Patents by Inventor Youngsik Hur

Youngsik Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013911
    Abstract: An antenna apparatus includes: a first dielectric layer having a first dielectric constant; a first patch antenna pattern disposed in the first dielectric layer; a second dielectric layer having a second dielectric constant; a second patch antenna pattern disposed on the second dielectric layer; a first feed via coupled to the first patch antenna pattern; and a second feed via coupled to the second patch antenna pattern. The first dielectric constant is higher than the second dielectric constant, and a frequency of a signal transmitted/received by the first patch antenna pattern is lower than a frequency of a signal transmitted/received by the second patch antenna pattern.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 13, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woncheol LEE, Youngsik HUR, Wongi KIM, Jeongki RYOO, Nam Ki KIM, Sungyong AN, Jaemin KEUM, Dongok KO
  • Publication number: 20220013914
    Abstract: An antenna apparatus including: a first insulation layer defining a cavity; an antenna and an electronic element disposed in the cavity of the first insulation layer; a second insulation layer disposed on a first surface facing a first direction among surfaces of the antenna and on a second surface facing the first direction among surfaces of the electronic element; and a connection wire disposed on a third surface facing the first direction among surfaces of the second insulation layer and configured to electrically connect the antenna and the electronic element. The connection wire is disposed on the second insulation layer, is disposed within a first contact hole overlapping the electronic element, and overlaps the antenna.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 13, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Woo HAN, Youngsik HUR, Se Jong KIM, Wongi KIM, Woncheol LEE, Jeongki RYOO, Jinseon PARK, Soo-Ki CHOI, Hotaek SONG
  • Publication number: 20220013909
    Abstract: An antenna device including: a ground plane; an antenna pattern overlapping the ground plane with respect to a first direction; a dielectric layer interposed between the ground plane and the antenna pattern; a feed via coupled with the antenna pattern and penetrating at least a portion of the dielectric layer; a ground via connected to the ground plane and penetrating at least a portion of the dielectric layer; and a ground pattern extending from the ground via and disposed adjacent to a lateral surface of the feed via in a second direction that forms a predetermined angle with the first direction.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 13, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki KIM, Woncheol LEE, Dongok KO, Jaemin KEUM, Jeongki RYOO, Youngsik HUR
  • Publication number: 20220013915
    Abstract: A dielectric resonator antenna includes: a first dielectric block; at least one second dielectric block stacked on the first dielectric block in a first direction; and a feed unit disposed in the first dielectric block. A side surface of the first dielectric block facing a second direction crossing the first direction is exposed to an outside of the dielectric resonator antenna.
    Type: Application
    Filed: February 16, 2021
    Publication date: January 13, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Woo HAN, Youngsik HUR, Jeongki RYOO, Hyungjin LEE, Woncheol LEE, Wongi KIM
  • Publication number: 20210408248
    Abstract: A radio frequency (RF) switch is provided. The RF switch is configured to switch a RF signal input to a first terminal. The RF switch includes a first transistor, disposed at a first distance from the first terminal, and configured to switch the RF signal, and a second transistor, disposed at a second distance from the first terminal, and configured to switch the RF signal. The first distance is shorter than the second distance, and a number of first contact vias formed in a first electrode in the first transistor is greater than a number of second contact vias formed in a second electrode of the second transistor.
    Type: Application
    Filed: February 5, 2021
    Publication date: December 30, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jongmo LIM, Wonsun HWANG, Byeonghak JO, Yoosam NA, Youngsik HUR
  • Publication number: 20210296222
    Abstract: A method of manufacturing a semiconductor package includes preparing a core substrate having an upper surface and a lower surface, and including a cavity. A passive component is disposed in the cavity. A first insulating layer is formed on the upper surface of the core substrate and in the cavity and encapsulates the passive component. Through-vias are formed that penetrate the core substrate and the first insulating layer, and a first wiring layer is formed on the first insulating layer. The first wiring layer connects the through-vias and the passive component. A connection structure including an insulating member is formed on the first insulating layer and a redistribution layer is formed in the insulating member. The redistribution layer is connected to the first wiring layer. A semiconductor chip is disposed on an upper surface of the connection structure. The semiconductor chip has connection pads connected to the redistribution layer.
