detected although a separate pressure sensor is not provided.
    Type: Application
    Filed: April 16, 2019
    Publication date: June 3, 2021
    Inventors: Youn Soo KIM, Ki Tae KIM
  • Publication number: 20210140048
    Abstract: A method of forming a material layer includes providing a substrate into a reaction chamber, providing a source material onto a substrate, the source material being a precursor of a metal or semimetal having a ligand, providing an ether-based modifier on the substrate, purging an inside of the reaction chamber, and reacting a reaction material with the source material to form the material layer.
    Type: Application
    Filed: January 20, 2021
    Publication date: May 13, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sun-min MOON, Youn-soo KIM, Han-jin LIM, Yong-jae LEE, Se-hoon OH, Hyun-jun KIM, Jin-sun LEE
  • Publication number: 20210141425
    Abstract: A patch type controller includes: a main body having a connection unit formed on the bottom surface or a side surface thereof, enabling connection to a mobile phone, a mobile phone case or a wireless communication device, and an input unit formed on the upper surface thereof, enabling control by a user; and a control unit for controlling the mobile phone or the wireless communication device by means of the input unit.
    Type: Application
    Filed: September 26, 2017
    Publication date: May 13, 2021
    Applicant: ITVERS CO., LTD.
    Inventors: Youn Soo KIM, Euy Sub HYUN
  • Patent number: 10978552
    Abstract: A method of manufacturing a semiconductor device includes forming a preliminary lower electrode layer on a substrate, the preliminary lower electrode layer including a niobium oxide; converting at least a portion of the preliminary lower electrode layer to a first lower electrode layer comprising a niobium nitride by performing a nitridation process on the preliminary lower electrode layer; forming a dielectric layer on the first lower electrode layer; and forming an upper electrode on the dielectric layer.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-goo Kang, Sang-yeol Kang, Youn-soo Kim, Jin-su Lee, Hyung-suk Jung, Kyu-ho Cho
  • Patent number: 10913754
    Abstract: A lanthanum compound, a method of synthesizing a thin film, and a method of manufacturing an integrated circuit device, the compound being represented by Formula 1 below, wherein, in Formula 1, R1 is a hydrogen atom or a C1-C4 linear or branched alkyl group, R2 and R3 are each independently a hydrogen atom or a C1-C5 linear or branched alkyl group, at least one of R2 and R3 being a C3-C5 branched alkyl group, and R4 is a hydrogen atom or a C1-C4 linear or branched alkyl group.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 9, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Gyu-hee Park, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Kazuki Harano, Haruyoshi Sato, Tsubasa Shiratori, Naoki Yamada
  • Patent number: 10882873
    Abstract: A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I): wherein R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: January 5, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DNF Co., Ltd.
    Inventors: Seung-min Ryu, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Myong-woon Kim, Kang-yong Lee, Sang-ick Lee, Sang-yong Jeon
  • Patent number: 10812127
    Abstract: A portable terminal case according to one embodiment of the present invention accommodates a portable terminal, and comprises an input button mounted on the portable terminal case, wherein the input button generates an input signal of the portable terminal.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: October 20, 2020
    Assignee: ITVERS CO., LTD.
    Inventor: Youn Soo Kim
  • Patent number: 10752645
    Abstract: A silicon-containing intermediate is synthesized by reacting a lanthanum tris[bis(trialkylsilyl)amide] complex with an alkylcyclopentadiene. A lanthanum compound is synthesized by reacting the silicon-containing intermediate with a dialkylamidine-based compound.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: August 25, 2020
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Gyu-hee Park, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Haruyoshi Sato, Naoki Yamada, Hiroyuki Uchiuzou
  • Publication number: 20200243531
    Abstract: A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 30, 2020
    Inventors: Se-hyoung Ahn, Youn-soo Kim, Jae-hyoung Choi, Jae-wan Chang, Sun-min Moon, Jin-sun Lee
  • Publication number: 20200209985
    Abstract: The present inventive concept relates to a smart controller which wirelessly communicates with a portable terminal so as to control the portable terminal, the smart controller comprising: a main button unit including a direction button for generating a first signal by being pressed laterally and a selection button, disposed at the central portion or one side of the direction button, for generating a second signal by being pressed downward; and an auxiliary button unit including at least one button provided to change an operation mode of the main button unit or perform a particular function of the portable terminal.
    Type: Application
    Filed: May 18, 2018
    Publication date: July 2, 2020
    Inventors: Youn Soo KIM, Euy Sub HYUN
  • Patent number: 10671184
    Abstract: A signal input device, according to one embodiment of the present invention, comprises: a base member including a bottom surface and a protruding part upwardly protruding from the bottom surface; a push button located on the upper side of the protruding part, and having a downward sidewall formed so as to cover the protruding part; a sensor unit provided on any one of an outer side surface of the protruding part or an inner side surface of the downward sidewall; and a contact point provided on the side, on which the sensor unit is not provided, of the outer side surface of the protruding part or on the inner side surface of the downward sidewall, wherein when the push button moves in a lateral direction, the sensor and the contact point come into contact with each other so as to generate a signal.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: June 2, 2020
    Assignee: ITVERS CO., LTD.
    Inventor: Youn Soo Kim
  • Patent number: 10636795
    Abstract: A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: April 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-hyoung Ahn, Youn-soo Kim, Jae-hyoung Choi, Jae-wan Chang, Sun-min Moon, Jin-sun Lee
  • Patent number: 10600643
    Abstract: A method of forming a thin film and an integrated circuit device, including forming a first reaction inhibiting layer chemisorbed on a first portion of a lower film by supplying a reaction inhibiting compound having a carbonyl group to an exposed surface of the lower film at a temperature of about 300° C. to about 600° C.; forming a first precursor layer of a first material chemisorbed on a second portion of the lower film at a temperature of about 300° C. to about 600° C., the second portion being exposed through the first reaction inhibiting layer; and forming a first monolayer containing the first material on the lower film by supplying a reactive gas to the first reaction inhibiting layer and the first precursor layer and removing the first reaction inhibiting layer from the surface of the lower film, and thus exposing the first portion.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 24, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gyu-hee Park, Youn-soo Kim, Hyun-jun Kim, Jin-sun Lee, Jae-soon Lim
  • Publication number: 20200091275
    Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.
    Type: Application
    Filed: July 24, 2019
    Publication date: March 19, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Youn-soo Kim, Seung-min Ryu, Chang-su Woo, Hyung-suk Jung, Kyu-ho Cho, Youn-joung Cho