Patents by Inventor Yu-Hung Lai

Yu-Hung Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210125970
    Abstract: A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 29, 2021
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Yun-Li Li, Tzu-Yang Lin, Yu-Hung Lai, Pei-Hsin Chen, Yi-Chun Shih
  • Publication number: 20210126048
    Abstract: A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.
    Type: Application
    Filed: January 7, 2021
    Publication date: April 29, 2021
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Ying-Tsang Liu, Yu-Chu Li, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10978609
    Abstract: A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 13, 2021
    Assignee: PlayNitride Inc.
    Inventors: Tzu-Yu Ting, Yu-Hung Lai, Hsiang-Wen Tang, Yi-Chun Shih
  • Patent number: 10937826
    Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 2, 2021
    Assignee: PLAYNITIRIDE DISPLAY CO., LTD.
    Inventors: Ying-Tsang Liu, Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Yu-Chu Li, Huan-Pu Chang, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10923527
    Abstract: A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: February 16, 2021
    Assignee: PixeLED Display CO., LTD.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Ying-Tsang Liu, Yu-Chu Li, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10879306
    Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, a plurality of micro semiconductor devices disposed on the substrate, and a first supporting layer disposed between the substrate and the micro semiconductor devices. Each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices. The lower surface includes a region, wherein the region is between the first electrode and the second electrode. An orthographic projection of the first supporting layer on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate. The first supporting layer directly contacts the region.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: December 29, 2020
    Assignee: PLAYNITRIDE DISPLAY CO., LTD.
    Inventors: Chih-Ling Wu, Ying-Tsang Liu, Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Yu-Chu Li, Huan-Pu Chang, Yu-Yun Lo, Yi-Min Su, Tzu-Yang Lin, Yu-Hung Lai
  • Publication number: 20200388736
    Abstract: A method for fabricating a micro light-emitting diode display is provided. The method includes disposing a plurality of micro light-emitting diodes on a carrier; transferring the micro light-emitting diodes from the carrier to a display substrate and disposing the micro light-emitting diodes in a plurality of pixels of the display substrate; subjecting the micro light-emitting diodes to a pre-bonding process to electrically connect the micro light-emitting diodes to the display substrate; subjecting the micro light-emitting diodes pre-bonded to the display substrate to a first detection process, thereby identifying whether a faulty micro light-emitting diode is present or not; and, subjecting the micro light-emitting diodes to the main bonding process after the first detection process.
    Type: Application
    Filed: December 26, 2019
    Publication date: December 10, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Yi-Ching CHEN, Pei-Hsin CHEN, Yi-Chun SHIH, Tzu-Yang LIN, Yu-Hung LAI
  • Patent number: 10833220
    Abstract: A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 10, 2020
    Assignee: PlayNitride Inc.
    Inventors: Yu-Yun Lo, Tzu-Yang Lin, Yu-Hung Lai
  • Publication number: 20200350466
    Abstract: A micro light emitting diode chip having a plurality of light-emitting regions, including a semiconductor epitaxial structure, a first electrode and a plurality of second electrodes disposed at interval is provided. The semiconductor epitaxial structure includes a first-type doped semiconductor layer, a plurality of second-type doped semiconductor layers and a plurality of light-emitting layers disposed at interval. The light-emitting layers are located between the first-type doped semiconductor layer and the second-type doped semiconductor layer. The light-emitting layers are located in the light-emitting regions respectively and electrically contact to the first-type doped semiconductor layer. The first electrode is electrically connected and contacts to the first-type doped semiconductor layers. The second electrodes are electrically connected to the second-type doped semiconductor layers. Furthermore, a display panel is also provided.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 5, 2020
    Applicant: PlayNitride Inc.
    Inventors: Yu-Hung Lai, Yu-Yun Lo, Tzu-Yang Lin
  • Patent number: 10784238
    Abstract: Disclosed are an epitaxial wafer and a display device that includes a display substrate, a first sub pixel unit and a second sub pixel unit. The first sub pixel unit has a first luminous area, and the second sub pixel unit has a second luminous area different from the first luminous area. The first sub pixel unit and the second sub pixel unit belong to the same color type and are located in different pixel units. The first sub pixel unit is a sub epitaxial structure emitting light within a first photoluminescent wavelength, the second sub pixel unit is a sub epitaxial structure emitting light within a second photoluminescent wavelength, and the first photoluminescent wavelength is different from the second photoluminescent wavelength. The difference between electroluminescent wavelengths of the first sub pixel unit and the second sub pixel unit is less than or equal to 2 nm.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: September 22, 2020
    Assignee: PLAYNITRIDE INC.
    Inventor: Yu-Hung Lai
  • Patent number: 10763393
    Abstract: A micro light emitting diode chip having a plurality of light-emitting regions, including a semiconductor epitaxial structure, a first electrode and a plurality of second electrodes disposed at interval is provided. The semiconductor epitaxial structure includes a first-type doped semiconductor layer, a plurality of second-type doped semiconductor layers and a plurality of light-emitting layers disposed at interval. The light-emitting layers are located between the first-type doped semiconductor layer and the second-type doped semiconductor layer. The light-emitting layers are located in the light-emitting regions respectively and electrically contact to the first-type doped semiconductor layer. The first electrode is electrically connected and contacts to the first-type doped semiconductor layers. The second electrodes are electrically connected to the second-type doped semiconductor layers. Furthermore, a display panel is also provided.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: September 1, 2020
    Assignee: PlayNitride Inc.