    Type: Application
    Filed: May 28, 2021
    Publication date: September 23, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junghyun CHO, Youngsik Hur, Youngkwan Lee, Jongrok Kim
  • Patent number: 11031328
    Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junghyun Cho, Youngsik Hur, Youngkwan Lee, Jongrok Kim
  • Publication number: 20200286818
    Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.
    Type: Application
    Filed: December 20, 2019
    Publication date: September 10, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junghyun Cho, Youngsik Hur, Youngkwan Lee, Jongrok Kim
  • Publication number: 20200219833
    Abstract: A semiconductor package may include: a connection structure including an insulating member having a first surface having a recess portion and a second surface opposing the first surface, a plurality of first pads disposed on a bottom surface of the recess portion, a plurality of second pads embedded in the second surface of the insulating member, and a redistribution layer disposed between the plurality of first pads and the plurality of second pads and connected to the plurality of first and second pads; a semiconductor chip disposed on the first surface of the insulating member and having a plurality of connection electrodes electrically connected, respectively, to the plurality of first pads; and a passivation layer disposed on the second surface of the insulating member and having a plurality of openings exposing, respectively, the plurality of second pads.
    Type: Application
    Filed: December 5, 2019
    Publication date: July 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngkwan LEE, Youngsik HUR, Junghyun Cho, Taehee Han, Jongrok Kim
  • Publication number: 20200185321
    Abstract: A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.
    Type: Application
    Filed: November 15, 2019
    Publication date: June 11, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngkwan LEE, Youngsik HUR, Taehee HAN
  • Publication number: 20200168570
    Abstract: A biological information detecting apparatus includes: an LC resonant pressure sensor including a resonant circuit including a capacitor and an inductor, and having a resonant frequency that changes depending on a change in external pressure applied to the capacitor; and an integrated circuit (IC) chip package including a coil type antenna radiating a radio frequency (RF) signal within a preset frequency band, wherein a change in the resonant frequency results in a change in a power transmission rate depending on a inductive coupling between the resonant frequency and a frequency of the RF signal. The IC chip package includes the coil type antenna disposed in a region overlapping the LC resonant pressure sensor in a plan view of the IC chip package.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 28, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonwook SO, Youngsik HUR, Yongho BAEK, Jungchul GONG, Dooil KIM
  • Publication number: 20200168518
    Abstract: A semiconductor package includes: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame; a first connection structure on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a first semiconductor chip on the first connection structure within the cavity; an encapsulant encapsulating the first semiconductor chip and covering the second surface of the frame; a second connection structure including a second redistribution layer including a first redistribution pattern and first connection vias; and a second semiconductor chip disposed on the second connection structure and having connection pads connected to the second redistribution layer.
    Type: Application
    Filed: November 12, 2019
    Publication date: May 28, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngkwan LEE, Youngsik Hur, Taehee Han, Yonghoon Kim, Yuntae Lee
  • Patent number: 9190851
    Abstract: Systems and methods pertaining to wireless power transfer are disclosed. Specifically, disclosed herein are calibration procedures that incorporate transmission of a reference power charge from a wireless power charger to permit determination of an optimized receiver circuitry configuration in one or more wirelessly chargeable devices. The result of the calibration procedures may then be used by the wireless charger to assign various frequencies to several wirelessly chargeable devices so as to optimally transfer a steady state power charge at one or more frequencies to the wirelessly chargeable devices.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 17, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS
    Inventors: Dukhyun Kim, Yun Ho Lee, Youngsik Hur
  • Patent number: 9035601
    Abstract: Systems and methods pertaining to wireless power transfer are disclosed. In one implementation, a system includes a wireless charger that is used to charge at least one wirelessly chargeable device. The wireless charger includes a master communication system and at least one wireless power charge transmitter, while the wirelessly chargeable device includes a slave wireless communication system configured at least in part, for communicating with the master wireless communication system in order to execute a wireless power charging operation. The wirelessly chargeable device further includes a wireless power charge receiver configured to receive a wireless power charge from the wireless power charge transmitter contained in the wireless charger.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: May 19, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS
