Abstract: An electronic device and a stopping structure thereof are provided. The electronic device includes a housing, an electronic element, a cover and a buffer. The housing has an opening. The electronic element is disposed corresponding to the opening. An outer frame of the cover is coupled to a peripheral edge of the opening. A hook of the buffer is disposed between the outer frame and the electronic element, and directly contacts with the outer frame. Thus, the above structure may strengthen the structural strength of the electronic device, effectively disperse the pressure applied to the electronic device, and reduce the chance of structural damage due to the deformation caused by the pressure to prolong the service life of the electronic device.

Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: The present invention relates to a diaphragm, and stethoscopes provided with the same. The diaphragm having a plate-shaped vibratable portion, and the vibratable portion has a first surface. The diaphragm further comprises a compliant structural layer disposed on the first surface. When the diaphragm is assembled with a sound collecting head, the compliant structural layer is in contact with the sound collecting head to enhance the airtightness between the diaphragm and the sound collecting head to prevent the acoustic vibration energy from dissipating. The invention also relates to methods for manufacturing the diaphragm which can quickly produce a large number of diaphragms by simple processes.

Abstract: The invention is a pet feeding device provides a feeding mechanism on a basis of fixed time and fixed amount of food for a pet. The pet feeding device includes a base and a rotatable tray. The base has a first opening and a second opening communicated with each other, and the second opening connects the base and an exterior environment. The rotatable tray having third openings is assembled to the base and rotates about an axis. The feed pellets received in the pet feeding device fall into the third openings with a rotation of the rotatable tray. In a process of rotation, the first opening covers portion of the third openings correspondingly in a unit time, and the feed pellets in the corresponding third openings drop out of the pet feeding device via the first opening and the second opening.

Abstract: A circuit board includes a first conductive circuit layer, a cover layer, and a second conductive circuit layer. The cover layer includes an adhesive layer and a base film. The first conductive circuit layer is embedded within the adhesive layer. One side of the first conductive circuit layer is revealed from the adhesive layer. The second conductive circuit layer is located on a side of the base film facing away from the adhesive layer. The cover layer defines a first through hole and a second through hole passing through the cover layer. A diameter of the first through hole is greater than a diameter of the second through hole. The first through hole is filled with a copper post adjacent to the first conductive circuit layer and an electroplating layer adjacent to the second conductive circuit layer. The second through hole is filled with the electroplating layer.

Abstract: Various solutions for avoiding circuit-switched call drop with respect to user equipment and network apparatus in mobile communications are described. An apparatus transmits a non-access stratum (NAS) message in a NAS signaling connection. The apparatus receives a NAS response message. The apparatus initiates a timer to control the NAS signaling connection. The apparatus further receives a circuit-switched (CS) service notification. The apparatus then stops the timer and execute a CS service procedure.

Abstract: An electronic system, an outlet structure and a cable are provided. The outlet structure includes a housing, a cable and a positioning member. The housing has a through hole and a receiving slot. The receiving slot is disposed on a second side of the housing. The through hole extends to a first side of the housing from the receiving slot. The cable includes a wire and an annulus annularly disposed on the wire, and has a groove set on one side of the annulus against the wire which passes though the through hole. The annulus is disposed in the receiving slot of the housing and on the through hole. The positioning member engages in the groove and is fixed on the second side of the housing. The outlet structure not only reduces overall material cost, but also simplifies overall assembly difficulty.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: A package substrate includes a dielectric layer, a first circuit layer, a second circuit layer and at least one electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located on the second side the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths gradually decreasing along the extension direction.

Abstract: A mobile communication device including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a first network supporting only Packet-Switched (PS) services or a second network supporting Circuit-Switched (CS) services. The controller receives a rejection message of a Tracking Area Updating (TAU) procedure from the first network via the wireless transceiver when a Circuit Switch Fallback (CSFB)-related call originated from or terminated to the mobile communication device is pending, determines whether the rejection message includes a predetermined rejection cause, and in response to the rejection message including the predetermined rejection cause, selects the second network to make the CSFB-related call via the wireless transceiver without re-attaching to the first network.

Abstract: An electronic device and a stopping structure thereof are provided. The electronic device includes a housing, an electronic element, a cover and a buffer. The housing has an opening. The electronic element is disposed corresponding to the opening. An outer frame of the cover is coupled to a peripheral edge of the opening. A hook of the buffer is disposed between the outer frame and the electronic element, and directly contacts with the outer frame. Thus, the above structure may strengthen the structural strength of the electronic device, effectively disperse the pressure applied to the electronic device, and reduce the chance of structural damage due to the deformation caused by the pressure to prolong the service life of the electronic device.

Abstract: Various solutions for avoiding circuit-switched call drop with respect to user equipment and network apparatus in mobile communications are described. An apparatus transmits a non-access stratum (NAS) message in a NAS signaling connection. The apparatus receives a NAS response message. The apparatus initiates a timer to control the NAS signaling connection. The apparatus further receives a circuit-switched (CS) service notification. The apparatus then stops the timer and execute a CS service procedure.

Abstract: The present disclosure provides a diaphragm set for a stethoscope having a chest piece. The diaphragm set includes a diaphragm having a bottom structure and a side structure connected to an edge of the bottom structure. The bottom structure and the side structure of the diaphragm form a diaphragm cavity for receiving the chest piece of the stethoscope.

Abstract: Various solutions for avoiding circuit-switched call drop with respect to user equipment and network apparatus in mobile communications are described. An apparatus may transmit a non-access stratum (NAS) message in a NAS signaling connection. The apparatus may receive a NAS response message. The apparatus may initiate a timer to control the NAS signaling connection. The apparatus may further receive a circuit-switched (CS) service notification. The apparatus may stop the timer and execute a CS service procedure.

Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.

Abstract: The present disclosure provides a stethoscope head assembly. The stethoscope head assembly comprises a diaphragm and a main body. The diaphragm comprises a membrane portion, and a sealing portion extending from a periphery of the membrane portion and comprising a ring-shaped raised platform and a connecting portion extending downwardly from a periphery of the ring-shaped raised platform. The main-body is detachably coupled to the diaphragm and comprises a sound gathering member. The connecting portion and the ring-shaped raised platform of the diaphragm cooperatively form a ring-shaped receiving slot for receiving the sound gathering member of the main body.

Abstract: Various solutions for avoiding circuit-switched call drop with respect to user equipment and network apparatus in mobile communications are described. An apparatus may transmit a non-access stratum (NAS) message in a NAS signaling connection. The apparatus may receive a NAS response message. The apparatus may initiate a timer to control the NAS signaling connection. The apparatus may further receive a circuit-switched (CS) service notification. The apparatus may stop the timer and execute a CS service procedure.

Abstract: An electronic device is provided, including a housing, a channel, and a flexible circuit. The housing includes a frame and a buffer structure connected to the frame by overmolding, wherein the hardness of the frame exceeds that of the buffer structure. The channel is extended along a sidewall of the frame, through the housing and adjacent to the buffer structure. The flexible circuit is disposed through the channel to connect a first circuit unit and a second circuit unit of the electronic device.