Abstract: An intermediary device and a wearable bridge are provided. The wearable bridge is detachably assembled with two wireless earbuds, and includes a headband, two ear cups respectively connected to two opposite ends of the headband, and a wireless module. Each ear cup includes an assembling slot and an electrical connector that is arranged in the assembling slot. Each assembling slot can be assembled with one of the two wireless earbuds so as to enable the corresponding electrical connector to be structurally and electrically connected to the one of the two wireless earbuds. The wireless module is electrically coupled to the electrical connector of each of the two ear cups, and the wireless module is configured to transmit sound signals from an external apparatus to the electrical connectors of the two ear cups, so that the two wireless earbuds are allowed to synchronously play.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: There is provided a wireless device including an earphone set and a charging cradle. The charging cradle is used as means for charging the earphone set. The charging cradle further records connection information of multiple external devices that have been BT connected to the charging cradle. The earphone set receives a connection command from the charging cradle to accordingly form an audio connection to one of the multiple external devices. The charging cradle is further used as a communication medium between the multiple external devices.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: Wireless charging devices, methods of manufacture thereof, and methods of charging electronic devices are disclosed. In some embodiments, a wireless charging device includes a controller, a molding material disposed around the controller, and an interconnect structure disposed over the molding material and coupled to the controller. The wireless charging device includes a wireless charging coil coupled to the controller. The wireless charging coil comprises a first portion disposed in the interconnect structure and a second portion disposed in the molding material. The wireless charging coil is adapted to provide an inductance to charge an electronic device.

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

Abstract: There is provided an electronic device having Bluetooth communication function. The electronic device confirms whether a current packet received in a receive slot is a retransmitted packet according to a SEQN bit in the packet header so as to determine whether to continuously turn on an RF receiver in the receive slot or early turn off the RF receiver to save power.

Abstract: There is provided an electronic device having Bluetooth communication function. The electronic device confirms whether the received signal power is larger than a power threshold within an interval of 72 microseconds every time an RF receiver is turned on in the receive slot so as to determine whether to continuously keep the RF receiver being turned on or to turn off the RF receiver to save power.

Abstract: There is provided a Bluetooth communication system including a master device and a slave device. After a link is established by a paging procedure, the master device determines whether to stop the link according to a connection quality calculated by a controller thereof. Before replying an accepted message LMP_accepted to the master device, the slave device determines whether to reply the accepted message according to a connection quality calculated by a controller thereof.

Abstract: There is provided an electronic device having Bluetooth communication function. The electronic device confirms whether the received signal power is larger than a power threshold within an interval of 72 microseconds every time an RF receiver is turned on in the receive slot so as to determine whether to continuously keep the RF receiver being turned on or to turn off the RF receiver to save power.

Abstract: A device is provided. The device includes a bridge layer over a first substrate. A first connector electrically connecting the bridge layer to the first substrate. A first die is coupled to the bridge layer and the first substrate, and a second die is coupled to the bridge layer.

Abstract: A semiconductor device includes a first semiconductor die package. The first semiconductor package includes a molding compound, and a conductive element in the molding compound, wherein a top surface of the conductive element is above or co-planar with a top-most surface of the molding compound. The semiconductor device further includes a second semiconductor die package. The second semiconductor package includes a plurality of copper-containing contacts on a single metal pad, wherein each of the plurality of copper-containing contacts is bonded to the conductive element.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.

Abstract: A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.

Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: There is provided an electronic device having Bluetooth communication function. The electronic device confirms whether a current packet received in a receive slot is a retransmitted packet according to a SEQN bit in the packet header so as to determine whether to continuously turn on an RF receiver in the receive slot or early turn off the RF receiver to save power.

Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.

Abstract: A memory device may include a memory array comprising at least two sections. Each of the sections may further include multiple memory cells. The memory device may also include one or more controllers designed to receive one or more commands to initiate writing logical data to the multiple memory cells of a first section and a second section. Additionally, the writing may alternate between the first section and the second section until the first section and second section have been entirely written with the logical data.