    Inventors: Dukhyun Kim, Yun Ho Lee, Youngsik Hur
  • Patent number: 8674486
    Abstract: Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: March 18, 2014
    Assignee: Samsung Electro-Mechanics
    Inventors: Geoffrey T Haigh, Matthew Kuhn, Patrick Melet, Romain Pelard, Jae Joon Chang, Youngsik Hur
  • Patent number: 8599970
    Abstract: A received RF signal is down-converted to a baseband or low-IF digitized signal in order to search for a pilot signal that indicates a presence of a DTV signal such as an ATSC DTV signal. The pilot signal characteristically resides in a fixed frequency range for all valid DTV signals and is extracted by processing the baseband or low-IF signal in multiple stages. The first stage reduces signal information to that pertaining to the frequency band covering all valid pilot frequencies, thereby reducing the sampling rate and computational complexity of subsequent operations. A second stage operates on this reduced rate signal to focus on a series of particular pilot frequencies for interrogation. For each such candidate frequency, the cyclostationarity of the signal is measured and tested for statistical significance relative to the background energy to yield an effective test that is invariant with respect to background noise level.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: December 3, 2013
    Assignee: Samsung Electro-Mechanics
    Inventors: Andrew Joo Kim, Seungmok Oh, Matthew Kuhn, Bob Nayar, Youngsik Hur
  • Patent number: 8565681
    Abstract: Embodiments of the invention may provide for reducing interference in the front-end of a communications receiver. The cancellation circuitry may be utilized in conjunction with a preliminary rejection filter for improved rejection of out-of-band interference from other radio services or circuitry. The cancellation circuit may be placed in parallel with the preliminary rejection filter and may enhance suppression at the interference frequency by matching the gain and phase of the preliminary rejection filter prior to subtracting the matched signal from the preliminary rejection filter output. The cancellation circuit need not necessary know beforehand the characteristics of the preliminary rejection filter, the interference source, or the coupling mechanism, as it may adapt to unknown or varying interferers by adapting the matching gain and phase values based on the output of the preliminary rejection filter at tap points occurring both before and after application of the cancellation signal.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: October 22, 2013
    Assignee: Samsung Electro-Mechanics
    Inventors: Andrew Joo Kim, Yunseo Park, Seongmo Yim, Youngsik Hur
  • Patent number: 8521090
    Abstract: Embodiments of the invention may provide for reducing interference in the front-end of a communications receiver. The cancellation circuitry may be utilized in conjunction with a preliminary rejection filter for improved rejection of out-of-band interference from other radio services or circuitry. The cancellation circuit may be placed in parallel with the preliminary rejection filter and may enhance suppression at the interference frequency by matching the gain and phase of the preliminary rejection filter prior to subtracting the matched signal from the preliminary rejection filter output. The cancellation circuit need not necessary know beforehand the characteristics of the preliminary rejection filter, the interference source, or the coupling mechanism, as it may adapt to unknown or varying interferers by adapting the matching gain and phase values based on the output of the preliminary rejection filter at tap points occurring both before and after application of the cancellation signal.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: August 27, 2013
    Assignee: Samsung Electro-Mechanics
    Inventors: Andrew Joo Kim, Yunseo Park, Seongmo Yim, Youngsik Hur
  • Publication number: 20130170840
    Abstract: A communication system includes a hybrid signal transmitter incorporating a signal routing circuit and a driver circuit. The signal routing circuit is configured to receive a first input signal and route the first input signal through a first signal path when the frequency bandwidth of the input signal is lower than a threshold frequency and through a second signal path when the frequency bandwidth exceeds the threshold frequency. The second signal path includes a frequency down-converter circuit. The driver circuit is configured to receive the routed input signal via the first signal path or the second signal path, and convert the routed input signal into an optical signal for coupling into an optical fiber.
    Type: Application
    Filed: July 27, 2012
    Publication date: July 4, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS COMPANY, LTD.
    Inventors: Jae Joon Chang, Youngsik Hur
  • Publication number: 20130154071
    Abstract: Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 20, 2013
    Applicant: Samsung Electro-Mechanics Company, Ltd.
    Inventors: Geoffrey T. Haigh, Matthew Kuhn, Patrick Melet, Romain Pelard, Jae Joon Chang, Youngsik Hur