Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A device includes a first buried layer over a substrate, a second buried layer over the first buried layer, a first well over the first buried layer and the second buried layer, a first high voltage well, a second high voltage well and a third high voltage well extending through the first well, wherein the second high voltage well is between the first high voltage well and the third high voltage well, a first drain/source region in the first high voltage well, a first gate electrode over the first well, a second drain/source region in the second high voltage well and a first isolation region in the second high voltage well, and between the second drain/source region and the first gate electrode, wherein a bottom of the first isolation region is lower than a bottom of the second drain/source region.

Abstract: A keyboard palm rest includes a base including a raised intermediate member, first and second cavities extending from two sides of the intermediate member respectively, and first and second grooves disposed through the first and second cavities respectively; a first pad including a first projection slidably disposed in the first groove; a second pad including a second projection slidably disposed in the second groove; a first sliding member including a first resilient member moveably disposed in the first cavity, and a first fastener driven through the first resilient member into the first projection to pivotably secure the first pad to the first sliding member; and a second sliding member includes a second resilient member moveably disposed in the second cavity, and a second fastener driven through the second resilient member into the second projection to pivotably secure the second pad to the second sliding member.

Abstract: A joystick includes a stick head, an actuating component, a substrate, a bearing base, a resilient recovering component and a constraining component. The actuating component has a first end and a second end opposite to each other. The first end is connected to the stick head, and an identification feature is disposed on the second end. The substrate has a detection module used to detect the identification feature and determine motion of the stick head. The bearing base is disposed on the substrate. An opening portion of the bearing base aligns with the detection module and the actuating component. The resilient recovering component is disposed between the substrate and the bearing base. The constraining component is disposed on the resilient recovering component and movably disposed inside the opening portion, and used to abut against the actuating component in a detachable manner.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: Methods for reducing resistivity of metal gapfill include depositing a conformal layer in an opening of a feature and on a field of a substrate with a first thickness of the conformal layer of approximately 10 microns or less, depositing a non-conformal metal layer directly on the conformal layer at a bottom of the opening and directly on the field using an anisotropic deposition process. A second thickness of the non-conformal metal layer on the field and on the bottom of the feature is approximately 30 microns or greater. And depositing a metal gapfill material in the opening of the feature and on the field where the metal gapfill material completely fills the opening without any voids.

Abstract: A semiconductor arrangement includes a first dielectric feature passing through a semiconductive layer and a first dielectric layer over a substrate. The semiconductor arrangement includes a conductive feature passing through the semiconductive layer and the first dielectric layer and electrically coupled to the substrate. The conductive feature is adjacent the first dielectric feature and electrically isolated from the semiconductive layer by the first dielectric feature.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: Methods, systems, and devices for wireless communications are described. A first device (e.g., a base station) may transmit reference signals to a second device (e.g., a user equipment (UE)) via transmitter antenna circles. The second device may receive and measure the reference signals via corresponding receiver antenna circles. Both the transmitter antenna circles and the in receiver antenna circles may include a center antenna circle and one or more peripheral antenna circles. The second device may transmit channel gain measurements to the first device based on measuring the reference signals. The first device may determine orbital angular momentum (OAM) modes, a power loading scheme, or both for the transmitter antenna circles based on the channel gain measurements. The first device may transmit OAM transmissions to the second device based on the determined OAM modes, the power loading scheme, or both. The OAM transmissions may have different OAM states, polarizations, or both.

Abstract: The present application relates to a system and a method for producing vinyl chloride. The system comprise a preheat unit, a gas-liquid separating unit, a heat-recovery unit, a heating unit and a thermal pyrolysis unit, and therefore heat energy of the thermal pyrolysis product can be efficiently recovered. Energy cost of the system can be efficiently lowered with the heat-recovery unit and the heating unit, and further prolonging operating cycle of the system.

Abstract: Disclosed herein are system, method, and computer program product embodiments for reducing GPU load by programmatically controlling shading rates in computer graphics. GPU load may be reduced by applying different shading rates to different screen regions. By reading the depth buffer of previous frames and performing image processing, thresholds may be calculated that control the shading rates. The approach may be run on any platform that supports VRS hardware and primitive- or image-based VRS. The approach may be applied on a graphics driver installed on a client device, in a firmware layer between hardware and a driver, in a software layer between a driver and an application, or in hardware on the client device. The approach is flexible and adaptable and calculates and sets the variable rate shading based on the graphics generated by an application without requiring the application developer to manually set variable rate shading.

Abstract: A display substrate and a display device are provided. The display substrate includes a first display region including first light emitting unit groups and first pixel circuit groups connected with the first light emitting unit groups, a second display region including second light emitting unit groups, second pixel circuit groups connected with the second light emitting unit groups and third pixel circuit groups, and a third display region including third light emitting unit groups connected with the third pixel circuit groups. Each light emitting unit group includes light emitting units of different colors. The light emitting unit includes a main body electrode, an area of the main body electrode of at least one color light emitting unit in the third display region is greater than that of a main body electrode of the same color light emitting unit in the first display region.

Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.

Abstract: Certain aspects of the present disclosure relate to wireless communications, and more particularly, to techniques for beam determination, multi-user transmission, and channel state variance information (CSVI) reporting in a holographic multiple input multiple output (MIMO) system.

Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.

Abstract: Embodiments of the present application provide a server of a battery swapping station, a charging method and system for a battery, a device and a medium. The method is applied to a server of a battery swapping station, and the method includes: acquiring version information of a first software version after a vehicle mounted with a power battery arrives at the battery swapping station, wherein the first software version is a software version of a first battery management unit of the power battery; controlling, under a condition that the version information of the first software version is lower than version information of a second software version stored in the server, a second battery management unit of the battery swapping station to update the first software version of the first battery management unit to the second software version.

Abstract: A touch sensing method for a touch panel includes following operations: entering a first touch sensing process and performing a non-water mode; determining whether there is water on the touch panel in the first touch sensing process; entering a second touch sensing process and performing a water mode when there is water detected on the touch panel in the first touch sensing process; determining whether there is water on the touch panel in the second touch sensing process; and entering the first touch sensing process and performing the non-water mode when there is no water detected on the touch panel in the second touch sensing process.

Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate, an isolation layer, a gate stack structure, and a dielectric layer. The method includes partially removing the gate stack structure to form a first trench in the gate stack structure. The method includes forming an isolation structure in the first trench. The method includes removing the first gate stack and the second gate stack to form a first recess and a second recess in the dielectric layer. The method includes forming an n-type gate stack and a p-type gate stack in the first recess and the second recess respectively. The method includes forming a conductive line over the n-type gate stack, the p-type gate stack, and the isolation structure. The conductive line electrically connects the n-type gate stack to the p-type gate stack.

Abstract: Provided herein are antibodies, and antigen-binding fragments thereof that specifically bind glucocorticoid-induced tumor necrosis factor receptor (GITR), compositions comprising the antibodies or antigen-binding fragments thereof, and methods of using the same, including, e.g., methods of treatment using the same.