Abstract: Disclosed aspects relate to access point selection. A set of beacon frame transmission data for a set of access points is collected by a computing device. The set of beacon frame transmission data includes first and second subsets including frame rates for access points and network capability data including security data for access points. The computing device compares factors derived utilizing the frame rates. The computing device weights the beacon frame transmission data with respect to the network capability data for the access points, wherein the weighting indicates security data has a heavier weight than network signal strength. The computing device computes, using the first and second factors and the weighting, a set of expected network quality scores. The computing device determines, using the set of expected network quality scores, to establish the connection utilizing the first access point. The computing device establishes the connection utilizing the first access point.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: In general, one or more loads, such as a sensor suite of an autonomous (or semi-autonomous) vehicle, may be configured to draw power from a supercapacitor. A switching mechanism can selectively connect or disconnect the one or more loads and the supercapacitor from a voltage source of a vehicle power system. By systematically disconnecting the voltage source from the supercapacitor and the one or more loads, the exposure of the voltage source to the one or more loads is minimized. Accordingly, the exposure of the voltage source of the vehicle power system to potentially damaging short circuits or power surges that may arise in relation to the one or more loads can also be minimized.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an adhesion layer and at least one outer via. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer is interposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The outer via extends through at least a portion of the upper conductive structure and the adhesion layer, and electrically connected to the circuit layer of the lower conductive structure.

Abstract: A phosphorus-containing resin composition comprises a first phosphorus-containing compound, a second phosphorus-containing compound and a maleimide resin; wherein the first phosphorus-containing compound comprises a compound of Formula (I), a compound of Formula (II), or a combination thereof, and wherein the second phosphorus-containing compound is different from the first phosphorus-containing compound, and the second phosphorus-containing compound is absent of a group capable of reacting with the maleimide resin.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) apparatus. The MEMS apparatus includes a base substrate and a conductive routing layer disposed over the base substrate. A bump feature is disposed directly over the conductive routing layer. Opposing outermost sidewalls of the bump feature are laterally between outermost sidewalls of the conductive routing layer. A MEMS substrate is bonded to the base substrate and includes a MEMS device directly over the bump feature. An anti-stiction layer is arranged on one or more of the bump feature and the MEMS device.

Abstract: A method for producing an artificial sebum film is provided with in raw material component and relative ratio, 78.4%-2% of triglyceride, 1%-15% of wax and ester, 20%-35% of squalane, 0.1%-7% of free fatty acid, 0.1%-6% of phospholipid, 0.1%-10% of cholesterol ester, 0.1%-10% of cholesterol, 0.1%-10% of antioxidant and 0.1%-5% of cellular activity regulator. The invention modifies the proportion of raw material composition of the artificial sebum film to reduce the negative effect generated by oxidation, and increase the proportion of squalane, so that the skin under high pollution can restore to the normal equilibrium state. Further, antioxidants and cellular active regulators are added to prolong the oxidation time of artificial sebum film and replenish the adenosine triphosphate in the cells.

Abstract: A reticle inspection system and related method are disclosed. The system includes a concave spherical mirror positioned adjacent a side of the reticle that is configured to reflect inspection light transmitted through the reticle back towards and through the reticle. A sensor is configured to create at least one of: a first inspection image representative of a circuit pattern of the reticle based on transmission of the inspection light through the first side of the reticle and a reflection thereof by the concave spherical mirror through the second side of the reticle, and a second inspection image representative of the circuit pattern of the reticle based on the reflection of the inspection light from the first side of the reticle. A controller is configured to identify a defect in the reticle based on at least one of the first inspection image and the second inspection image.

Abstract: An antenna adjustment device and an antenna adjustment method for a mobile vehicle, in which main structure includes the mobile vehicle having a directional antenna, a photographic element and an epipolar line analysis component. The epipolar line analysis component establishes data connection with the directional antenna and the photographic element. The photographic element includes a photographic part and an image receiving processing part. With the above structure, the user can use the photographic element with the directional antenna to define an epipolar line of optimal connection efficiency with the base station on the image receiving processing part. When the connection is needed, the mobile vehicle is moved for adjusting an image of the base station imaged by the image receiving processing part to align to the epipolar line, so as to get the optimal connection efficiency.

