Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: In general, one or more loads, such as a sensor suite of an autonomous (or semi-autonomous) vehicle, may be configured to draw power from a supercapacitor. A switching mechanism can selectively connect or disconnect the one or more loads and the supercapacitor from a voltage source of a vehicle power system. By systematically disconnecting the voltage source from the supercapacitor and the one or more loads, the exposure of the voltage source to the one or more loads is minimized. Accordingly, the exposure of the voltage source of the vehicle power system to potentially damaging short circuits or power surges that may arise in relation to the one or more loads can also be minimized.

Abstract: Certain aspects provide a circuit for analog-to-digital conversion. The circuit generally includes a flash analog-to-digital converter (ADC) having a plurality of comparators, each comparator being configured to compare an input voltage to a reference voltage; and a calibration circuit coupled to the flash ADC and configured to tune the reference voltage prior to a conversion operation by the flash ADC.

Abstract: A method of forming a semiconductor device includes forming a source/drain region on a substrate and forming a first interlayer dielectric (ILD) layer over the source/drain region. The method further includes forming a second ILD layer over the first ILD layer, forming a source/drain contact structure within the first ILD layer and the second ILD layer, and selectively removing a portion of the source/drain contact structure to form a concave top surface of the source/drain contact structure.

Abstract: Provided is a graphene additive, having a viscosity between 1000 and 40000 cps and a grind fineness not greater than 15 ?m, and comprising: nano-graphene sheets and a silane coupling agent, wherein a weight ratio of the nano-graphene sheets to the silane coupling agent is 0.1-15:99.9-85, and carbon atoms on a surface of the nano-graphene sheets form chemical bonds Si—O—C with oxygen substituents of the silane coupling agent. The present application further provides a method of preparing the graphene additive.

Abstract: An exercise mat includes a fabric layer including holes and having a joining surface on a first surface and a sweat absorbing surface on a second surface; and an elastic slip resistant layer having a slip resistant surface on a first surface and a joining surface on a second surface. The joining surface of the elastic slip resistant layer includes slip resistant protuberances each disposed in the hole.

Abstract: The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

Abstract: A method of medical image registration is to be implemented by a computer device, and includes steps of: obtaining an ultrasound target image corresponding to an area of interest in an ultrasound image; for each of multiple computed tomography (CT) images, obtaining a CT candidate image that corresponds to an area of interest in the CT image; for each of the CT candidate images, calculating a similarity between the CT candidate image and the ultrasound target image; making one of the CT candidate images that corresponds to the greatest similarity among the CT candidate images serve as a CT target image; and performing image registration on the ultrasound target image and the CT target image.

Abstract: A light-emitting diode includes: a light emitting epitaxial structure including a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and having a first surface as a light emitting surface, and an opposing second surface; a conducting layer formed over the second surface and including a physical plating layer and a chemical plating layer, wherein the physical plating layer is adjacent to the light emitting epitaxial structure and has cracks, and the chemical plating layer fills the cracks in the physical plating layer; and a submount coupled to the light emitting epitaxial laminated layer through the conducting layer.

Abstract: A photosensitive device includes a semiconductor substrate and a photodiode. The semiconductor substrate has a patterned semiconductor polarizer having a semiconductor surface. The photodiode is in the semiconductor substrate.

Abstract: A microelectromechanical gyroscope system is provided. The system includes a first substrate, a second substrate, and a third substrate. The substrates respectively have a first fixing, a second fixing, and a third fixing surfaces. The system further includes a first sensing, a second sensing and a third sensing module boards respectively fixed to the fixing surfaces. Each sensing module board has several microelectromechanical gyroscopes. A signal processing control board is electrically connected to the first sensing module board, the second sensing module board, and the third sensing module board. Wherein the first substrate, the second substrate, and the third substrate are perpendicular to each other. With the above structure, on each system coordinate axis of the microelectromechanical gyroscope system, at least one gyroscope is aligned with it for data acquisition and measurement. Accordingly, the measurement accuracy of the system is improved.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination type ionic compound with a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.

Abstract: An image sensor that includes a substrate is provided. A photodiode is formed in the substrate and in a pixel region. Storage devices are formed in the substrate and adjacent to the photodiode. Deep trench isolation walls penetrate the substrate to isolate the photodiode from the storage devices. A circuit layer is disposed on a first surface of the substrate and connected to the photodiode and the storage devices. A shielding structure is disposed on a second surface of the substrate to shield of the storage devices. A material layer is disposed above the second surface of the substrate. A lens is disposed on the material layer and configured to receive incident light and transmit the incident light to the photodiode.

Abstract: In general, one or more loads on a vehicle can be connected to both a first voltage source on the vehicle and a backup vehicle power system on the vehicle. If the voltage provided by the first voltage source to the one or more loads satisfies a voltage threshold, the backup vehicle power system does not provide power to the one or more loads. However, if the voltage provided by the first voltage source to the one or more loads falls below the voltage threshold, the backup vehicle power system provides power to the one or more loads.

Abstract: Provided are a computer program product, system, and method for replaying interactions with a graphical user interface (GUI) presented in a video stream of the GUI. Interaction with a rendered graphical user interface (GUI) to control an application is recorded to generate a video stream. In response to activation of a graphical element in the rendered GUI, an event action is rendered indicating a display region in which the graphical element was activated and a section of the video stream in which the activation of the graphical element occurred. The video stream is rendered. Selection is detected of a display region of the rendered video stream comprising the display region in the event action. The section of the video stream indicated in the event action is rendered in response to the selection of the display region indicated in the event action.

Abstract: A resin composition includes: (A) a vinyl-containing polyphenylene ether resin; (B) a resin of Formula (1); and (C) an inorganic filler. Moreover, also provided is an article made from the resin composition described above, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dissipation factor, comparative tracking index, X-axis thermal expansion coefficient, and temperature coefficient of dielectric constant.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: An image sensor that includes a substrate is provided. A photodiode is formed in the substrate and in a pixel region. Storage devices are formed in the substrate and adjacent to the photodiode. Deep trench isolation walls penetrate the substrate to isolate the photodiode from the storage devices. A circuit layer is disposed on a first surface of the substrate and connected to the photodiode and the storage devices. A shielding structure is disposed on a second surface of the substrate to shield of the storage devices. A material layer is disposed above the second surface of the substrate. A lens is disposed on the material layer and configured to receive incident light and transmit the incident light to the photodiode.

Abstract: A method of medical image registration is to be implemented by a computer device, and includes steps of: obtaining an ultrasound target image corresponding to an area of interest in an ultrasound image; for each of multiple computed tomography (CT) images, obtaining a CT candidate image that corresponds to an area of interest in the CT image; for each of the CT candidate images, calculating a similarity between the CT candidate image and the ultrasound target image; making one of the CT candidate images that corresponds to the greatest similarity among the CT candidate images serve as a CT target image; and performing image registration on the ultrasound target image and the CT target image.