Abstract: Disclosed are sensors for detecting a fingerprint and methods of manufacturing the sensor. The sensor for detecting a fingerprint includes a substrate, first conductor lines formed on a surface of the substrate, an insulating layer formed on the first conductor lines, and second conductor lines formed on the insulating layer. A width of the first conductor lines or a width of the second conductor lines is 1-10 ?m.

Abstract: A housing of a mobile device including a frame defining a perimeter of the mobile device, the frame including a first metal material and configured to operate as a first antenna for a first wireless communication, and a cover configured to cover one surface of the mobile device, the cover including a second metal material, and the cover and at least a portion of the frame configured to operate as a second antenna for a second wireless communication may be provided.

Abstract: A near field communication antenna included in a mobile device includes a body case and a loop antenna. The body case accommodates semiconductor devices included in the mobile device, and includes a metal material. The loop antenna is electrically connected to the body case. The loop antenna and a first portion of the body case form a signal path to perform a near field communication.

Abstract: A near field communication (NFC) antenna includes a first antenna electrode and a second antenna electrode, and a loop coil. The first and second antenna electrodes are formed on a first surface of a substrate. The loop coil is formed on the first surface of the substrate, is directly coupled between the first antenna electrode and the second antenna electrode, and includes a first plurality of turns. The first antenna electrode is located inside each of the plurality of turns of the loop coil, and the second antenna electrode is located outside each of the plurality of turns of the loop coil. An imaginary line passing through the first antenna electrode and the second antenna electrode is parallel to one of edges of the substrate. Each of the first plurality of turns of the loop coil does not overlap each other.

Abstract: Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

Abstract: Provided is a method of operating a camera connected to at least one another cameras via a communication network. The method includes: performing interfacing between the camera and the at least one another camera; controlling the camera to execute first at least one task which is allocated to the at least one another camera; and updating a job queue containing second at least one task which is allocated to the camera and the first at least one task which is allocated to the at least one another camera, wherein the performing interfacing, the controlling the camera and the updating the job queue are performed by running a program.

Abstract: Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Abstract: In one embodiment, the antenna arrangement includes a primary antenna having a conductive sidewall; and a loop antenna disposed in and physically separated from the primary antenna. The loop antenna includes a first conductive loop and a capacitor electrically connected between ends of the first conductive loop.

Abstract: A mobile apparatus includes a sensing handler and a processing handler. The sensing handler includes a plurality of sensing operators. The sensing operator senses data during a sensing time corresponding to a size of C-FRAME and stops sensing during a skip time. The C-FRAME is a sequence of the sensed data to produce a context monitoring result. The processing handler includes a plurality of processing operators. The processing operator executes the sensed data of the sensing operator in a unit of F-FRAME. The F-FRAME is a sequence of the sensed data to execute a feature extraction operation.

Abstract: A wearable electronic device according to example embodiments includes a display panel configured to display an image, a main board including a processor configured to control an operation of the wearable electronic device, a metal frame defining a perimeter of the wearable electronic device, the metal frame including a metal material, the metal frame having first and second terminals, the first terminal being adjacent to the second terminal with a slit therebetween, a loop antenna between the display panel and the main board, the loop antenna configured to connect to the first and second terminals of the metal frame, and a near field communication (NFC) chip configured to connect to the metal frame and the loop antenna, the NFC chip configured to perform a near field communication by transmitting or receiving an NFC signal using the metal frame and the loop antenna.

Abstract: A housing of a mobile device including a frame defining a perimeter of the mobile device, the frame including a first metal material and configured to operate as a first antenna for a first wireless communication, and a cover configured to cover one surface of the mobile device, the cover including a second metal material, and the cover and at least a portion of the frame configured to operate as a second antenna for a second wireless communication may be provided.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract: The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.

Abstract: Provided is a system and method for monitoring a student behavior in a field trip. The system may include: a plurality of member terminals held respectively by a plurality of members conducting a group activity and provided with a plurality of sensors, an imaging device, and a data storage device to collect and store behavior information of the members to match time information, the behavior information including location information, orientation information, view information, and motion information; at least one leader terminal held by a leader and configured to receive and store the behavior information of the members collected by the plurality of member terminals; and an analysis terminal configured to receive the behavior information from the at least one leader terminal and the plurality of member terminals.

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Abstract: The present invention relates to Rhizobium sp. KB10 strain having properties of promoting growth of Botryococcus braunii, which is an alga capable of producing biodiesel, and also enhancing production performance of biodiesel. Mores specifically, it relates to novel Rhizobium sp. KB10 strain which has properties of promoting growth of Botryococcus braunii used for biodiesel production and also enhancing content of C18 (i.e., oleate) corresponding to high quality biodiesel component as much as 900%. By using root colonizing bacteria like Rhizobium, it is possible to promote effectively the slow cell growth of Botryococcus braunii and increase as much as possible the oleate amount, which is a high quality biodiesel component. Further, by carrying out mixture culture using such bacteria, problems associated with contamination by other microorganisms during a process of producing biodiesel by culture in an outside environment can be dramatically solved.

Abstract: Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.