Abstract: A system for detecting leakage of a liquid supply pipe includes a pipe casing for enclosing an end portion of the liquid supply pipe adjoined to a nozzle and a sensor system configured to detect presence of a liquid leaked from the liquid supply pipe at the end portion. The sensor system is in alignment with the end portion of the liquid supply pipe.

Abstract: The present disclosure describes a container for placing an object therein. The container includes a container body and a lid over the container body, a collision-preventing portion attached to one or more of the container body and the lid and configured to buffer an impact force, a pairing recognition mechanism configured to detect an object placed in the container body, and a liquid-detecting sensor configured to detect a leakage from the object.

Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.

Abstract: A semiconductor device is disclosed. The device includes a source/drain feature formed over a substrate. A dielectric layer formed over the source/drain feature. A contact trench formed through the dielectric layer to expose the source/drain feature. A titanium nitride (TiN) layer deposited in the contact trench and a cobalt layer deposited over the TiN layer in the contact trench.

Abstract: A power supply circuit includes a power converter circuit, a path switch and a protocol control circuit. The protocol control circuit controls the power converter circuit and the path switch. The protocol control circuit includes: a shared pin and a signal determination circuit. The shared pin is coupled to the bus node via the temperature sensitive device and transmits different signals having different functions under at least two different modes. The signal determination circuit senses a voltage at the bus node via the shared pin under a power start-up mode, to determine whether to control the path switch to conduct the power path, thereby determining whether to enter a power supply mode. The signal determination circuit receives a temperature signal generated by the temperature sensitive device via the shared pin under the power supply mode, to determine an ambient temperature where the temperature sensitive is located.

Abstract: A power supply circuit includes a power converter circuit, a path switch and a protocol control circuit. The protocol control circuit controls the power converter circuit and the path switch. The protocol control circuit includes: a shared pin and a signal determination circuit. The shared pin is coupled to the bus node via the temperature sensitive device and transmits different signals having different functions under at least two different modes. The signal determination circuit senses a voltage at the bus node via the shared pin under a power start-up mode, to determine whether to control the path switch to conduct the power path, thereby determining whether to enter a power supply mode. The signal determination circuit receives a temperature signal generated by the temperature sensitive device via the shared pin under the power supply mode, to determine an ambient temperature where the temperature sensitive is located.

Abstract: A dust protector of a fiber optic connector according to the present disclosure includes a dust cap and a cleaning component. The dust cap includes a frame and a cover. The frame is configured to cover the front end of a fiber optic connector. The cover is pivotally coupled to the frame. The cleaning component is disposed on the frame to clean the fiber optic connector. The cover is configured to be closed to cover the cleaning component and to be flipped open to expose the cleaning component. The present disclosure further provides another dust protector of a fiber optic connector. In addition to being used to protect the fiber optic connector from contamination, the dust protector of the present disclosure provides additional value that avoids the need to use a separate component to clean a fiber end of a fiber optic connector.

Abstract: A dust protector of a fiber optic connector according to the present disclosure includes a dust cap and a cleaning component. The dust cap includes a frame and a cover. The frame is configured to cover the front end of a fiber optic connector. The cover is pivotally coupled to the frame. The cleaning component is disposed on the frame to clean the fiber optic connector. The cover is configured to be closed to cover the cleaning component and to be flipped open to expose the cleaning component. The present disclosure further provides another dust protector of a fiber optic connector. In addition to being used to protect the fiber optic connector from contamination, the dust protector of the present disclosure provides additional value that avoids the need to use a separate component to clean a fiber end of a fiber optic connector.

Abstract: A semiconductor device is disclosed. The device includes a source/drain feature formed over a substrate. A dielectric layer formed over the source/drain feature. A contact trench formed through the dielectric layer to expose the source/drain feature. A titanium nitride (TiN) layer deposited in the contact trench and a cobalt layer deposited over the TiN layer in the contact trench.

Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.

Abstract: The present invention provides a power converter, a secondary side controller, and a short circuit determination method for a current sensing resistor of the power converter. The power converter is controlled by a power switch to convert an input voltage to an output voltage, and provide an output current to an output terminal. The power converter senses the output current by a current sensing resistor to generate first information which relates to the output current. The power converter generates second information according to an ON time, an OFF time or a switching period of the power switch, or according to an energy-releasing period for transmitting energy to the output terminal, wherein the second information indicates whether there is a substantial amount of energy transmitted to the output terminal. By checking whether the first information and the second information are contradictory to each other, a malfunction can be found.

Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.