Abstract: A photodetector includes a substrate, at least one nanowire and a cladding layer. The at least one nanowire is disposed on the substrate and has a semiconductor core. The cladding layer is disposed on sidewalls of the semiconductor core and includes an epitaxial semiconductor film in contact with the sidewalls of the semiconductor core, a metal film disposed on the outside of the epitaxial semiconductor film and a high-k material layer disposed on the outside of metal film.

Abstract: In general, one or more loads on a vehicle can be connected to both a first voltage source on the vehicle and a backup vehicle power system on the vehicle. If the voltage provided by the first voltage source to the one or more loads satisfies a voltage threshold, the backup vehicle power system does not provide power to the one or more loads. However, if the voltage provided by the first voltage source to the one or more loads falls below the voltage threshold, the backup vehicle power system provides power to the one or more loads.

Abstract: A material layer having recesses is formed on a substrate including a high pattern density area and a low pattern density area. A first dielectric layer and a second dielectric layer are sequentially formed to cover the material layer, wherein a top surface of the first dielectric layer in the high pattern density area is higher than a top surface of the first dielectric layer in the low pattern density area, thereby a thickness of the second dielectric layer in the low pattern density area being thicker than a thickness of the second dielectric layer in the high pattern density area. An etching back process is performed to remove the second dielectric layer and the first dielectric layer, wherein the etching rate of the etching back process to the second dielectric layer is lower than the etching rate of the etching back process to the first dielectric layer.

Abstract: A method of forming a semiconductor device includes forming a source/drain region on a substrate and forming a first interlayer dielectric (ILD) layer over the source/drain region. The method further includes forming a second ILD layer over the first ILD layer, forming a source/drain contact structure within the first ILD layer and the second ILD layer, and selectively removing a portion of the source/drain contact structure to form a concave top surface of the source/drain contact structure.

Abstract: A lid structure, which is used for covering an opening of a container, includes a mainbody, an elastic annular element, and a covering assembly. The mainbody includes a through hole. The elastic annular element is integrally disposed on a peripheral region of the mainbody, wherein the elastic annular element is used for positioning the lid structure on the opening. The covering assembly is disposed on the mainbody and includes a spacer element and a covering element. The spacer element is disposed on and covers the through hole. The spacer element includes a plurality of drain holes and a central connecting portion. The covering element is deformably disposed on the central connecting portion.

Abstract: A driving circuit, a display apparatus and a driving method thereof are provided. The display panel is divided into a plurality of regions including a first region having a rectangular form and a second region having a free form. The driving circuit generates a plurality of control clocks having a first duty cycle during a first period and a second duty cycle different from the first duty cycle during a second period, or having a first phase shift during the first period and a second phase shift different from the first phase shift during the second period, or having a first driving capability during the first period and a second driving capability different from the first driving capability during the second period.

Abstract: A material layer having recesses is formed on a substrate including a high pattern density area and a low pattern density area. A first dielectric layer and a second dielectric layer are sequentially formed to cover the material layer, wherein a top surface of the first dielectric layer in the high pattern density area is higher than a top surface of the first dielectric layer in the low pattern density area, thereby a thickness of the second dielectric layer in the low pattern density area being thicker than a thickness of the second dielectric layer in the high pattern density area. An etching back process is performed to remove the second dielectric layer and the first dielectric layer, wherein the etching rate of the etching back process to the second dielectric layer is lower than the etching rate of the etching back process to the first dielectric layer.

Abstract: The present disclosure relates to a MEMS apparatus with a patterned anti-stiction layer, and an associated method of formation. The MEMS apparatus has a handle substrate defining a first bonding face and a MEMS substrate having a MEMS device and defining a second bonding face. The handle substrate is bonded to the MEMS substrate through a bonding interface with the first bonding face toward the second bonding face. An anti-stiction layer is arranged between the first and the second bonding faces without residing over the bonding interface.

Abstract: A photodetector includes a substrate, at least one nanowire and a cladding layer. The at least one nanowire is disposed on the substrate and has a semiconductor core. The cladding layer is disposed on sidewalls of the semiconductor core and includes an epitaxial semiconductor film in contact with the sidewalls of the semiconductor core, a metal film disposed on the outside of the epitaxial semiconductor film and a high-k material layer disposed on the outside of metal film.