Abstract: According to an exemplary embodiments, the disclosure is directed to a memory circuit which includes not limited to a first half sense amplifier circuit connected to a first plurality of memory cells through a first bit line and configured to receive a unit of analog electrical signal from each of the first plurality of memory cells and to generate a first half sense amplifier output signal corresponding to the first bit line based on a first gain of the half sense amplifier and an accumulation of the units of analog signals, a locking code register circuit configured to receive a locking data and to generate a digital locking sequence, and a source selector circuit configured to receive the digital locking sequence and to generate a first adjustment signal to adjust the first half sense amplifier output signal corresponding to the first bit line by adjusting the first gain.

Abstract: A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a warpage-control element laterally surrounding the chip-containing structure. The warpage-control element has a protruding portions extending into the substrate.

Abstract: A package structure is provided. The package structure includes a substrate and a chip-containing structure bonded to the substrate. The package structure also includes a warpage-control element attached to the substrate. The warpage-control element has a protruding portion extending into the substrate.

Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.

Abstract: An antenna module includes a substrate and an antenna structure. The antenna structure is disposed on the substrate and includes a radiating portion, a feeding portion, a ground plane, and an impedance adjustment portion. The feeding portion is coupled to the radiating portion and the ground plane. The impedance adjustment portion has a connection end portion and a ground end portion opposite to each other. The connection end portion is connected to the radiating portion. The impedance adjustment portion is bent relative to the radiating portion to extend from the connection end portion toward the feeding portion along an extending direction. The ground end portion is connected to the ground plane and near the feeding portion. In addition, an electronic device including the antenna module is also provided.

Abstract: Mass transfer equipment including a base stage, a first substrate stage, a second substrate stage, at least one laser head and a servo motor module is provided. The first substrate stage is adapted to drive a target substrate to move along a first direction. The second substrate stage is adapted to drive at least one micro device substrate to move along a second direction. The at least one laser head is adapted to move to a target position of the second substrate stage and emits a laser beam toward the at least one micro device substrate. At least one micro device is separated from a substrate of the at least one micro device substrate and connected with the target substrate after the irradiation of the laser beam. The servo motor module is used for driving the first substrate stage, the second substrate stage and the at least one laser head to move.

Abstract: Methods and systems for powering components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the type of power being supplied to the power supplies. The power supplies may modify their operation based on the type of input power being supplied to them so that conditioned power may be provided even when changes to the power supplied to the power supplies occur.

Abstract: A micro LED display device includes a display substrate. The display substrate has a first transfer area and a second transfer area adjacent to each other. Both the first transfer area and the second transfer area include a plurality of pixel areas. The pixel area of the first transfer area includes a first micro light-emitting element arranged in a straight line along a first direction. The pixel area of the second transfer area includes a second micro light-emitting element arranged in another straight line along the first direction. In the first direction, the first micro light-emitting element and the second micro light-emitting element are arranged in a staggered manner. A manufacturing method of a micro LED display device is also provided.

Abstract: A micro LED display device includes a substrate, micro LED units and a transparent insulation layer. The substrate includes conductive pads and conductive connecting portions. The conductive pads are disposed on the substrate. Each of the micro LED units includes a semiconductor epitaxial structure and electrodes. The electrodes are disposed on the semiconductor epitaxial structure, and each of the electrodes is connected to one of the conductive connecting portions adjacent to each other. The transparent insulation layer is disposed on the substrate and covers the conductive pads, the conductive connecting portions and the micro LED units, and the transparent insulation layer is filled between the electrodes of each of the micro LED units. The transparent insulation layer relative to a surface on each of the semiconductor epitaxial structures is of a first thickness and a second thickness, and the first thickness is different from the second thickness.

Abstract: Methods and systems for thermal management of components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the thermal environment and/or thermal states of components of the power supply.

