Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.

Abstract: A semiconductor package includes: an interposer substrate including a core substrate and a connection structure, the core substrate having a cavity and having through-vias connecting upper and lower surfaces thereof, and the connection structure including an insulating member on the upper surface and a redistribution layer on the insulating member; a semiconductor chip on an upper surface of the connection structure and including connection pads connected to the redistribution layer; a passive component accommodated in the cavity; a first insulating layer disposed between the core substrate and the connection structure; a first wiring layer on the first insulating layer and connecting the through-vias and the passive component to the redistribution layer; a second insulating layer on the lower surface of the core substrate; and a second wiring layer on a lower surface of the second insulating layer and connected to the through-vias.

Abstract: A semiconductor package may include: a connection structure including an insulating member having a first surface having a recess portion and a second surface opposing the first surface, a plurality of first pads disposed on a bottom surface of the recess portion, a plurality of second pads embedded in the second surface of the insulating member, and a redistribution layer disposed between the plurality of first pads and the plurality of second pads and connected to the plurality of first and second pads; a semiconductor chip disposed on the first surface of the insulating member and having a plurality of connection electrodes electrically connected, respectively, to the plurality of first pads; and a passivation layer disposed on the second surface of the insulating member and having a plurality of openings exposing, respectively, the plurality of second pads.

Abstract: A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.

Abstract: A semiconductor package includes: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame; a first connection structure on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a first semiconductor chip on the first connection structure within the cavity; an encapsulant encapsulating the first semiconductor chip and covering the second surface of the frame; a second connection structure including a second redistribution layer including a first redistribution pattern and first connection vias; and a second semiconductor chip disposed on the second connection structure and having connection pads connected to the second redistribution layer.

Abstract: A biological information detecting apparatus includes: an LC resonant pressure sensor including a resonant circuit including a capacitor and an inductor, and having a resonant frequency that changes depending on a change in external pressure applied to the capacitor; and an integrated circuit (IC) chip package including a coil type antenna radiating a radio frequency (RF) signal within a preset frequency band, wherein a change in the resonant frequency results in a change in a power transmission rate depending on a inductive coupling between the resonant frequency and a frequency of the RF signal. The IC chip package includes the coil type antenna disposed in a region overlapping the LC resonant pressure sensor in a plan view of the IC chip package.

Abstract: Systems and methods pertaining to wireless power transfer are disclosed. Specifically, disclosed herein are calibration procedures that incorporate transmission of a reference power charge from a wireless power charger to permit determination of an optimized receiver circuitry configuration in one or more wirelessly chargeable devices. The result of the calibration procedures may then be used by the wireless charger to assign various frequencies to several wirelessly chargeable devices so as to optimally transfer a steady state power charge at one or more frequencies to the wirelessly chargeable devices.

Abstract: Systems and methods pertaining to wireless power transfer are disclosed. In one implementation, a system includes a wireless charger that is used to charge at least one wirelessly chargeable device. The wireless charger includes a master communication system and at least one wireless power charge transmitter, while the wirelessly chargeable device includes a slave wireless communication system configured at least in part, for communicating with the master wireless communication system in order to execute a wireless power charging operation. The wirelessly chargeable device further includes a wireless power charge receiver configured to receive a wireless power charge from the wireless power charge transmitter contained in the wireless charger.

Abstract: Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

Abstract: A received RF signal is down-converted to a baseband or low-IF digitized signal in order to search for a pilot signal that indicates a presence of a DTV signal such as an ATSC DTV signal. The pilot signal characteristically resides in a fixed frequency range for all valid DTV signals and is extracted by processing the baseband or low-IF signal in multiple stages. The first stage reduces signal information to that pertaining to the frequency band covering all valid pilot frequencies, thereby reducing the sampling rate and computational complexity of subsequent operations. A second stage operates on this reduced rate signal to focus on a series of particular pilot frequencies for interrogation. For each such candidate frequency, the cyclostationarity of the signal is measured and tested for statistical significance relative to the background energy to yield an effective test that is invariant with respect to background noise level.

Abstract: Embodiments of the invention may provide for reducing interference in the front-end of a communications receiver. The cancellation circuitry may be utilized in conjunction with a preliminary rejection filter for improved rejection of out-of-band interference from other radio services or circuitry. The cancellation circuit may be placed in parallel with the preliminary rejection filter and may enhance suppression at the interference frequency by matching the gain and phase of the preliminary rejection filter prior to subtracting the matched signal from the preliminary rejection filter output. The cancellation circuit need not necessary know beforehand the characteristics of the preliminary rejection filter, the interference source, or the coupling mechanism, as it may adapt to unknown or varying interferers by adapting the matching gain and phase values based on the output of the preliminary rejection filter at tap points occurring both before and after application of the cancellation signal.

