Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Abstract: Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

Abstract: There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.

Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract: Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other.

Abstract: A video recorder connected to a plurality of cameras and a plurality of client devices and a method of controlling the video recorder are provided. The method includes: setting a plurality of buffers, in a memory of the video recorder, corresponding to the plurality of cameras, respectively, and setting a plurality of positions in at least one buffer of the buffers for loading image data input from a corresponding camera of the plurality of cameras; loading, in the at least one buffer, the image data on given positions of the plurality of positions; and transmitting the loaded image data to the plurality of client devices so that each of the plurality of client devices receives the image data input from a same corresponding camera.

Abstract: Provided is a system and method for perceiving an outcast in a group. The system may include: a plurality of member terminals held, respectively, by a plurality of members conducting an outdoor activity and configured to transmit waves with a radio frequency; and a leader terminal held by a leader of the outdoor activity and configured to receive the waves transmitted from the plurality of member terminals, to sense intensities of the waves, to obtain distances between the plurality of member terminals from the sensed intensities of the waves, to calculate a group distance based on the obtained distances between the member terminals, to sort the plurality of member terminals into at least one subgroup, and to determine an outcast member terminal excluded from the at least one subgroup.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Abstract: Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

Abstract: Disclosed herein is a cooling system of a power semiconductor device. The cooling system of a power semiconductor device, which improves a cooling structure according to the related art to deprive heat generated from power devices while moving a working fluid introduced through an inlet to one direction and discharge the working fluid to an outlet, forms a branch inlet in a direction crossing a main inlet and additionally introduce the low-temperature working fluid through the branch inlet so as to be supplied to a channel to mix the working fluid supplied through the main inlet via the channel with the working fluid additionally introduced through the branch inlet around power devices, thereby improving a cooling effect.

Abstract: An image processing apparatus and method are provided. The image processing apparatus includes: at least one image input unit, to which a plurality of input images are input according to respective frame rates; and a controller that arranges an operation time and an operation order of each of tasks for processing a corresponding image of the plurality of input images according to the respective frame rates, and performs each of the tasks according to the operation time and the operation order.

Abstract: Disclosed herein is a power module package including: a base substrate; a metal layer including a circuit pattern and a connection pad formed on the base substrate; a semiconductor device including a plurality of electrodes mounted on the circuit pattern of the metal layer; and a plurality of lead frames formed on the connection pad of the metal layer and respectively connected to the plurality of electrodes of the semiconductor device.

Abstract: There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.