Abstract: A micro LED display device includes a display substrate. The display substrate has a first transfer area and a second transfer area adjacent to each other. Both the first transfer area and the second transfer area include a plurality of pixel areas. The pixel area of the first transfer area includes a first micro light-emitting element arranged in a straight line along a first direction. The pixel area of the second transfer area includes a second micro light-emitting element arranged in another straight line along the first direction. In the first direction, the first micro light-emitting element and the second micro light-emitting element are arranged in a staggered manner. A manufacturing method of a micro LED display device is also provided.

Abstract: Methods and systems for powering components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the type of power being supplied to the power supplies. The power supplies may modify their operation based on the type of input power being supplied to them so that conditioned power may be provided even when changes to the power supplied to the power supplies occur.

Abstract: A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.

Abstract: A transfer substrate is configured to transfer a plurality of micro components from a first substrate to a second substrate. The transfer substrate comprises a base and a plurality of transfer heads. The base includes an upper surface. The plurality of transfer heads is disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof. A plurality of adhesion lumps is separated from each other, wherein each adhesion lump is disposed on the second surface of one of the transfer heads. A CTE of the base is different from CTEs of the transfer heads.

Abstract: Methods and systems for thermal management of components of a data processing system that may be used to provide computer implemented services are disclosed. The disclosed thermal management method and systems may improve the likelihood of data processing systems providing desired computer implemented services by improving the likelihood that desired power is provided by power supplies. To improve the likelihood of power supplies providing desired power, the power supplies may proactively take into account the thermal environment and/or thermal states of components of the power supply.

Abstract: A micro LED display includes a display substrate, a first soldering layer, at least one second soldering layer, first micro LEDs and at least one second micro LED. The display substrate includes a substrate having a plurality of pixel areas, a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are arranged in each pixel area. The first soldering layer is disposed on the first circuit layer, and the second soldering layer is disposed on the second micro LED. An arranging area of the first soldering layer is greater than an arranging area of the second soldering layer. The first micro LEDs is bonding to the first circuit layer in each pixel area through the first soldering layer. The second micro LED is bonding to the second circuit layer of one of the pixel areas through the second soldering layer.

Abstract: A method of manufacturing display device is disclosed. A substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

Abstract: The micro-LED display device provided includes a substrate having a first circuit layer and a second circuit layer; a first pad on the first circuit layer and a second pad on the second circuit layer; a plurality of micro-LEDs, wherein each of the micro-LEDs includes a first electrode connected to the first pad and a second electrode connected to the second pad; a first bonding support layer disposed between the first and second pad and in direct contact with the substrate and the micro-LED; and a plurality of second bonding support layers, wherein each of the second bonding support layers includes a lower portion and a upper portion over the lower portion, wherein both portion are disposed between and in lateral contact with adjacent two of the micro-LEDs, and an optical density of the lower portion is greater than that of the upper portion under the same thickness.

Abstract: A method for manufacturing a micro light emitting diode device is provided. A plurality of first type epitaxial structures are formed on a first substrate and the first type epitaxial structures are separated from each other. A first connection layer and a first adhesive layer are configured between the first type epitaxial structures and the first substrate. The first connection layer is connected to the first type epitaxial structures. The first adhesive layer is located between the first connection layer and the first type epitaxial substrate. The Young's modulus of the first connection layer is larger than the Young's modulus of the first adhesive layer. The first connection layer located between any two adjacent first type epitaxial structures is removed so as to form a plurality of first connection portions separated from each other. Each of the first connection portions is connected to the corresponding first type epitaxial structure.

Abstract: A micro device mass transfer equipment including a base stage, a moving stage, a substrate stage, a laser device, a rolling and pressing mechanism, and a heating mechanism is provided. The moving stage is movably disposed on the base stage, and moves with a moving path. The substrate stage is movably disposed on the base stage, and is adapted to move between different positions overlapping the moving stage. The laser device is movably disposed on the base stage. The laser device is adapted to move relative to the substrate stage, and emits a laser beam toward the substrate stage. The rolling and pressing mechanism is disposed on the moving path of the moving stage, and forms a contact region with the moving stage. The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism.