Abstract: A heat-dissipating fin assembly including a first fin and a second fin is provided. Each of the first fin and the second fin respectively includes a body, a bending part and a connecting part. The bending part is bent from an end of the body to form a turning portion along a predetermined direction. The connecting part, located near a turning portion of the bending part from the end of the body, extends opposite to the predetermined direction. When the first fin is connected to the second fin, the connecting part of the first fin is connected with the second fin. Also, an assembling method of the heat-dissipating fin assembly is provided.

Abstract: A heat dissipating apparatus includes a heat dissipating base and a heat dissipating element. The heat dissipating base includes a heat conducting plate and a heat dissipating plate having a hole. The heat conducting plate is disposed in the hole by a way of fitting with the hole and the outer edge of the heat conducting plate is tightly contacted with the inner wall of the hole. The heat dissipating element is disposed on and connected to the heat dissipating base.

Abstract: A heat dissipating module includes a fan and a heat sink. The heat sink comprises a body and at least one movable member. The body comprises a plurality of fins, at least one first slot and at least one second slot. The first and second slots are integrally formed on the body as a single piece. The movable member, rotatably or movably coupled to the first slot, comprises a pivoting portion, an operating portion, a jointing portion and at least one fixing portion. The pivoting portion is rotatably or movably received in the first slot. A first end of the operating portion connects to the pivoting portion, rotating or moving the pivoting portion. The jointing portion, at a second end of the operating portion, selectively connects to or separates from the second slot. The fixing portion protrudes from the pivoting portion, abutting and securing the fan to the heat sink.

Abstract: A safety monitoring mechanism of a wafer fabrication platform is disclosed. The mechanism comprises a vibration sensor mounted at the loading apparatus of the wafer fabrication platform for detecting vibration generated during the operation of the loading apparatus; a determination module for receiving the vibration detected by the vibration sensor and to convert the vibration into digital signals and for contrast analysis with the preset standard signal range; and an alarm apparatus which produces an alarm signal to operator when the detected digital signal by the vibration sensor exceeds the standard signal range for being abnormal after contrast analysis with that of the module.

Abstract: A heat sink has a heat-dissipating portion and a contact portion for contacting an electric device generating heat. The diameter of the contact portion is smaller than that of the heat-dissipating portion. The heat-dissipating portion has a plurality of fins. The contact portion is disposed on a bottom surface of the heat-dissipating and formed with the heat-dissipating portion as a single unitary member. The contact portion includes a first axial cross section and a second axial cross section. The first axial cross section is away from the heat-dissipating portion, and the second axial cross section is near the heat-dissipating portion. The diameter of the first axial cross section is larger than that of the second axial cross section.

Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

Abstract: A heat dissipating module. A frame accommodates a fan. An engaging assembly is coupled to the frame and includes an engaging body, a tongue, a resilient element, a wrench bar, and a connecting element. The engaging body includes a hollow portion and at least one first pivot hole. The tongue includes a bent portion and a bottom engaging portion. The bent portion includes at least one second pivot hole and is slidably engaged in the hollow portion. The resilient element fits on the tongue and is interposed between the engaging body and the bottom engaging portion of the tongue. The wrench bar abuts the surface of the engaging body and includes at least one third pivot hole. The connecting element fits in the first, second, and third pivot holes and is disposed in the engaging body, pivoting the tongue and wrench bar to the engaging body.

Abstract: This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element is comprised of a heat conductive plate and a heat conductive block installed at the center thereof. The area of the lower surface of the heat conductive block is greater than that of the upper surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract: A heat sink includes a plurality of fins, each of which includes a first vent and a first baffle. Each baffle is extended at one side of the first vent, and each of the first vents of the fins is located corresponding to the first vent of an adjacent fin. The heat sink further has a base, on which the fins are installed in parallel.

Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

Abstract: A safety monitoring mechanism of a wafer fabrication platform is disclosed. The mechanism comprises a vibration sensor mounted at the loading apparatus of the wafer fabrication platform for detecting vibration generated during the operation of the loading apparatus; a determination module for receiving the vibration detected by the vibration sensor and to convert the vibration into digital signals and for contrast analysis with the preset standard signal range; and an alarm apparatus which produces an alarm signal to operator when the detected digital signal by the vibration sensor exceeds the standard signal range for being abnormal after contrast analysis with that of the module.

Abstract: A heat dissipating module. A frame accommodates a fan. An engaging assembly is coupled to the frame and includes an engaging body, a tongue, a resilient element, a wrench bar, and a connecting element. The engaging body includes a hollow portion and at least one first pivot hole. The tongue includes a bent portion and a bottom engaging portion. The bent portion includes at least one second pivot hole and is slidably engaged in the hollow portion. The resilient element fits on the tongue and is interposed between the engaging body and the bottom engaging portion of the tongue. The wrench bar abuts the surface of the engaging body and includes at least one third pivot hole. The connecting element fits in the first, second, and third pivot holes and is disposed in the engaging body, pivoting the tongue and wrench bar to the engaging body.

Abstract: A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.

Abstract: The circulative cooling apparatus has a first chamber, a second chamber, a first pipe, and a second pipe. There are porous structures on internal walls of the first chamber and the second pipe. There is work fluid in the second chamber and the porous structures. The work fluid is evaporated by heat in the first chamber, and owing to the pressure drop the vapor of the work fluid moves to the second chamber through the first pipe. Then the vapor of the work fluid condenses into the work fluid in the second chamber. Afterward the work fluid is transported back to the first chamber through the second pipe using the porous structures thereof, thus forming a circulative cooling apparatus.

Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.

Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

Abstract: A heat-dissipating assembly utilizes a heat conductor having a high thermal conductivity to stagedly and effectively dissipate the heat to the surrounding environment. The heat-dissipating assembly includes a plurality of heat portions, at least one fan being disposed on the surface or side of the heat-dissipating portions, and a heat conductor having a high thermal conductivity connected within the plurality of the heat-dissipating portions.

Abstract: A heat sink comprises a plurality of heat-dissipating units, and each heat-dissipating unit provides a base and a plurality of parallel fins disposed thereon, respectively. The fins of any two adjacent heat-dissipating units extend in different directions.