Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A method includes depositing a photoresist layer over a target layer, the photoresist layer comprising an organometallic material; exposing the photoresist layer to an extreme ultraviolet (EUV) radiation; developing the exposed photoresist layer to form a photoresist pattern; forming a spacer on a sidewall of the photoresist pattern; removing the photoresist pattern; after removing the photoresist pattern, patterning the target layer through the spacer.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. Microstructures are located on the second surface. The second contact layer is located below the first surface. The active layer is located between the first contact layer and the second contact layer. The photonic crystal layer is located between the active layer and the second contact layer. The passivation layer is located on the second contact layer. The first electrode is located on the passivation layer and is electrically connected the first surface of the first contact layer. The second electrode is located on the passivation layer and is electrically connected to the second contact layer.

Abstract: Provided herein are antibodies, or antigen-binding portions thereof, that specifically bind and inhibit TREM-1 signaling, wherein the antibodies do not bind to one or more Fc?Rs and do not induce the myeloid cells to produce inflammatory cytokines. Also provided are uses of such antibodies, or antigen-binding portions thereof, in therapeutic applications, such as treatment of autoimmune diseases.

Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: Provided are a system and a method for cardiovascular risk prediction, where artificial intelligence is utilized to perform segmentation on non-contrast or contrast medical images to identify precise regions of the heart, pericardium, and aorta of a subject, such that the adipose tissue volume and calcium score can be derived from the medical images to assist in cardiovascular risk prediction. Also provided is a computer readable medium for storing a computer executable code to implement the method.

Abstract: A surface mounted assembly is provided and includes a surface mounted device, a cable and a circuit board. The circuit board includes a first outer side and a second outer side opposite to first outer side, and a conductive hole structure. The cable is inserted into the conductive hole structure from the first outer side of the circuit board and affixed with and electrically connected to the conductive hole structure to locate a terminal of the cable between the first outer side and the second outer side of the circuit board. The surface mounted device is mounted on the second outer side of the circuit board. An electrical connecting component of the surface mounted device and the terminal of the cable are affixed with and electrically connected to the conductive hole structure and electrically connected to each other by the conductive hole structure. Furthermore, an endoscope is provided.

Abstract: A driving mechanism for driving a plunger of an auto-injector to slide relative to a reservoir of the auto-injector is provided and includes a first transmission component, a driving component, a second transmission component, a driving resilient component, a stopping resilient component, a third transmission component, a sliding component and a supporting component. The second transmission component resiliently deforms the stopping resilient component when the first transmission component resiliently deforms the driving resilient component to push the second transmission component to rotate along a first rotating direction. The second transmission component is stopped from rotating along a second rotating direction by the stopping resilient component when the driving resilient component is released to resiliently recover. The third transmission component drives the sliding component to slide when the second transmission component rotates. The supporting component guides the sliding component to slide.

Abstract: A controllable bending tube is applied to an endoscope device having an endoscope lens module disposed on an end of the controllable bending tube and includes a first wire, a second wire, and a plurality of helical coil portions connected in series to integrally form a helical tube body with a helical pitch. A first retaining slot and a second retaining slot are formed at first sides and second sides of at least two of the plurality of helical coil portions respectively, and two first nodes protrudes axially at third sides and fourth sides of the at least two of the plurality of helical coil portions respectively. The first and second wires are movably disposed through the first and second retaining slots for controlling a bending direction of the helical tube body.

Abstract: A driving mechanism for driving a plunger of an auto-injector to slide relative to a reservoir of the auto-injector is provided. The driving mechanism includes a first transmission component, a driving component, a second transmission component, a third transmission component, a sliding component and a bracket. The driving component is for driving the first transmission component to rotate to drive the second transmission component to rotatably drive the third transmission component rotate together with the second transmission component, so as to drive the sliding component to slide relative to the third transmission component by the third transmission component to push the plunger to pump a drug out of the reservoir. The sliding component passes through a guiding portion of the bracket, and the guiding portion is configured to guide the sliding component to slide without any rotation. Besides, a related auto-injector is provided.

Abstract: A paper aligning mechanism and an image generating device having the same are provided, the paper aligning mechanism is arranged on a calibration path of the image generating device, the calibration path is arranged between a paper assigning mechanism and a paper-feeding mechanism of the image generating device, and the paper aligning mechanism has at least two calibrating swingarms arranged spacedly. Each of the calibrating swingarms has an arm portion and a pivoting axle portion arranged on the arm portion to pivotally connect the arm portion to the image generating device. The arm portion has an extending segment and a limiting segment extended from the extending segment, the limiting segment is downward extended along the calibration path toward an exit of the calibration path to be swingable and to block the exit of the calibration path.