Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: A radio frequency circuit with font routing to replace a resistor includes a routing layer and a ground layer. The routing layer includes a first pad, a second pad and a font routing unit. The second pad is corresponding to the first pad. The font routing unit is connected between the first pad and the second pad, and has a trace width. The trace width is less than a 50 ohm trace width. The ground layer is disposed below the routing layer and is separated from the routing layer by a height. The font routing unit has a second equivalent impedance at the radio frequency, the second equivalent impedance is determined according to the trace width, the height and the radio frequency, and the second equivalent impedance is the same or similar to a first equivalent impedance.

Abstract: An electronic device includes a display module, a protection cover, a light shielding layer on a bottom surface of the protection cover, a light source on the display module, a light guide plate on the display module and adjacent to the light source, a touch sensitive film above the light guide plate and having a first opening, a first optical adhesive between the touch sensitive film and the protection cover and having a second opening overlapping and communicated with the first opening, and a light shielding element having a portion overlapping the first and second openings. The light shielding element is located on the display module, extends to said portion of the light shielding layer, and is configured to block light passing through the light guide plate, the touch sensitive film, and the first optical adhesive in a non-visible area.

Abstract: A high-speed additive manufacturing apparatus includes a main body, a sintering module, a product carrying member, a raw material carrying member, and a raw material wiper. The main body includes a printing tank and a raw material tank adjacent to the printing tank. The sintering module is arranged on the main body. The sintering module includes a plurality of sintering light source assemblies. Each of the sintered light source assemblies has a light beam emitting end. The light beam emitting end emits a sintering light beam. The light beam emitting ends of the sintering light source assemblies are arranged in a plurality of rows. Each light beam emitting end in one row is unaligned with the light beam emitting end in adjacent rows along a direction in which the light beam emitting end moves.

Abstract: A method for correcting critical dimension (CD) measurements of a lithographic tool includes steps as follows. A correction pattern having a first sub-pattern parallel to a first direction and a second sub-pattern parallel to a second direction is provided on a lithographic mask; wherein the first sub-pattern and the second sub-pattern come cross with each other. A first After-Develop-Inspection critical dimension (ADI CD) of a developed pattern formed on a photo-sensitive layer and transferred from the correction pattern is measured using the lithographic tool along a first scanning direction. A second ADI CD of the developed pattern is measured using the lithographic tool along a second scanning direction. The first ADI CD is subtracted from the second ADI CD to obtain a measurement bias value. Exposure conditions and/or measuring parameters of the lithographic tool are adjusted according to the measurement bias value.

Abstract: A radio frequency circuit with font routing to replace a resistor includes a routing layer and a ground layer. The routing layer includes a first pad, a second pad and a font routing unit. The second pad is corresponding to the first pad. The font routing unit is connected between the first pad and the second pad, and has a trace width. The trace width is less than a 50 ohm trace width. The ground layer is disposed below the routing layer and is separated from the routing layer by a height. The font routing unit has a second equivalent impedance at the radio frequency, the second equivalent impedance is determined according to the trace width, the height and the radio frequency, and the second equivalent impedance is the same or similar to a first equivalent impedance.

Abstract: An auxiliary vehicle mirror device includes a main rod unit, a securing unit and an auxiliary mirror unit. The main rod unit includes a connecting rod, first and second fixture rods connected perpendicularly to opposite ends of the connecting rod and extending respectively in opposite directions, and first and second ball fixtures disposed respectively on the first and second fixture rods. The first ball fixture is engaged with a first socket seat of the securing unit to be freely rotatable relative to it. The second ball fixture is engaged with a second socket seat of the auxiliary mirror unit to be freely rotatable relative to it.

Abstract: A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A training method for a neural network includes determining first disassembly paths of a plurality of first molecules, and obtaining a first cost dictionary based on the first disassembly paths of the first molecules. The method also includes determining molecular expression information of second molecules based on the first disassembly paths of the first molecules, and determining a plurality of third molecules from the second molecules, each of the third molecules representing a class of the second molecules. The method further includes obtaining a second cost dictionary based on second disassembly paths of the third molecules, and performing training based on the first cost dictionary and the second cost dictionary to obtain a target neural network. The target neural network being configured to output cost value information corresponding to a target molecule according to input molecular expression information of the target molecule.

Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

Abstract: The present disclosure provides a photomask and a method of forming a photomask, in which the photomask may obtain an optimized uniformity via a simplified process flow. The photomask includes a plurality of stair-like patterns parallel disposed with each other, wherein each of the stair-like patterns includes a plurality of first right angles at one side and a plurality of second right angle at another side opposite to the side, and each of the first right angles and each of the second right angles are not in a same vertical axis.

Abstract: A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

Abstract: A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.

Abstract: A detection and charge neutralization device comprises a vacuum chamber, an electrical optical system, and a charge neutralization member. The electrical optical system and the charge neutralization member are disposed inside the vacuum chamber. The electrical optical system, outputs a charged particle beam to an observation position of the vacuum chamber. The charge neutralization member provides a focused vacuum ultraviolet light to the observation position to neutralize the accumulating charges.

Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) apparatus. The MEMS apparatus includes a base substrate and a conductive routing layer disposed over the base substrate. A bump feature is disposed directly over the conductive routing layer. Opposing outermost sidewalls of the bump feature are laterally between outermost sidewalls of the conductive routing layer. A MEMS substrate is bonded to the base substrate and includes a MEMS device directly over the bump feature. An anti-stiction layer is arranged on one or more of the bump feature and the MEMS device.

Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3?-dimethyl-5,5?-diethyl-4,4?-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method.

Abstract: The present disclosure provides a photomask and a method of forming a photomask, in which the photomask may obtain an optimized uniformity via a simplified process flow. The photomask includes a plurality of stair-like patterns parallel disposed with each other, wherein each of the stair-like patterns includes a plurality of first right angles at one side and a plurality of second right angle at another side opposite to the side, and each of the first right angles and each of the second right angles are not in a same vertical axis.

Abstract: A method of forming a semiconductor device is disclosed. A substrate having a first device region and a second device region is provided. A metal nitride barrier layer is formed to cover the first device region and the second device region. A titanium layer is deposited on the metal nitride barrier layer. The titanium layer is selectively removed from the second device region, thereby exposing the metal nitride barrier layer in the second device region. The titanium layer in the first device region is transformed into a titanium nitride layer. The titanium nitride layer is a work function layer on the first device region.