    Inventors: Yu-Hung Lai, Yu-Yun Lo, Tzu-Yang Lin
  • Publication number: 20200273737
    Abstract: A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.
    Type: Application
    Filed: December 19, 2019
    Publication date: August 27, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Pei-Hsin CHEN, Yi-Ching CHEN, Yu-Chu LI, Yi-Chun SHIH, Ying-Tsang LIU, Yu-Hung LAI, Tzu-Yang LIN
  • Publication number: 20200185243
    Abstract: A carrier structure suitable for transferring or supporting a plurality of micro devices includes a carrier and a plurality of transfer units. The carrier has a carrier surface and a plurality of recesses disposed on the carrier surface. The transfer units are respectively disposed in the recesses and a plurality of transferring surfaces are exposed. Each micro device has a device surface. The transferring surface of each transfer unit is configured to be connected to the device surface of the corresponding micro device. A micro device structure including the carrier structure is also provided.
    Type: Application
    Filed: September 25, 2019
    Publication date: June 11, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Ying-Tsang Liu, Yu-Chu Li, Huan-Pu Chang, Tzu-Yang Lin, Yu-Hung Lai
  • Publication number: 20200185360
    Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
    Type: Application
    Filed: November 8, 2019
    Publication date: June 11, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Sheng-Yuan Sun, Ying-Tsang Liu, Yi-Ching Chen, Pei-Hsin Chen, Yi-Chun Shih, Tzu-Yang Lin, Yu-Hung Lai
  • Publication number: 20200176508
    Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, a plurality of micro semiconductor devices disposed on the substrate, and a first supporting layer disposed between the substrate and the micro semiconductor devices. Each of the micro semiconductor devices has a first electrode and a second electrode disposed on a lower surface of the micro semiconductor devices. The lower surface includes a region, wherein the region is between the first electrode and the second electrode. An orthographic projection of the first supporting layer on the substrate at least overlaps an orthographic projection of a portion of the region on the substrate. The first supporting layer directly contacts the region.
    Type: Application
    Filed: June 7, 2019
    Publication date: June 4, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Chih-Ling WU, Ying-Tsang LIU, Pei-Hsin CHEN, Yi-Chun SHIH, Yi-Ching CHEN, Yu-Chu LI, Huan-Pu CHANG, Yu-Yun LO, Yi-Min SU, Tzu-Yang LIN, Yu-Hung LAI
  • Publication number: 20200176509
    Abstract: A micro semiconductor structure is provided. The micro semiconductor structure includes a substrate, at least one supporting layer, and at least one micro semiconductor device. The supporting layer includes at least one upper portion and a bottom portion, wherein the upper portion extends in a first direction. The length L1 of the upper portion in the first direction is greater than the length L2 of the bottom portion in the first direction. Furthermore, the bottom surface of the micro semiconductor device is in direct contact with the upper portion of the supporting layer.
    Type: Application
    Filed: June 10, 2019
    Publication date: June 4, 2020
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Ying-Tsang Liu, Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Yu-Chu Li, Huan-Pu Chang, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10658345
    Abstract: A display panel includes a substrate, a plurality of first light emitting diodes (LEDs), a plurality of second LEDs, a plurality of first common electrodes, and a plurality of second common electrodes. Each pixel unit of the substrate includes a first sub-pixel region and a second sub-pixel region. The first LEDs are disposed on the substrate and located in the first sub-pixel regions, and the second LEDs are disposed on the substrate and located in the second sub-pixel regions. A dominant wavelength of each of the first LEDs is different from that of each of the second LEDs. The first common electrodes are connected to and form an ohmic contact with the first LEDs. The second common electrodes are connected to and form an ohmic contact with the second LEDs. A material of the first common electrodes is different from that of the second common electrodes.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: May 19, 2020
    Assignee: PlayNitride Inc.
    Inventors: Yu-Hung Lai, Chih-Ling Wu
  • Patent number: 10632727
    Abstract: A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate. At least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 28, 2020
    Assignee: PlayNitride Inc.
    Inventors: Yun-Li Li, Tzu-Yang Lin, Yu-Hung Lai, Pei-Hsin Chen
  • Patent number: 10615313
    Abstract: A display device including a backplane, a plurality of light-emitting devices, a first distributed Bragg reflector layer and a second distributed Bragg reflector layer is provided. The light-emitting devices are disposed on the backplane. The first distributed Bragg reflector layer is disposed between the backplane and the light-emitting devices. The light-emitting devices are disposed between the first distributed Bragg reflector layer and the second distributed Bragg reflector layer. A projected area of the first distributed Bragg reflector layer on the backplane is larger than a projected area of one of the light-emitting devices on the backplane or a projected area of the second distributed Bragg reflector layer on the backplane is larger than a projected area of one light-emitting device on the backplane.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: April 7, 2020
    Assignee: PlayNitride Inc.
    Inventors: Yun-Li Li, Yu-Hung Lai, Tzu-Yang Lin
  • Publication number: 20200091370
    Abstract: A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.
    Type: Application
    Filed: August 14, 2019
    Publication date: March 19, 2020
    Applicant: PLAYNITRIDE INC.
    Inventors: Tzu-Yu TING, Yu-Hung LAI, Hsiang-Wen TANG, Yi-Chun SHIH