Abstract: An optical fiber adapter according to the present disclosure includes a main body, a first shutter member, a second shutter member, an inner housing, a first elastic member and a second elastic member. The first elastic member includes a first base portion, a first driving portion and a first connecting portion. The first connecting portion connects the first base portion with the first driving portion. The second shutter member includes a second base portion, a second driving portion and a second connecting portion. The second connecting portion connects the second base portion with the second driving portion. The inner housing is positioned within the main body through the first opening. The first shutter member is attached to and is driven to move by the first driving portion. The second shutter member is attached to and is driven to move by the second driving portion.

Abstract: An optical fiber adapter according to the present disclosure includes a main body, a first shutter member, a second shutter member, an inner housing, a first elastic member and a second elastic member. The first elastic member includes a first base portion, a first driving portion and a first connecting portion. The first connecting portion connects the first base portion with the first driving portion. The second shutter member includes a second base portion, a second driving portion and a second connecting portion. The second connecting portion connects the second base portion with the second driving portion. The inner housing is positioned within the main body through the first opening. The first shutter member is attached to and is driven to move by the first driving portion. The second shutter member is attached to and is driven to move by the second driving portion.

Abstract: The present invention provides a power converter, a secondary side controller, and a short circuit determination method for a current sensing resistor of the power converter. The power converter is controlled by a power switch to convert an input voltage to an output voltage, and provide an output current to an output terminal. The power converter senses the output current by a current sensing resistor to generate first information which relates to the output current. The power converter generates second information according to an ON time, an OFF time or a switching period of the power switch, or according to an energy-releasing period for transmitting energy to the output terminal, wherein the second information indicates whether there is a substantial amount of energy transmitted to the output terminal. By checking whether the first information and the second information are contradictory to each other, a malfunction can be found.

Abstract: A semiconductor device is disclosed. The device includes a source/drain feature formed over a substrate. A dielectric layer formed over the source/drain feature. A contact trench formed through the dielectric layer to expose the source/drain feature. A titanium nitride (TiN) layer deposited in the contact trench and a cobalt layer deposited over the TiN layer in the contact trench.

Abstract: The present invention discloses a power converter with synchronous control function and control method thereof. The power converter includes: a transformer, a power switch, a switch control unit, a signal coupling circuit, a synchronous rectifying switch and a secondary side control circuit. The switch control unit generates an operation signal according to a feedback signal, and generates a first synchronous signal which is related to the operation signal. The signal coupling circuit couples the first synchronous signal to generate a second synchronous signal. The synchronous rectifying switch is turned ON/OFF according to a synchronous rectifying switch signal, for synchronous rectification. The secondary side control circuit generates the synchronous rectifying switch signal according to a secondary side level detection signal and the second synchronous signal, to control the synchronous rectifying switch. The ON time of the power switch and the ON time of the synchronous rectifying switch do not overlap.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming a source/drain feature over a substrate, forming a dielectric layer over the source/drain feature, forming a contact trench through the dielectric layer to expose the source/drain feature, depositing a titanium nitride (TiN) layer by a first atomic layer deposition (ALD) process in the contact trench and depositing a cobalt layer over the TiN layer in the contact trench.

Abstract: An optical fiber adapter according to the present disclosure includes a main body, an inner housing, a movable member, an elastic shutter member, a spring and a cover plate. The main body has an axial accommodation room and an access opening is provided on a first wall of the main body. The inner housing is placed within the accommodation room and includes a hollow cylinder extending from the front surface of a flange. The movable member is positioned within the accommodation room and is configured to be moved toward a second opening of the accommodation room. The shutter member is positioned within the accommodation room and includes a fixed portion, a shutter plate and a connecting portion. The fixed portion is fixed at the movable member and is moved with the movable member. The connecting portion connects the fixed portion with the shutter plate. The shutter plate extends from the connecting portion and arrives in front of an opening of the hollow cylinder.

Abstract: The present invention discloses a flyback converter, a primary side control circuit therein, and a control method thereof. The flyback converter includes: a transformer circuit, a power switch circuit, a primary side control circuit, a synchronous rectification (SR) switch, and a synchronous rectification (SR) control circuit. When a feedback signal indicates that a difference between a target output voltage and an actual output voltage increases, the primary side control circuit increases an operation frequency of an operation signal by step-wisely reducing a cycle period of the operation signal in response to the increase of the difference, wherein the cycle period of the operation signal is reduced by a predetermined unit of time in each step, such that the cycle period of the operation signal is a step function of the increase of the difference.