Abstract: Embodiments of the invention may provide for reducing interference in the front-end of a communications receiver. The cancellation circuitry may be utilized in conjunction with a preliminary rejection filter for improved rejection of out-of-band interference from other radio services or circuitry. The cancellation circuit may be placed in parallel with the preliminary rejection filter and may enhance suppression at the interference frequency by matching the gain and phase of the preliminary rejection filter prior to subtracting the matched signal from the preliminary rejection filter output. The cancellation circuit need not necessary know beforehand the characteristics of the preliminary rejection filter, the interference source, or the coupling mechanism, as it may adapt to unknown or varying interferers by adapting the matching gain and phase values based on the output of the preliminary rejection filter at tap points occurring both before and after application of the cancellation signal.

Abstract: A communication system includes a hybrid signal transmitter incorporating a signal routing circuit and a driver circuit. The signal routing circuit is configured to receive a first input signal and route the first input signal through a first signal path when the frequency bandwidth of the input signal is lower than a threshold frequency and through a second signal path when the frequency bandwidth exceeds the threshold frequency. The second signal path includes a frequency down-converter circuit. The driver circuit is configured to receive the routed input signal via the first signal path or the second signal path, and convert the routed input signal into an optical signal for coupling into an optical fiber.

Abstract: Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

Abstract: A communication system includes a configurable transceiver that accommodates multi-band, multi-format signals by incorporating a duplex transceiver circuit, a simplex transceiver circuit and at least two switches. A first switch may be operated so as to configure the configurable transceiver to propagate duplex signals, such as for example, frequency division multiplexed (FDD) signals. The second switch may be operated so as to configure the simplex transceiver circuit to provide signal propagation of various types of signals in either a receive direction or a transmit direction. The various types of signals include time division multiplexed (TDD) signals.

Abstract: Systems and methods pertaining to multi-frequency wireless power transfer are disclosed. In one exemplary implementation, a wireless charger is used to generate and transmit two wireless power charges at two different frequencies, using a frequency division multiplexed (FDM) format. A wireless sly chargeable device that is inductively coupled to the wireless charger receives the two wireless power charges in the FDM format and uses the two charges to charge one or more chargeable batteries contained in the wirelessly chargeable device.

Abstract: Systems and methods pertaining to wireless power transfer are disclosed. Specifically, disclosed herein are calibration procedures that incorporate transmission of a reference power charge from a wireless power charger to permit determination of an optimized receiver circuitry configuration in one or more wirelessly chargeable devices. The result of the calibration procedures may then be used by the wireless charger to assign various frequencies to several wirelessly chargeable devices so as to optimally transfer a steady state power charge at one or more frequencies to the wirelessly chargeable devices.

Abstract: Payment systems and methods for providing a wireless power charge are disclosed. In one exemplary implementation, a system includes a wireless charger that is used to provide a power charge to a wirelessly chargeable device. Prior to providing the power charge to the wirelessly chargeable device, the wireless charger obtains payment-related information from the wirelessly chargeable device using near field communications (NFC), and transmits this payment-related information to a payment center via a network such as the Internet. The payment center uses the information to either deny or authorize the power charge operation. If authorized, an authorization indication is provided to the wireless charger via the network, and the wireless charger then wirelessly transmits a suitable power charge to the wirelessly chargeable device.

Abstract: Systems and methods pertaining to wireless power transfer are disclosed. In one implementation, a system includes a wireless charger that is used to charge at least one wirelessly chargeable device. The wireless charger includes a master communication system and at least one wireless power charge transmitter, while the wirelessly chargeable device includes a slave wireless communication system configured at least in part, for communicating with the master wireless communication system in order to execute a wireless power charging operation. The wirelessly chargeable device further includes a wireless power charge receiver configured to receive a wireless power charge from the wireless power charge transmitter contained in the wireless charger.

Abstract: Embodiments of the invention may provide for reducing interference in the front-end of a communications receiver. The cancellation circuitry may be utilized in conjunction with a preliminary rejection filter for improved rejection of out-of-band interference from other radio services or circuitry. The cancellation circuit may be placed in parallel with the preliminary rejection filter and may enhance suppression at the interference frequency by matching the gain and phase of the preliminary rejection filter prior to subtracting the matched signal from the preliminary rejection filter output. The cancellation circuit need not necessary know beforehand the characteristics of the preliminary rejection filter, the interference source, or the coupling mechanism, as it may adapt to unknown or varying interferers by adapting the matching gain and phase values based on the output of the preliminary rejection filter at tap points occurring both before and after application of the cancellation signal.