Abstract: A metrology target of a semiconductor device is provided. The metrology target includes a substrate including first and second layers. The first layer includes a first grating, a second grating, and a first dummy structure. The first dummy structure is at least formed between the first grating and the second grating. The second layer is formed over the first layer and includes a third grating and a fourth grating. The first, second, third and fourth gratings are formed based on the first spatial period. The third grating and fourth grating are placed to overlap the first grating and second grating, respectively. The first grating and the third grating are formed with a first positional offset which is along a first direction. The second grating and the fourth grating are formed with a second positional offset which is along a second direction which is opposite to the first direction.

Abstract: A metrology target of a semiconductor device is provided. The metrology target includes a substrate including first and second layers. The first layer includes a first grating, a second grating, and a first dummy structure. The first dummy structure is at least formed between the first grating and the second grating. The second layer is formed over the first layer and includes a third grating and a fourth grating. The first, second, third and fourth gratings are formed based on the first spatial period. The third grating and fourth grating are placed to overlap the first grating and second grating, respectively. The first grating and the third grating are formed with a first positional offset which is along a first direction. The second grating and the fourth grating are formed with a second positional offset which is along a second direction which is opposite to the first direction.

Abstract: A display module includes a bottom substrate, a display device having a plurality of display pixels, and a diffusion module. The display pixels are disposed between the bottom substrate and the diffusion module. The diffusion module has a thickness and a haze, wherein the haze of the diffusion module satisfies: A < Haze ? ( % ) < B ; wherein A = 0.642 × ( NP ) 0.35 ( NT ) 0.32 ; B = 0.821 × ( NP ) 0.45 ( NT ) 0.60 ; NP = 25400 / PPI 63 ? ? µm ; and NT = T 500 ? ? µm ; wherein PPI is a resolution of the display module, T is the thickness of the diffusion module, and Haze is the haze of the diffusion module.

Abstract: A growth method of dendritic crystal structure that provides directional heat transfer, including the steps: A. providing a substrate, whereby the substrate is provided with a plurality of crystal defects; B. depositing a plurality of metal ions on the substrate using a deposition method, whereby the metal ions on the crystal defects enable the growth of dendritic crystals. Moreover, an interspace is provided between each of the dendritic crystals. Hence, when the substrate is in contact with a heat source, heat energy is transferred from the substrate in the growth direction of the dendritic crystals; or, when the dendritic crystals are disposed at the position of a heat source, heat provided by the heat source is transferred from the dendritic crystals in a direction toward the substrate. Accordingly, the fractal structure of the dendritic crystals is used to provide ample heat dissipation areas and contact areas.

Abstract: An organic light emitting display panel includes an array substrate, at least one blue sub-pixel, at least one green sub-pixel, and at least one red sub-pixel. The blue sub-pixel, the green sub-pixel, and the red sub-pixel are disposed on the array substrate and are respectively configured for providing blue light, green light, and red light. The blue sub-pixel, the green sub-pixel, and the red sub-pixel together have a light emitting surface. The light emitting surface has a normal direction which is along a normal line of the light emitting surface, and has an oblique direction which forms an angle greater than 0 degree with the normal line. The red light has a red normal intensity RI1 along the normal direction, and a red oblique intensity RI2 along the oblique direction. When the angle is about 15 degrees, 1.12?RI2/RI1?1.

Abstract: A heat transfer component with dendritic crystal structures and a purpose and method of use for such a component; this component is used to resolve the deficiency concerning conventional heat transfer components possessing inadequate surface areas for heat dissipation. Dendritic crystal structure is comprising: a substrate and multiple dendritic crystals. The substrate contains multiple preset crystal defects in which all the dendritic crystals deposit and congregate, and a space is located between each dendritic crystal for thermal convection. Regarding the method of use, the substrate is connected to a heat source, which then induces directional heat transfer from the substrate and the metal layer to the main branch and at least one sub-branch of the dendritic crystal, or the dendritic crystal is placed on a heat source, which induces heat transfer from the crystal to the substrate.

Abstract: A touch panel having a light transmitting area and a light shielding area adjacent to the light transmitting area is provided. The touch panel includes a cover plate, a first decoration layer, a touch-sensing element and a metal conductive layer. The first decoration layer is disposed on the cover plate and located in the light shielding area. The first decoration layer has at least one hollow area. The touch-sensing element is disposed on the cover plate and at least located in the light transmitting area. The metal conductive layer is disposed on the first decoration layer, located in the light shielding area and surrounds the touch-sensing element. A portion of the metal conductive layer surrounds the hollow area.

Abstract: A touch display device including a touch panel, a protection layer, a conductive optical adhesive layer and a display panel is provided. The touch panel includes a substrate, pads, at least one grounding pad, a touch-sensing device, and at least one ESD protection line. The touch panel includes a pad area and an active area. The pads and the grounding pad are disposed on the substrate and located in the pad area. The touch-sensing device is disposed on the substrate and located in the active area. The ESD protection line is disposed on the substrate and located at a side of the active area. The protection layer including a first opening covers the touch panel and a portion of the pad area is exposed by the first opening. The conductive optical adhesive layer is disposed on the protection layer and electrically connected to the ESD protection circuit.

Abstract: A touch panel includes a substrate, a patterned decoration layer, a patterned transparent conductive layer and an optical compensation layer. The patterned decoration layer is disposed on the substrate so as to define an opening region and a hole on the substrate. The hole is disposed adjacently to a side of the opening region. The patterned transparent conductive layer is disposed on the substrate. The patterned transparent conductive layer includes a transparent conductive pattern. The transparent conductive pattern is disposed correspondingly to the hole, and the transparent conductive pattern completely covers the hole along a vertical projective direction perpendicular to the substrate. The optical compensation layer is disposed on the substrate, and the optical compensation layer covers the hole along the vertical projective direction.

Abstract: A touch panel, having a light transmission touch sensing region and a peripheral region adjacent to at least one side of the light transmission touch sensing region, includes an inner frame and a decoration frame disposed in the peripheral region. The peripheral region has an inner edge and an outer edge, wherein the inner edge is closer to the light transmission touch sensing region than the outer edge. The inner sidewall of the inner frame is disposed along the inner edge of the peripheral region. The decoration frame includes at least one decoration layer. The pattern of the decoration layer does not exceed the inner edge of the peripheral region.

Abstract: Touch panel having electrostatic protection is provided. The touch panel includes a substrate, a plurality of sensing electrodes, a plurality of conductive wires and an electrostatic protection line. The substrate has a touch sensitive area and a periphery area surrounding the touch sensitive area. The inner part of the periphery area is a first layout area. The outer part of the periphery area is a second layout area. The sensing electrodes are formed in the touch sensitive area. The conductive wires are disposed in the first layout area. The electrostatic protection line is disposed in the second layout area and adjacent to the conductive wires. The width of the electrostatic protection line is greater than that of the conductive wires. The distance separating the outside of the electrostatic protection line from the border of the substrate is smaller than 48.12 mm and greater than or equal to 0.3 mm.

Abstract: A touch panel, having a peripheral region, includes a first substrate, a plurality of first conductive series, a plurality of first outer traces, and an outer device. The first conductive series are disposed on the first substrate and extend along a first direction. The first outer traces are disposed in the peripheral region. Two ends of each of the first outer traces are respectively connected to two ends of the corresponding first conductive series. The first outer traces connected to the each of the first conductive series extend to a connection region within the peripheral region and include discontinuous sections within the connection region. The outer device is disposed in the peripheral region and is electrically connected to the first outer traces. Each of the first outer traces, each corresponding first conductive series, and the outer device in the connection region constitute a closed conductive path on the first substrate.

Abstract: A touch panel, having a peripheral region, includes a first substrate, a touch-sensing structure, first outer traces, a first ground wire and an outer device. The first outer trace is electrically connected to the touch-sensing structure. The first outer traces extend to a connection region in the peripheral region. The first ground wire extends to the connection region, and the first ground wire has at least one discontinuous section in the connection region. The outer device is electrically connected to the first ground wire and the first outer traces in the connection region. The outer device electrically connects two ends of the discontinuous section of the first ground wire in the connection region, and the two ends of the discontinuous section of the first ground wire are electrically connected via the outer device.

Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.

Abstract: Disclosed is a recycling method for waste ceramic filters, and the recycling method includes the steps of heating a waste ceramic filter that no longer has the oil filtering effect, applying an acid to the waste ceramic filter to remove unwanted substances attached on the filter, performing a washing or dewatering step to remove any acid solution remained on the ceramic filter, and performing a drying step to dry the ceramic filter.

Abstract: A semiconductor circuit pattern includes an angled conductive pattern having a line portion and a pad portion at an end of the line portion extending normal to the line portion on a first side of the line portion. The pad portion has a width greater than a width of the line portion. A spacing has a first portion adjacent the first side of the pad portion, and a second portion adjacent a second side of the pad portion opposite the first side. The first portion of the spacing has a width greater than the width of the second portion of the spacing.

Abstract: A method for strengthening glass and a glass using the same are provided. The method for strengthening glass includes the following steps. Firstly, a glass substrate, which has a first surface and a second surface opposite to the first surface, is provided. Next, a barrier film is formed on at least one of the first surface and the second surface. Then, the glass substrate with the barrier film is immersed in a strengthening solution. The strengthening solution includes first ions, and the barrier film can limit the first ions in the quantity entering the glass substrate.