Abstract: Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract: Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract: Disclosed herein is a heat radiation system including: a frame; a partition plate disposed across the frame and including an inlet for supplying a cooling medium, a plurality of louvers extended radially from a circumference of the inlet, and a slot formed at a circumference of an edge thereof; a diffusion chamber defined by the frame and the partition plate; a lower plate disposed at a lower portion of the frame so as to be spaced apart from the partition plate by a predetermined interval and including an outlet for discharging the cooling medium; and a recovery chamber defined by the frame, the partition plate, and the lower plate and being in fluid communication with the diffusion chamber.

Abstract: Disclosed herein is a power semiconductor module including a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof, a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged, and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. Accordingly, stray inductance may be effectively reduced, and thus, current distribution between power devices may be balanced, thereby effectively preventing a surge voltage from increasing.

Abstract: A mobile apparatus includes a sensing handler and a processing handler. The sensing handler includes a plurality of sensing operators. The sensing operator senses data during a sensing time corresponding to a size of C-FRAME and stops sensing during a skip time. The C-FRAME is a sequence of the sensed data to produce a context monitoring result. The processing handler includes a plurality of processing operators. The processing operator executes the sensed data of the sensing operator in a unit of F-FRAME. The F-FRAME is a sequence of the sensed data to execute a feature extraction operation.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: The present disclosures relates to a control terminal, comprising: a data communication unit for receiving a first user voice by data communication with a first audio device and receiving a second user voice by data communication with a second audio device; a turn information generating unit for generating turn information, which is voice unit information, by using the first and second user voices; and a metalanguage processing unit for determining a conversation pattern of the first and second users by using the turn information, and outputting a reminder message corresponding to a reminder event to the first user when the conversation pattern corresponds to a preset reminder event occurrence condition.

Abstract: Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Abstract: A cover of a mobile device includes a metal structure disposed to cover one surface of the mobile device. The metal structure includes a metal material, and operates as an antenna for a wireless communication of the mobile device.

Abstract: Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion installed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.

Abstract: Provided are a multi-channel network camera surveillance system and a method of constructing the same. The multi-channel network camera surveillance system includes a master network camera including a photographing unit configured to capture an image and a storage unit configured to store first image data of the image captured by the photographing unit; a salve network camera which is connected to the master network camera and configured to capture an image and store second image data of the image captured by the slave network camera in the storage unit of the master network camera; and a client device which receives at least one of the first image data and the second image data from the master network camera.

Abstract: Provided is a method of operating a camera connected to at least one another cameras via a communication network. The method includes: performing interfacing between the camera and the at least one another camera; controlling the camera to execute first at least one task which is allocated to the at least one another camera; and updating a job queue containing second at least one task which is allocated to the camera and the first at least one task which is allocated to the at least one another camera, wherein the performing interfacing, the controlling the camera and the updating the job queue are performed by running a program.

Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

Abstract: A method for continuously removing scale from a hot-rolled carbon steel strip includes: cracking the scale on the hot-rolled steel strip; shot-blasting the cracked scale to remove the scale; deforming the hot-rolled steel strip so as to weaken the bond between scale remaining after the shot-blasting and the hot-rolled steel strip and so as to impart surface roughness to the hot-rolled steel sheet; and polishing the deformed hot-rolled steel strip to remove the remaining scale.

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Abstract: Provided is a system and method for monitoring a student behavior in a field trip. The system may include: a plurality of member terminals held respectively by a plurality of members conducting a group activity and provided with a plurality of sensors, an imaging device, and a data storage device to collect and store behavior information of the members to match time information, the behavior information including location information, orientation information, view information, and motion information; at least one leader terminal held by a leader and configured to receive and store the behavior information of the members collected by the plurality of member terminals; and an analysis terminal configured to receive the behavior information from the at least one leader terminal and the plurality of member terminals.